HK123797A - Printed circuit board with built-in testing of connections to ICS - Google Patents
Printed circuit board with built-in testing of connections to ICSInfo
- Publication number
- HK123797A HK123797A HK123797A HK123797A HK123797A HK 123797 A HK123797 A HK 123797A HK 123797 A HK123797 A HK 123797A HK 123797 A HK123797 A HK 123797A HK 123797 A HK123797 A HK 123797A
- Authority
- HK
- Hong Kong
- Prior art keywords
- connections
- ics
- testing
- built
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95103881A EP0733910B1 (de) | 1995-03-16 | 1995-03-16 | Platine mit eingebauter Kontaktfühlerprüfung für integrierte Schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
HK123797A true HK123797A (en) | 1997-09-12 |
Family
ID=8219075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK123797A HK123797A (en) | 1995-03-16 | 1997-06-26 | Printed circuit board with built-in testing of connections to ICS |
Country Status (8)
Country | Link |
---|---|
US (1) | US5815001A (ko) |
EP (1) | EP0733910B1 (ko) |
JP (1) | JP3902808B2 (ko) |
KR (1) | KR100279198B1 (ko) |
AT (1) | ATE146282T1 (ko) |
DE (1) | DE59500064D1 (ko) |
HK (1) | HK123797A (ko) |
TW (1) | TW288187B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE512916C2 (sv) | 1998-07-16 | 2000-06-05 | Ericsson Telefon Ab L M | Metod och anordning för feldetektering i digitalt system |
JP4036554B2 (ja) * | 1999-01-13 | 2008-01-23 | 富士通株式会社 | 半導体装置およびその試験方法、および半導体集積回路 |
US6498507B1 (en) * | 2000-04-20 | 2002-12-24 | Analog Devices, Inc. | Circuit for testing an integrated circuit |
DE10114291C1 (de) | 2001-03-23 | 2002-09-05 | Infineon Technologies Ag | Verfahren zum Überprüfen von lösbaren Kontakten an einer Mehrzahl von integrierten Halbleiterbausteinen auf einem Wafer |
TW594025B (en) * | 2002-12-31 | 2004-06-21 | Via Tech Inc | Method and device for determining signal transmission quality of circuit board |
DE102004014242B4 (de) | 2004-03-24 | 2014-05-28 | Qimonda Ag | Integrierter Baustein mit mehreren voneinander getrennten Substraten |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3867693A (en) * | 1974-02-20 | 1975-02-18 | Ibm | LSI chip test probe contact integrity checking circuit |
US4220917A (en) * | 1978-07-31 | 1980-09-02 | International Business Machines Corporation | Test circuitry for module interconnection network |
US4441075A (en) * | 1981-07-02 | 1984-04-03 | International Business Machines Corporation | Circuit arrangement which permits the testing of each individual chip and interchip connection in a high density packaging structure having a plurality of interconnected chips, without any physical disconnection |
US4504784A (en) * | 1981-07-02 | 1985-03-12 | International Business Machines Corporation | Method of electrically testing a packaging structure having N interconnected integrated circuit chips |
US4509008A (en) * | 1982-04-20 | 1985-04-02 | International Business Machines Corporation | Method of concurrently testing each of a plurality of interconnected integrated circuit chips |
US4894605A (en) * | 1988-02-24 | 1990-01-16 | Digital Equipment Corporation | Method and on-chip apparatus for continuity testing |
US4963824A (en) * | 1988-11-04 | 1990-10-16 | International Business Machines Corporation | Diagnostics of a board containing a plurality of hybrid electronic components |
-
1995
- 1995-03-16 DE DE59500064T patent/DE59500064D1/de not_active Expired - Fee Related
- 1995-03-16 AT AT95103881T patent/ATE146282T1/de not_active IP Right Cessation
- 1995-03-16 EP EP95103881A patent/EP0733910B1/de not_active Expired - Lifetime
-
1996
- 1996-02-26 TW TW085102171A patent/TW288187B/zh active
- 1996-03-13 JP JP08304896A patent/JP3902808B2/ja not_active Expired - Fee Related
- 1996-03-15 KR KR1019960007024A patent/KR100279198B1/ko not_active IP Right Cessation
- 1996-03-18 US US08/617,125 patent/US5815001A/en not_active Expired - Lifetime
-
1997
- 1997-06-26 HK HK123797A patent/HK123797A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW288187B (ko) | 1996-10-11 |
KR100279198B1 (ko) | 2001-01-15 |
KR960035947A (ko) | 1996-10-28 |
ATE146282T1 (de) | 1996-12-15 |
EP0733910A1 (de) | 1996-09-25 |
US5815001A (en) | 1998-09-29 |
JPH08264917A (ja) | 1996-10-11 |
DE59500064D1 (de) | 1997-01-23 |
EP0733910B1 (de) | 1996-12-11 |
JP3902808B2 (ja) | 2007-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |