HK1189389A1 - 各向異性導電連接材料、膜層叠體、連接方法及連接結構體 - Google Patents

各向異性導電連接材料、膜層叠體、連接方法及連接結構體

Info

Publication number
HK1189389A1
HK1189389A1 HK14102534.3A HK14102534A HK1189389A1 HK 1189389 A1 HK1189389 A1 HK 1189389A1 HK 14102534 A HK14102534 A HK 14102534A HK 1189389 A1 HK1189389 A1 HK 1189389A1
Authority
HK
Hong Kong
Prior art keywords
connection
anisotropic conductive
film laminate
connection structure
connection method
Prior art date
Application number
HK14102534.3A
Other languages
English (en)
Chinese (zh)
Inventor
阿久津恭志
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1189389A1 publication Critical patent/HK1189389A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
HK14102534.3A 2011-05-12 2014-03-13 各向異性導電連接材料、膜層叠體、連接方法及連接結構體 HK1189389A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011107457A JP5816456B2 (ja) 2011-05-12 2011-05-12 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体
PCT/JP2012/062194 WO2012153849A1 (ja) 2011-05-12 2012-05-11 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体

Publications (1)

Publication Number Publication Date
HK1189389A1 true HK1189389A1 (zh) 2014-06-06

Family

ID=44881092

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14102534.3A HK1189389A1 (zh) 2011-05-12 2014-03-13 各向異性導電連接材料、膜層叠體、連接方法及連接結構體

Country Status (6)

Country Link
JP (1) JP5816456B2 (ja)
KR (1) KR101973823B1 (ja)
CN (1) CN103502379B (ja)
HK (1) HK1189389A1 (ja)
TW (1) TWI539470B (ja)
WO (1) WO2012153849A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102413690B1 (ko) * 2014-02-04 2022-06-27 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
JP7305957B2 (ja) * 2016-10-03 2023-07-11 株式会社レゾナック 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法
CN106371250A (zh) * 2016-10-21 2017-02-01 芜湖赋兴光电有限公司 一种acf胶热压工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4736280B2 (ja) * 2001-08-30 2011-07-27 日立化成工業株式会社 回路接続用接着剤及びそれを用いた回路接続構造体
JP2003313533A (ja) * 2002-04-23 2003-11-06 Sumitomo Bakelite Co Ltd 異方導電性接着剤
KR101039978B1 (ko) * 2004-06-09 2011-06-13 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로접속재료, 회로부재의 접속구조 및 반도체 장치
JP4381967B2 (ja) * 2004-12-07 2009-12-09 電気化学工業株式会社 接着剤組成物とそれを用いた接合体、接着剤組成物の製造方法
KR101035810B1 (ko) * 2005-10-18 2011-05-20 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 회로 접속 부재의 접속구조 및 반도체 장치
JP5000695B2 (ja) 2009-09-01 2012-08-15 日立化成工業株式会社 回路板装置の製造法

Also Published As

Publication number Publication date
JP2011204685A (ja) 2011-10-13
KR101973823B1 (ko) 2019-04-29
CN103502379A (zh) 2014-01-08
JP5816456B2 (ja) 2015-11-18
CN103502379B (zh) 2016-02-10
KR20140035391A (ko) 2014-03-21
WO2012153849A1 (ja) 2012-11-15
TWI539470B (zh) 2016-06-21
TW201301300A (zh) 2013-01-01

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