HK1199351A1 - 冷卻發熱電子器件 - Google Patents

冷卻發熱電子器件

Info

Publication number
HK1199351A1
HK1199351A1 HK14112748.4A HK14112748A HK1199351A1 HK 1199351 A1 HK1199351 A1 HK 1199351A1 HK 14112748 A HK14112748 A HK 14112748A HK 1199351 A1 HK1199351 A1 HK 1199351A1
Authority
HK
Hong Kong
Prior art keywords
cooling heat
generating electronics
electronics
generating
cooling
Prior art date
Application number
HK14112748.4A
Other languages
English (en)
Inventor
Michael Lau
Richard C Bruns
Melanie Beauchemin
Original Assignee
Google Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Inc filed Critical Google Inc
Publication of HK1199351A1 publication Critical patent/HK1199351A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
HK14112748.4A 2010-12-01 2014-12-19 冷卻發熱電子器件 HK1199351A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/957,855 US8644020B2 (en) 2010-12-01 2010-12-01 Cooling heat-generating electronics

Publications (1)

Publication Number Publication Date
HK1199351A1 true HK1199351A1 (zh) 2015-06-26

Family

ID=45390185

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14112748.4A HK1199351A1 (zh) 2010-12-01 2014-12-19 冷卻發熱電子器件

Country Status (7)

Country Link
US (2) US8644020B2 (zh)
EP (2) EP2750493B1 (zh)
CN (1) CN103329641B (zh)
HK (1) HK1199351A1 (zh)
SG (1) SG190896A1 (zh)
TW (1) TWI559844B (zh)
WO (1) WO2012075300A1 (zh)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8850816B2 (en) * 2010-05-11 2014-10-07 Dell Products L.P. Power regeneration for an information handling system
US8644020B2 (en) * 2010-12-01 2014-02-04 Google Inc. Cooling heat-generating electronics
GB2506764B (en) * 2011-06-27 2015-09-23 Hewlett Packard Development Co Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component
AU2012232967B2 (en) 2011-10-31 2015-01-15 Abb Technology Ag Cabinet with modules having a thermosiphon cooler arrangement
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
US8617927B1 (en) 2011-11-29 2013-12-31 Hrl Laboratories, Llc Method of mounting electronic chips
US9348378B2 (en) * 2012-04-19 2016-05-24 Hitachi, Ltd. Computer provided with cooling system
WO2013169774A2 (en) 2012-05-07 2013-11-14 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
FR2995172B1 (fr) * 2012-09-06 2015-11-20 Sagemcom Broadband Sas Equipement electronique a refroidissement par air et dispositif de refroidissement d'un composant electronique
EP2901242A4 (en) 2012-09-28 2016-05-25 Hewlett Packard Development Co PLENUMS FOR REMOVABLE MOBILE
US9606588B2 (en) 2012-11-08 2017-03-28 Silicon Graphics International Corp. Closed-loop cooling system for high-density clustered computer system
US20140188283A1 (en) * 2012-12-28 2014-07-03 Prosenjit Ghosh Adjusting performance range of computing device
CN103237412B (zh) * 2013-03-27 2016-03-23 苏州远创达科技有限公司 一种电子件安装结构及制作方法、电子件产品
US10079160B1 (en) 2013-06-21 2018-09-18 Hrl Laboratories, Llc Surface mount package for semiconductor devices with embedded heat spreaders
CN104613556A (zh) * 2013-11-04 2015-05-13 珠海格力电器股份有限公司 电器元件的散热装置及具有其的空调器
US9405335B1 (en) * 2014-02-21 2016-08-02 Google Inc. Heat pipe cooling arrangement
USD748638S1 (en) 2014-07-10 2016-02-02 Bae Systems Information And Electronic Systems Integration Inc. Front panel with openings for air cooling a data storage transfer archive repository
USD748093S1 (en) 2014-07-10 2016-01-26 Bae Systems Information And Electronic Systems Integration Inc. Data storage transfer archive repository
USD748627S1 (en) 2014-07-10 2016-02-02 Bae Systems Information And Electronic Systems Integration Inc. Front panel with openings for air cooling a data storage transfer archive repository
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9398731B1 (en) 2014-09-23 2016-07-19 Google Inc. Cooling electronic devices in a data center
US9337124B1 (en) * 2014-11-04 2016-05-10 Hrl Laboratories, Llc Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers
US10606324B2 (en) 2015-01-16 2020-03-31 Hewlett Packard Enterprise Development Lp Plenum to deliver cool air and route multiple cables
WO2016171654A1 (en) * 2015-04-20 2016-10-27 Hewlett Packard Enterprise Development Lp Supplemental air cooling
US10448543B2 (en) 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US9385083B1 (en) 2015-05-22 2016-07-05 Hrl Laboratories, Llc Wafer-level die to package and die to die interconnects suspended over integrated heat sinks
US10462935B2 (en) 2015-06-23 2019-10-29 Google Llc Cooling electronic devices in a data center
US10265812B2 (en) 2015-08-12 2019-04-23 International Business Machines Corporation Liquid-cooled, composite heat sink assemblies
US10026672B1 (en) 2015-10-21 2018-07-17 Hrl Laboratories, Llc Recursive metal embedded chip assembly
US9508652B1 (en) 2015-11-24 2016-11-29 Hrl Laboratories, Llc Direct IC-to-package wafer level packaging with integrated thermal heat spreaders
US10349561B2 (en) 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
CN106304797B (zh) * 2016-09-29 2019-03-08 努比亚技术有限公司 一种移动终端
CN106455428B (zh) * 2016-09-29 2018-12-21 努比亚技术有限公司 一种移动终端
CN106455427B (zh) * 2016-09-29 2019-03-05 努比亚技术有限公司 一种移动终端
CN106413345B (zh) * 2016-09-29 2019-01-15 努比亚技术有限公司 一种导热部件的密封方法
CN106455429B (zh) * 2016-09-29 2019-01-15 努比亚技术有限公司 一种导热部件的密封方法
CN106455426B (zh) * 2016-09-29 2019-06-07 努比亚技术有限公司 一种导热部件的密封方法
US10415474B2 (en) 2017-01-31 2019-09-17 General Electric Company Method and system for phase change material component cooling
CN107979955B (zh) * 2017-11-24 2020-06-30 北京百度网讯科技有限公司 一种模块化液冷服务器机箱
CN108495516B (zh) * 2018-04-26 2023-12-19 湖北三江航天万峰科技发展有限公司 一种基于流体介质散热的板卡组件及安装板卡组件的设备
US11051431B2 (en) * 2018-06-29 2021-06-29 Juniper Networks, Inc. Thermal management with variable conductance heat pipe
US10950562B1 (en) 2018-11-30 2021-03-16 Hrl Laboratories, Llc Impedance-matched through-wafer transition using integrated heat-spreader technology
US10548240B1 (en) * 2019-01-11 2020-01-28 Google Llc Cooling electronic devices in a data center
US11765871B2 (en) * 2020-03-26 2023-09-19 Ge Aviation Systems Llc Aircraft and method for thermal management
JP2023030387A (ja) * 2021-08-23 2023-03-08 富士フイルムビジネスイノベーション株式会社 基板構造及び電子機器
US11950354B2 (en) 2022-03-04 2024-04-02 Apple Inc. Internal architecture of a computing device
US12046534B2 (en) 2022-03-04 2024-07-23 Apple Inc. Structural and thermal management of an integrated circuit

