HK1194534A1 - 具有液晶透鏡的集成圖像傳感器封裝 - Google Patents
具有液晶透鏡的集成圖像傳感器封裝Info
- Publication number
- HK1194534A1 HK1194534A1 HK14107877.7A HK14107877A HK1194534A1 HK 1194534 A1 HK1194534 A1 HK 1194534A1 HK 14107877 A HK14107877 A HK 14107877A HK 1194534 A1 HK1194534 A1 HK 1194534A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- liquid crystal
- image sensor
- crystal lens
- sensor package
- integrated image
- Prior art date
Links
- 239000004973 liquid crystal related substance Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/12—Fluid-filled or evacuated lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
- G03B3/10—Power-operated focusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
- H02K41/0356—Lorentz force motors, e.g. voice coil motors moving along a straight path
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0053—Driving means for the movement of one or more optical element
- G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Liquid Crystal (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/559,510 US8921759B2 (en) | 2012-07-26 | 2012-07-26 | Integrated image sensor package with liquid crystal lens |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1194534A1 true HK1194534A1 (zh) | 2014-10-17 |
Family
ID=49993953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14107877.7A HK1194534A1 (zh) | 2012-07-26 | 2014-08-01 | 具有液晶透鏡的集成圖像傳感器封裝 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8921759B2 (zh) |
KR (1) | KR101424930B1 (zh) |
CN (1) | CN103579265B (zh) |
HK (1) | HK1194534A1 (zh) |
TW (1) | TWI470780B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5760525B2 (ja) * | 2010-03-30 | 2015-08-12 | Jfeスチール株式会社 | ステンレス箔およびその箔を用いた排ガス浄化装置用触媒担体 |
KR102047378B1 (ko) | 2012-11-30 | 2019-11-21 | 엘지이노텍 주식회사 | 카메라 모듈 |
US9496247B2 (en) * | 2013-08-26 | 2016-11-15 | Optiz, Inc. | Integrated camera module and method of making same |
US9461190B2 (en) | 2013-09-24 | 2016-10-04 | Optiz, Inc. | Low profile sensor package with cooling feature and method of making same |
US9496297B2 (en) | 2013-12-05 | 2016-11-15 | Optiz, Inc. | Sensor package with cooling feature and method of making same |
CN203708326U (zh) * | 2013-12-09 | 2014-07-09 | 光宝电子(广州)有限公司 | 相机模组 |
US9666730B2 (en) * | 2014-08-18 | 2017-05-30 | Optiz, Inc. | Wire bond sensor package |
US9276140B1 (en) * | 2014-09-16 | 2016-03-01 | Amazon Technologies, Inc. | Imager module with interposer chip |
CN104851899B (zh) * | 2015-05-19 | 2018-01-19 | 苏州晶方半导体科技股份有限公司 | 图像传感器封装结构及其封装方法 |
US10869393B2 (en) * | 2015-06-29 | 2020-12-15 | Microsoft Technology Licensing, Llc | Pedestal mounting of sensor system |
US9996725B2 (en) | 2016-11-03 | 2018-06-12 | Optiz, Inc. | Under screen sensor assembly |
CN106373974B (zh) * | 2016-11-24 | 2019-10-18 | 江苏骏龙光电科技股份有限公司 | 一种具有参考电容的传感器件 |
CN106373973B (zh) * | 2016-11-24 | 2019-11-05 | 江苏骏龙光电科技股份有限公司 | 一种抗干扰图像传感器 |
CN106409856B (zh) * | 2016-11-24 | 2019-09-20 | 江苏天楹之光光电科技有限公司 | 一种制造具有参考电容的传感器的方法 |
US20190027531A1 (en) * | 2017-07-19 | 2019-01-24 | Omnivision Technologies, Inc. | Image sensor module having protective structure |
US10224357B1 (en) * | 2017-09-07 | 2019-03-05 | Visera Technologies Company Limited | Image sensor packages |
