HK1256747A1 - 鍍敷處理方法、鍍敷處理裝置、及感測器裝置 - Google Patents

鍍敷處理方法、鍍敷處理裝置、及感測器裝置

Info

Publication number
HK1256747A1
HK1256747A1 HK18115826.8A HK18115826A HK1256747A1 HK 1256747 A1 HK1256747 A1 HK 1256747A1 HK 18115826 A HK18115826 A HK 18115826A HK 1256747 A1 HK1256747 A1 HK 1256747A1
Authority
HK
Hong Kong
Prior art keywords
plating
sensor device
plating method
sensor
plating device
Prior art date
Application number
HK18115826.8A
Other languages
English (en)
Inventor
奈良圭
杉崎敬
堀正和
Original Assignee
株式會社 尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社 尼康 filed Critical 株式會社 尼康
Publication of HK1256747A1 publication Critical patent/HK1256747A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/307—Disposable laminated or multilayered electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C25D7/0678—Selective plating using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/302—Electrodes, e.g. test electrodes; Half-cells pH sensitive, e.g. quinhydron, antimony or hydrogen electrodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
HK18115826.8A 2016-03-30 2018-12-10 鍍敷處理方法、鍍敷處理裝置、及感測器裝置 HK1256747A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016067108 2016-03-30
PCT/JP2017/012580 WO2017170510A1 (ja) 2016-03-30 2017-03-28 メッキ処理方法、メッキ処理装置、および、センサー装置

Publications (1)

Publication Number Publication Date
HK1256747A1 true HK1256747A1 (zh) 2019-10-04

Family

ID=59965769

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18115826.8A HK1256747A1 (zh) 2016-03-30 2018-12-10 鍍敷處理方法、鍍敷處理裝置、及感測器裝置

Country Status (6)

Country Link
JP (1) JP6939773B2 (zh)
KR (2) KR102372799B1 (zh)
CN (2) CN111060570B (zh)
HK (1) HK1256747A1 (zh)
TW (1) TWI732840B (zh)
WO (1) WO2017170510A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6399973B2 (ja) * 2015-06-18 2018-10-03 株式会社荏原製作所 めっき装置の調整方法及び測定装置
CN208766227U (zh) * 2016-12-12 2019-04-19 株式会社村田制作所 Ec传感器以及使用了该ec传感器的农场管理系统
KR102031294B1 (ko) * 2018-01-08 2019-11-08 한국기초과학지원연구원 액체 플라즈마 연속 코팅장치 및 방법
CN113630963A (zh) * 2021-07-08 2021-11-09 广州美维电子有限公司 改善超薄板板变形的方法
FI20235319A1 (en) * 2023-03-20 2024-09-21 Teknologian Tutkimuskeskus Vtt Oy Apparatus for the simultaneous electrochemical processing of a number of electrodes

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968428A (en) * 1974-09-30 1976-07-06 Minoru Numoto Portable soil moisture tester
JP3483702B2 (ja) * 1996-05-28 2004-01-06 イビデン株式会社 長尺基材のめっき方法及びめっき装置
US6165830A (en) * 1998-11-02 2000-12-26 Vanguard International Semiconductor Corporation Method to decrease capacitance depletion, for a DRAM capacitor, via selective deposition of a doped polysilicon layer on a selectively formed hemispherical grain silicon layer
TWI223064B (en) * 1999-11-15 2004-11-01 Matsushita Electric Ind Co Ltd Biological sensor, formation method of thin film electrode, quantity determination device and quantity determination method
JP4310886B2 (ja) * 2000-05-12 2009-08-12 住友金属鉱山株式会社 絶縁体付き薄板条材の連続メッキ用導通ローラ
JP2009273773A (ja) * 2008-05-16 2009-11-26 Nitto Denko Corp 体液採取用回路基板、その製造方法、その使用方法、および、その体液採取用回路基板を備えるバイオセンサ
US8852734B2 (en) * 2009-10-14 2014-10-07 Sumitomo Bakelite Company, Ltd. Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
JP2011242354A (ja) * 2010-05-21 2011-12-01 Shinshu Univ 水蒸気バリア性能の評価方法
US9335287B2 (en) * 2010-06-17 2016-05-10 National University Corporation Toyohashi University Of Technology Specification device for water status of soil, and method for same
US8365679B2 (en) * 2010-08-20 2013-02-05 Deere & Company Seed spacing monitoring system for use in an agricultural seeder
CN102954816B (zh) * 2012-01-13 2015-03-11 北京安赛博技术有限公司 作物长势的监测方法
US9629304B2 (en) * 2013-04-08 2017-04-25 Ag Leader Technology On-the go soil sensors and control methods for agricultural machines
US8849523B1 (en) * 2013-05-20 2014-09-30 Elwha Llc Systems and methods for detecting soil characteristics
CN103674978B (zh) * 2013-12-10 2016-01-20 北京市农林科学院 一种微型时域反射土壤水分传感器
CN105052302A (zh) * 2015-07-28 2015-11-18 范燕波 一种可显示温度、湿度曲线的种子培育箱

Also Published As

Publication number Publication date
TW201739328A (zh) 2017-11-01
KR20210154880A (ko) 2021-12-21
CN111060570B (zh) 2022-06-07
CN108884583B (zh) 2020-08-04
CN108884583A (zh) 2018-11-23
CN111060570A (zh) 2020-04-24
WO2017170510A1 (ja) 2017-10-05
KR102372799B1 (ko) 2022-03-10
TWI732840B (zh) 2021-07-11
JP6939773B2 (ja) 2021-09-22
KR102373920B1 (ko) 2022-03-14
JPWO2017170510A1 (ja) 2019-02-07
KR20180128911A (ko) 2018-12-04

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