HK1161421A1 - Extremely stretchable electronics - Google Patents
Extremely stretchable electronicsInfo
- Publication number
- HK1161421A1 HK1161421A1 HK12101553.3A HK12101553A HK1161421A1 HK 1161421 A1 HK1161421 A1 HK 1161421A1 HK 12101553 A HK12101553 A HK 12101553A HK 1161421 A1 HK1161421 A1 HK 1161421A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- stretchable electronics
- extremely stretchable
- extremely
- electronics
- stretchable
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/95—Instruments specially adapted for placement or removal of stents or stent-grafts
- A61F2/958—Inflatable balloons for placing stents or stent-grafts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Combinations Of Printed Boards (AREA)
- Measuring Leads Or Probes (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11362208P | 2008-11-12 | 2008-11-12 | |
US12/575,008 US9289132B2 (en) | 2008-10-07 | 2009-10-07 | Catheter balloon having stretchable integrated circuitry and sensor array |
PCT/US2009/064199 WO2010056857A2 (fr) | 2008-11-12 | 2009-11-12 | Dispositifs electroniques extremement etirables |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1161421A1 true HK1161421A1 (en) | 2012-08-24 |
Family
ID=44279922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12101553.3A HK1161421A1 (en) | 2008-11-12 | 2012-02-16 | Extremely stretchable electronics |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP2356680B1 (fr) |
JP (5) | JP5689066B2 (fr) |
HK (1) | HK1161421A1 (fr) |
WO (1) | WO2010056857A2 (fr) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US9119533B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
EP2349440B1 (fr) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Ballonnet de cathéter comportant un circuit intégré étirable et un réseau de détecteurs |
US9545285B2 (en) | 2011-10-05 | 2017-01-17 | Mc10, Inc. | Cardiac catheter employing conformal electronics for mapping |
US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
WO2012125494A2 (fr) | 2011-03-11 | 2012-09-20 | Mc10, Inc. | Dispositifs intégrés destinés à faciliter des dosages quantitatifs et la pose de diagnostics |
JP2014523633A (ja) | 2011-05-27 | 2014-09-11 | エムシー10 インコーポレイテッド | 電子的、光学的、且つ/又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法 |
US9757050B2 (en) | 2011-08-05 | 2017-09-12 | Mc10, Inc. | Catheter balloon employing force sensing elements |
DE112012003250T5 (de) | 2011-08-05 | 2014-04-30 | Mc10, Inc. | Katheder Ballon-Verfahren und Vorrichtung unter Einsatz von Abtastelementen |
JP6129838B2 (ja) | 2011-09-01 | 2017-05-17 | エムシー10 インコーポレイテッドMc10,Inc. | 組織の状態を検出する電子装置 |
US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
US9247637B2 (en) | 2012-06-11 | 2016-01-26 | Mc10, Inc. | Strain relief structures for stretchable interconnects |
US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
KR20150031324A (ko) | 2012-07-05 | 2015-03-23 | 엠씨10, 인크 | 유동 감지를 포함하는 카테터 장치 |
EP2906960A4 (fr) | 2012-10-09 | 2016-06-15 | Mc10 Inc | Électronique conforme intégrée à un article vestimentaire |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
CN105723197A (zh) | 2013-08-05 | 2016-06-29 | Mc10股份有限公司 | 包括可适形电子器件的柔性温度传感器 |
CN105705093A (zh) | 2013-10-07 | 2016-06-22 | Mc10股份有限公司 | 用于感测和分析的适形传感器系统 |
CN105813545A (zh) | 2013-11-22 | 2016-07-27 | Mc10股份有限公司 | 用于感测和分析心搏的适形传感器系统 |
CN105874606B (zh) | 2014-01-06 | 2021-01-12 | Mc10股份有限公司 | 包封适形电子系统和器件及其制作和使用方法 |
US9380697B2 (en) * | 2014-01-28 | 2016-06-28 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device and manufacturing method for same |
EP3114911B1 (fr) | 2014-03-04 | 2023-05-03 | Medidata Solutions, Inc. | Boîtier d'encapsulation souple en plusieurs parties pour dispositifs électroniques |
CA2941248A1 (fr) | 2014-03-12 | 2015-09-17 | Mc10, Inc. | Quantification d'un changement lors d'un dosage |
US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
US10297572B2 (en) * | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
US9380698B1 (en) * | 2014-12-05 | 2016-06-28 | VivaLnk, Inc. | Stretchable electronic patch having a foldable circuit layer |
US10306755B2 (en) | 2014-12-08 | 2019-05-28 | Fujikura Ltd. | Stretchable board |
US10477354B2 (en) | 2015-02-20 | 2019-11-12 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
US10398343B2 (en) | 2015-03-02 | 2019-09-03 | Mc10, Inc. | Perspiration sensor |