US11408589B2 (en) | 2019-12-05 | 2022-08-09 | Optiz, Inc. | Monolithic multi-focus light source device |
KR102455520B1 (ko) * | 2020-06-05 | 2022-10-17 | 한국과학기술원 | 마이크로렌즈 어레이를 이용한 초박형 카메라 장치 그리고 이의 다기능 이미징 방법 |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1073758A (ja) | 1996-06-07 | 1998-03-17 | Olympus Optical Co Ltd | 結像光学系 |
IL123207A0 (en) | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
IL133453A0 (en) | 1999-12-10 | 2001-04-30 | Shellcase Ltd | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
US7033664B2 (en) | 2002-10-22 | 2006-04-25 | Tessera Technologies Hungary Kft | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
US6972480B2 (en) | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
KR101078621B1 (ko) | 2003-07-03 | 2011-11-01 | 테쎄라 테크놀로지스 아일랜드 리미티드 | 집적회로 디바이스를 패키징하기 위한 방법 및 장치 |
JP3841174B2 (ja) * | 2003-12-18 | 2006-11-01 | ソニー株式会社 | 撮像装置 |
US7535649B2 (en) | 2004-03-09 | 2009-05-19 | Tang Yin S | Motionless lens systems and methods |
JP2005309323A (ja) | 2004-04-26 | 2005-11-04 | Kodak Digital Product Center Japan Ltd | 撮像用焦点距離検出方法及び撮像装置 |
AU2005327541A1 (en) | 2004-11-05 | 2006-08-24 | The Regents Of The University Of California | Fluidic adaptive lens systems with pumping systems |
JP4607900B2 (ja) | 2004-11-16 | 2011-01-05 | シチズンホールディングス株式会社 | 自動合焦点装置 |
KR100645635B1 (ko) * | 2004-11-30 | 2006-11-15 | 삼성전기주식회사 | 광학 소자를 포함하는 이미지 픽업 모듈 |
US7936062B2 (en) | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
US20070190747A1 (en) | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
JP2007310004A (ja) | 2006-05-16 | 2007-11-29 | Citizen Holdings Co Ltd | 自動合焦点装置 |
JP4750626B2 (ja) | 2006-05-31 | 2011-08-17 | シチズンホールディングス株式会社 | 自動合焦点装置 |
JP5301618B2 (ja) * | 2006-06-01 | 2013-09-25 | 日本電信電話株式会社 | 光学センサ及びセンサチップ |
US7724347B2 (en) | 2006-09-05 | 2010-05-25 | Tunable Optix Corporation | Tunable liquid crystal lens module |
US7829438B2 (en) | 2006-10-10 | 2010-11-09 | Tessera, Inc. | Edge connect wafer level stacking |
US7901989B2 (en) | 2006-10-10 | 2011-03-08 | Tessera, Inc. | Reconstituted wafer level stacking |
US8513789B2 (en) | 2006-10-10 | 2013-08-20 | Tessera, Inc. | Edge connect wafer level stacking with leads extending along edges |
US7935568B2 (en) | 2006-10-31 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating |
US7807508B2 (en) | 2006-10-31 | 2010-10-05 | Tessera Technologies Hungary Kft. | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating |
US7791199B2 (en) | 2006-11-22 | 2010-09-07 | Tessera, Inc. | Packaged semiconductor chips |
US8569876B2 (en) | 2006-11-22 | 2013-10-29 | Tessera, Inc. | Packaged semiconductor chips with array |
US7749886B2 (en) | 2006-12-20 | 2010-07-06 | Tessera, Inc. | Microelectronic assemblies having compliancy and methods therefor |
US20080191335A1 (en) * | 2007-02-08 | 2008-08-14 | Advanced Chip Engineering Technology Inc. | Cmos image sensor chip scale package with die receiving opening and method of the same |
US8405196B2 (en) | 2007-03-05 | 2013-03-26 | DigitalOptics Corporation Europe Limited | Chips having rear contacts connected by through vias to front contacts |
WO2008150817A1 (en) | 2007-05-31 | 2008-12-11 | Artificial Muscle, Inc. | Optical systems employing compliant electroactive materials |
