HK1206143A1 - 氣密密封用蓋、電子部件收納用封裝以及氣密密封用蓋的製造方法 - Google Patents

氣密密封用蓋、電子部件收納用封裝以及氣密密封用蓋的製造方法

Info

Publication number
HK1206143A1
HK1206143A1 HK15106479.0A HK15106479A HK1206143A1 HK 1206143 A1 HK1206143 A1 HK 1206143A1 HK 15106479 A HK15106479 A HK 15106479A HK 1206143 A1 HK1206143 A1 HK 1206143A1
Authority
HK
Hong Kong
Prior art keywords
sealing cap
hermetic sealing
electronic component
component housing
housing package
Prior art date
Application number
HK15106479.0A
Other languages
English (en)
Inventor
長友和也
淺田賢
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Publication of HK1206143A1 publication Critical patent/HK1206143A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
HK15106479.0A 2013-10-03 2015-07-07 氣密密封用蓋、電子部件收納用封裝以及氣密密封用蓋的製造方法 HK1206143A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013208397A JP6314406B2 (ja) 2013-10-03 2013-10-03 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法

Publications (1)

Publication Number Publication Date
HK1206143A1 true HK1206143A1 (zh) 2015-12-31

Family

ID=52776764

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15106479.0A HK1206143A1 (zh) 2013-10-03 2015-07-07 氣密密封用蓋、電子部件收納用封裝以及氣密密封用蓋的製造方法

Country Status (6)

Country Link
US (1) US10183360B2 (zh)
JP (1) JP6314406B2 (zh)
KR (1) KR101596161B1 (zh)
CN (1) CN104517908B (zh)
HK (1) HK1206143A1 (zh)
TW (1) TWI540690B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015046209A1 (ja) * 2013-09-27 2015-04-02 京セラ株式会社 蓋体、パッケージおよび電子装置
JP6499886B2 (ja) * 2015-03-11 2019-04-10 田中貴金属工業株式会社 電子部品封止用キャップ
JP2017011249A (ja) * 2015-06-17 2017-01-12 株式会社ソーデナガノ 電子部品用パッケージの金属カバー
JP7004191B2 (ja) * 2015-07-15 2022-01-21 日立金属株式会社 気密封止用キャップおよび電子部品収納パッケージ
JP2017054937A (ja) * 2015-09-10 2017-03-16 日立金属株式会社 気密封止用金属シートの製造方法と気密封止用キャップの製造方法
JP6774626B2 (ja) * 2016-10-31 2020-10-28 日立金属株式会社 気密封止用リッドの製造方法
JP7022297B2 (ja) * 2017-01-06 2022-02-18 日立金属株式会社 気密封止用キャップおよび電子部品収納パッケージ
JP7082309B2 (ja) * 2017-03-24 2022-06-08 日本電気硝子株式会社 カバーガラス及び気密パッケージ
JP2020053554A (ja) * 2018-09-27 2020-04-02 日立金属株式会社 気密封止用キャップおよびその製造方法
CN114864785A (zh) * 2018-10-15 2022-08-05 三菱综合材料株式会社 封装用盖部件及封装体的制造方法
JP6784317B2 (ja) 2018-10-15 2020-11-11 三菱マテリアル株式会社 パッケージ用蓋材及びパッケージの製造方法
US11025033B2 (en) * 2019-05-21 2021-06-01 Taiwan Semiconductor Manufacturing Co., Ltd. Bump bonding structure to mitigate space contamination for III-V dies and CMOS dies
JP7166997B2 (ja) * 2019-08-27 2022-11-08 京セラ株式会社 電子部品パッケージおよび電子装置
EP4040475A4 (en) * 2019-09-30 2023-11-08 Kyocera Corporation COVER BODY, ELECTRONIC COMPONENT HOUSING AND ELECTRONIC DEVICE
JP7388943B2 (ja) * 2020-02-17 2023-11-29 日本電波工業株式会社 圧電デバイス
JP7455003B2 (ja) 2020-06-09 2024-03-25 スタンレー電気株式会社 半導体発光装置、および、水殺菌装置
CN114696777A (zh) * 2020-12-25 2022-07-01 Ngk电子器件株式会社 封装体及其制造方法
CN114918538A (zh) * 2022-05-27 2022-08-19 无锡中微高科电子有限公司 一种用于高可靠集成电路气密性封装的激光封焊方法

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JPH01165649U (zh) * 1988-05-12 1989-11-20
JPH0311653A (ja) 1989-06-07 1991-01-18 Nec Yamagata Ltd 半導体装置
JPH0496256A (ja) * 1990-08-03 1992-03-27 Mitsubishi Materials Corp 金属製ハーメチックシール蓋
JP3432988B2 (ja) * 1996-01-18 2003-08-04 日本特殊陶業株式会社 電子部品パッケージ用金属製リッド基板、及び金属製リッドの製造方法
WO2004070836A1 (ja) * 2003-02-06 2004-08-19 Neomax Co., Ltd. 気密封止用キャップおよびその製造方法
JP2005167969A (ja) * 2003-11-14 2005-06-23 Fujitsu Media Device Kk 弾性波素子および弾性波素子の製造方法
US7504663B2 (en) * 2004-05-28 2009-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with a floating gate electrode that includes a plurality of particles
KR101133339B1 (ko) * 2004-11-05 2012-04-06 가부시키가이샤 네오맥스 마테리아르 기밀 밀봉용 캡, 기밀 밀봉용 캡의 제조 방법 및 전자 부품수납용 패키지
CN101107705A (zh) 2005-01-21 2008-01-16 西铁城控股株式会社 密封板以及其制造方法
US7842891B2 (en) 2005-01-21 2010-11-30 Citizen Holdings Co. Ltd. Sealing board and method for producing the same
JP4630338B2 (ja) * 2006-02-15 2011-02-09 株式会社Ｎｅｏｍａｘマテリアル 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法
JP2009200093A (ja) * 2008-02-19 2009-09-03 Murata Mfg Co Ltd 中空型の電子部品

Also Published As

Publication number Publication date
JP6314406B2 (ja) 2018-04-25
KR101596161B1 (ko) 2016-02-19
US10183360B2 (en) 2019-01-22
TWI540690B (zh) 2016-07-01
KR20150039676A (ko) 2015-04-13
JP2015073027A (ja) 2015-04-16
TW201521157A (zh) 2015-06-01
US20150098171A1 (en) 2015-04-09
CN104517908A (zh) 2015-04-15
CN104517908B (zh) 2018-09-21

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