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6315038B1 (en) * 1998-09-22 2001-11-13 Intel Corporation Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
US6657121B2 (en) 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US7133283B2 (en) 2002-01-04 2006-11-07 Intel Corporation Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
JP4371210B2 (ja) * 2003-12-05 2009-11-25 日本電気株式会社 電子ユニットおよびその放熱構造
US7719837B2 (en) 2005-08-22 2010-05-18 Shan Ping Wu Method and apparatus for cooling a blade server
CN100543639C (zh) * 2005-11-01 2009-09-23 鸿富锦精密工业（深圳）有限公司 散热系统
CN101072482A (zh) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 散热装置及使用该散热装置的散热系统
WO2007139559A1 (en) 2006-06-01 2007-12-06 Exaflop Llc Controlled warm air capture
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components
US7403384B2 (en) * 2006-07-26 2008-07-22 Dell Products L.P. Thermal docking station for electronics
US20080043442A1 (en) * 2006-08-16 2008-02-21 Strickland Travis C Computer system with thermal conduction
US7903409B2 (en) * 2007-07-18 2011-03-08 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic device
US20090027856A1 (en) * 2007-07-26 2009-01-29 Mccoy Scott Blade cooling system using wet and dry heat sinks
FR2925254B1 (fr) * 2007-12-18 2009-12-04 Thales Sa Dispositif de refroidissement d'une carte electronique par conduction a l'aide de caloducs,et procede de fabrication correspondant.
CN201142047Y (zh) * 2008-01-03 2008-10-29 浪潮电子信息产业股份有限公司 利于散热的1u机箱散热装置
US7626820B1 (en) * 2008-05-15 2009-12-01 Sun Microsystems, Inc. Thermal transfer technique using heat pipes with integral rack rails
BRPI0918292A2 (pt) * 2008-09-08 2015-12-22 Intergraph Technologies Co computador robusto capaz de operar em ambientes de alta temperatura
JP4658174B2 (ja) 2008-09-24 2011-03-23 株式会社日立製作所 電子装置
CN101902895A (zh) * 2009-05-27 2010-12-01 鸿富锦精密工业（深圳）有限公司 散热系统
US8644020B2 (en) * 2010-12-01 2014-02-04 Google Inc. Cooling heat-generating electronics

Also Published As

Publication number Publication date
SG190896A1 (en) 2013-07-31
EP2750493B1 (en) 2016-03-30
TWI559844B (zh) 2016-11-21
EP2647273A1 (en) 2013-10-09
US9313926B2 (en) 2016-04-12
EP2647273B1 (en) 2014-04-02
EP2750493A2 (en) 2014-07-02
EP2750493A3 (en) 2014-08-06
CN103329641A (zh) 2013-09-25
US8644020B2 (en) 2014-02-04
US20140146466A1 (en) 2014-05-29
WO2012075300A1 (en) 2012-06-07
US20120140403A1 (en) 2012-06-07
CN103329641B (zh) 2016-03-09
TW201238461A (en) 2012-09-16

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