WO2017015000A1 (fr) | 2015-07-17 | 2017-01-26 | Mc10, Inc. | Raidisseur conducteur, procédé de fabrication d'un raidisseur conducteur, ainsi qu'adhésif conducteur et couches d'encapsulation |
US10709384B2 (en) | 2015-08-19 | 2020-07-14 | Mc10, Inc. | Wearable heat flux devices and methods of use |
EP4079383A3 (fr) | 2015-10-01 | 2023-02-22 | Medidata Solutions, Inc. | Procédé et système permettant d'interagir avec un environnement virtuel |
WO2017062508A1 (fr) | 2015-10-05 | 2017-04-13 | Mc10, Inc. | Procédé et système de neuromodulation et de stimulation |
US10277386B2 (en) | 2016-02-22 | 2019-04-30 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
CN108781313B (zh) | 2016-02-22 | 2022-04-08 | 美谛达解决方案公司 | 用以贴身获取传感器信息的耦接的集线器和传感器节点的系统、装置和方法 |
US11154235B2 (en) | 2016-04-19 | 2021-10-26 | Medidata Solutions, Inc. | Method and system for measuring perspiration |
CN109076696A (zh) * | 2016-07-12 | 2018-12-21 | 株式会社藤仓 | 伸缩性基板 |
FR3054640B1 (fr) * | 2016-07-28 | 2020-06-12 | Linxens Holding | Dispositif emetteur de lumiere |
US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
JP6920040B2 (ja) | 2016-09-15 | 2021-08-18 | 日東電工株式会社 | 生体貼付用積層体 |
JP2020107660A (ja) * | 2018-12-26 | 2020-07-09 | ソニー株式会社 | フレキシブル配線基板及び電子機器 |
GB201907270D0 (en) * | 2019-03-14 | 2019-07-10 | Imp College Innovations Ltd | Component for a stretchable electronic device |
JP7316538B2 (ja) * | 2019-03-20 | 2023-07-28 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
US11123011B1 (en) | 2020-03-23 | 2021-09-21 | Nix, Inc. | Wearable systems, devices, and methods for measurement and analysis of body fluids |
DE102020120642A1 (de) | 2020-08-05 | 2022-02-10 | peptech GmbH | Funktionseinheit, elektronisches Bauteil und Verfahren zur Herstellung einer Funktionseinheit |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5686697A (en) * | 1995-01-06 | 1997-11-11 | Metatech Corporation | Electrical circuit suspension system |
DE59803887D1 (de) * | 1998-01-22 | 2002-05-23 | Fraunhofer Ges Forschung | Mikrosystem und verfahren zum herstellen eines mikrosystems |
US6360615B1 (en) * | 2000-06-06 | 2002-03-26 | Technoskin, Llc | Wearable effect-emitting strain gauge device |
US6775906B1 (en) * | 2000-10-20 | 2004-08-17 | Silverbrook Research Pty Ltd | Method of manufacturing an integrated circuit carrier |
US6743982B2 (en) * | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
WO2003021679A2 (fr) * | 2001-09-03 | 2003-03-13 | National Microelectronic Research Centre University College Cork - National University Of Ireland Cork | Structure de circuit integre et son procede de fabrication |
US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
JP3811495B2 (ja) * | 2004-02-05 | 2006-08-23 | 松下電器産業株式会社 | アクチュエータ及びアクチュエータ用平板状電極支持体の製造方法 |
JP2006108431A (ja) * | 2004-10-06 | 2006-04-20 | Sharp Corp | 半導体装置 |
WO2007116344A1 (fr) * | 2006-04-07 | 2007-10-18 | Koninklijke Philips Electronics N.V. | Dispositif de circuit integre a deformation elastique |
CN101681695B (zh) * | 2006-09-06 | 2013-04-10 | 伊利诺伊大学评议会 | 在用于可拉伸电子元件的半导体互连和纳米膜中的受控弯曲结构 |
-
2009
- 2009-11-12 JP JP2011536465A patent/JP5689066B2/ja active Active
- 2009-11-12 EP EP09826745.3A patent/EP2356680B1/fr active Active
- 2009-11-12 EP EP15157469.6A patent/EP2902293B1/fr active Active
- 2009-11-12 WO PCT/US2009/064199 patent/WO2010056857A2/fr active Application Filing
-
2012
- 2012-02-16 HK HK12101553.3A patent/HK1161421A1/xx unknown
-
2015
- 2015-01-27 JP JP2015013538A patent/JP6014178B2/ja active Active
- 2015-01-27 JP JP2015013537A patent/JP5933773B2/ja active Active
-
2016
- 2016-09-23 JP JP2016185527A patent/JP6411423B2/ja active Active
-
2018
- 2018-06-13 JP JP2018112663A patent/JP2018174335A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP2902293A2 (fr) | 2015-08-05 |
EP2902293B1 (fr) | 2020-03-04 |
JP2012508984A (ja) | 2012-04-12 |
JP5689066B2 (ja) | 2015-03-25 |
JP6014178B2 (ja) | 2016-10-25 |
EP2902293A3 (fr) | 2015-10-14 |
JP6411423B2 (ja) | 2018-10-24 |
WO2010056857A3 (fr) | 2010-07-15 |
WO2010056857A2 (fr) | 2010-05-20 |
JP2016213515A (ja) | 2016-12-15 |
EP2356680A4 (fr) | 2012-03-14 |
EP2356680A2 (fr) | 2011-08-17 |
JP5933773B2 (ja) | 2016-06-15 |
JP2015097290A (ja) | 2015-05-21 |
JP2018174335A (ja) | 2018-11-08 |
JP2015111713A (ja) | 2015-06-18 |
EP2356680B1 (fr) | 2015-04-08 |
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