JP2008305972A (ja) * | 2007-06-07 | 2008-12-18 | Panasonic Corp | 光学デバイス及びその製造方法、並びに、光学デバイスを用いたカメラモジュール及び該カメラモジュールを搭載した電子機器 |
US8786759B2 (en) * | 2007-08-28 | 2014-07-22 | Motorola Mobility Llc | Method and apparatus for auto-focus using liquid crystal adaptive optics |
KR101572600B1 (ko) | 2007-10-10 | 2015-11-27 | 테세라, 인코포레이티드 | 다층 배선 요소와 마이크로전자 요소가 실장된 어셈블리 |
US7829966B2 (en) * | 2007-11-23 | 2010-11-09 | Visera Technologies Company Limited | Electronic assembly for image sensor device |
US7986178B2 (en) | 2007-12-14 | 2011-07-26 | Supertex, Inc. | Pulse width modulation driver for electroactive lens |
US20090212381A1 (en) | 2008-02-26 | 2009-08-27 | Tessera, Inc. | Wafer level packages for rear-face illuminated solid state image sensors |
US20100053407A1 (en) | 2008-02-26 | 2010-03-04 | Tessera, Inc. | Wafer level compliant packages for rear-face illuminated solid state image sensors |
US7859033B2 (en) | 2008-07-09 | 2010-12-28 | Eastman Kodak Company | Wafer level processing for backside illuminated sensors |
JP2010219425A (ja) | 2009-03-18 | 2010-09-30 | Toshiba Corp | 半導体装置 |
CN101931742B (zh) * | 2009-06-18 | 2013-04-24 | 鸿富锦精密工业(深圳)有限公司 | 影像感测模组及取像模组 |
TWI449162B (zh) * | 2010-05-17 | 2014-08-11 | Kingpak Tech Inc | 具有特定焦距之晶圓級影像感測器模組之製造方法 |
US8796135B2 (en) | 2010-07-23 | 2014-08-05 | Tessera, Inc. | Microelectronic elements with rear contacts connected with via first or via middle structures |
US8847376B2 (en) | 2010-07-23 | 2014-09-30 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
US8598695B2 (en) | 2010-07-23 | 2013-12-03 | Tessera, Inc. | Active chip on carrier or laminated chip having microelectronic element embedded therein |
US8697569B2 (en) | 2010-07-23 | 2014-04-15 | Tessera, Inc. | Non-lithographic formation of three-dimensional conductive elements |
US8791575B2 (en) | 2010-07-23 | 2014-07-29 | Tessera, Inc. | Microelectronic elements having metallic pads overlying vias |
US9640437B2 (en) | 2010-07-23 | 2017-05-02 | Tessera, Inc. | Methods of forming semiconductor elements using micro-abrasive particle stream |
US8685793B2 (en) | 2010-09-16 | 2014-04-01 | Tessera, Inc. | Chip assembly having via interconnects joined by plating |
US8686565B2 (en) | 2010-09-16 | 2014-04-01 | Tessera, Inc. | Stacked chip assembly having vertical vias |
US8610259B2 (en) | 2010-09-17 | 2013-12-17 | Tessera, Inc. | Multi-function and shielded 3D interconnects |
US8847380B2 (en) | 2010-09-17 | 2014-09-30 | Tessera, Inc. | Staged via formation from both sides of chip |
JP5331838B2 (ja) * | 2011-02-25 | 2013-10-30 | 株式会社東芝 | 固体撮像装置および携帯情報端末 |
-
2012
- 2012-07-26 US US13/559,510 patent/US8921759B2/en active Active
-
2013
- 2013-02-04 TW TW102104182A patent/TWI470780B/zh active
- 2013-02-28 CN CN201310063474.6A patent/CN103579265B/zh active Active
- 2013-05-10 KR KR1020130053143A patent/KR101424930B1/ko active IP Right Grant
-
2014
- 2014-08-01 HK HK14107877.7A patent/HK1194534A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20140027612A1 (en) | 2014-01-30 |
CN103579265A (zh) | 2014-02-12 |
TWI470780B (zh) | 2015-01-21 |
US8921759B2 (en) | 2014-12-30 |
TW201405787A (zh) | 2014-02-01 |
CN103579265B (zh) | 2016-03-02 |
KR20140013905A (ko) | 2014-02-05 |
KR101424930B1 (ko) | 2014-08-01 |
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