HK1152288A1 - Composite micromechanical component and method of fabricating the same - Google Patents
Composite micromechanical component and method of fabricating the sameInfo
- Publication number
- HK1152288A1 HK1152288A1 HK11106350.8A HK11106350A HK1152288A1 HK 1152288 A1 HK1152288 A1 HK 1152288A1 HK 11106350 A HK11106350 A HK 11106350A HK 1152288 A1 HK1152288 A1 HK 1152288A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- fabricating
- same
- micromechanical component
- composite micromechanical
- composite
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/008—Manufacture of substrate-free structures separating the processed structure from a mother substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0075—For improving wear resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00087—Holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B13/00—Gearwork
- G04B13/02—Wheels; Pinions; Spindles; Pivots
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B13/00—Gearwork
- G04B13/02—Wheels; Pinions; Spindles; Pivots
- G04B13/021—Wheels; Pinions; Spindles; Pivots elastic fitting with a spindle, axis or shaft
- G04B13/022—Wheels; Pinions; Spindles; Pivots elastic fitting with a spindle, axis or shaft with parts made of hard material, e.g. silicon, diamond, sapphire, quartz and the like
-
- G—PHYSICS
- G04—HOROLOGY
- G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
- G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
- G04D3/0069—Watchmakers' or watch-repairers' machines or tools for working materials for working with non-mechanical means, e.g. chemical, electrochemical, metallising, vapourising; with electron beams, laser beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/035—Microgears
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/032—LIGA process
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Dispersion Chemistry (AREA)
- Nanotechnology (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09162292A EP2263971A1 (fr) | 2009-06-09 | 2009-06-09 | Pièce de micromécanique composite et son procédé de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1152288A1 true HK1152288A1 (en) | 2012-02-24 |
Family
ID=41317859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11106350.8A HK1152288A1 (en) | 2009-06-09 | 2011-06-21 | Composite micromechanical component and method of fabricating the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US9045333B2 (xx) |
EP (3) | EP2263971A1 (xx) |
JP (1) | JP5596426B2 (xx) |
KR (1) | KR20100132463A (xx) |
CN (1) | CN101920928B (xx) |
HK (1) | HK1152288A1 (xx) |
RU (1) | RU2544289C2 (xx) |
TW (1) | TWI555698B (xx) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5366318B2 (ja) * | 2009-09-14 | 2013-12-11 | セイコーインスツル株式会社 | デテント脱進機およびデテント脱進機の作動レバーの製造方法 |
JP5441168B2 (ja) * | 2010-03-10 | 2014-03-12 | セイコーインスツル株式会社 | デテント脱進機と機械式時計 |
EP2400351B1 (fr) | 2010-06-22 | 2013-09-25 | Omega SA | Mobile monobloc pour une pièce d'horlogerie |
JP5595254B2 (ja) * | 2010-12-16 | 2014-09-24 | セイコーインスツル株式会社 | 部品、時計、および部品の製造方法 |
EP2484629B1 (fr) * | 2011-02-03 | 2013-06-26 | Nivarox-FAR S.A. | Pièce de micromécanique complexe ajourée |
CN102167282A (zh) * | 2011-04-07 | 2011-08-31 | 天津海鸥表业集团有限公司 | 一种硅与金属复合材料的微结构加工方法 |
CH705724B9 (fr) | 2011-11-03 | 2016-05-13 | Sigatec Sa | Pièce de micromécanique, notamment pour l'horlogerie. |
EP2595005A1 (fr) * | 2011-11-16 | 2013-05-22 | Omega SA | Mobile monobloc pour une pièce d'horlogerie |
EP2672319A1 (fr) * | 2012-06-06 | 2013-12-11 | Mimotec S.A. | Procédé de fabrication de micro-pièces métalliques tridimensionnelles par croissance dans une cavité mixte et micro-pièces obtenues par le procédé. |
EP2767869A1 (fr) * | 2013-02-13 | 2014-08-20 | Nivarox-FAR S.A. | Procédé de fabrication d'une pièce de micromécanique monobloc comportant au moins deux niveaux distincts |
CH708827A2 (fr) * | 2013-11-08 | 2015-05-15 | Nivarox Sa | Pièce de micromécanique creuse, à plusieurs niveaux fonctionnels et monobloc en un matériau à base d'un allotrope synthétique du carbone. |
EP3109199B1 (fr) * | 2015-06-25 | 2022-05-11 | Nivarox-FAR S.A. | Piece a base de silicium avec au moins un chanfrein et son procede de fabrication |
EP3171230B1 (fr) * | 2015-11-19 | 2019-02-27 | Nivarox-FAR S.A. | Composant d'horlogerie a tribologie amelioree |
EP4075205A1 (fr) * | 2021-04-16 | 2022-10-19 | ETA SA Manufacture Horlogère Suisse | Procédé de fabrication d'un mobile d'horlogerie et mobile d'horlogerie obtenu par sa mise en oeuvre |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4142001A1 (de) * | 1991-12-19 | 1993-06-24 | Microparts Gmbh | Verfahren zum herstellen gestufter formeinsaetze, gestufte formeinsaetze und damit abgeformte mikrostrukturkoerper |
US5529681A (en) * | 1993-03-30 | 1996-06-25 | Microparts Gesellschaft Fur Mikrostrukturtechnik Mbh | Stepped mould inserts, high-precision stepped microstructure bodies, and methods of producing the same |
JPH0874099A (ja) * | 1994-09-09 | 1996-03-19 | Terumo Corp | 機械要素および可動部を有する構造体ならびにその製造方法 |
DE10017976A1 (de) * | 2000-04-11 | 2001-10-18 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
DE10046510A1 (de) * | 2000-09-14 | 2002-04-18 | Siemens Ag | Sensorbauteil mit einem in einem Kanal isoliert, umströmbar gelagerten, elektrisch leitenden, länglichen Element und Herstellverfahren hierfür |
JP2002370199A (ja) * | 2001-06-13 | 2002-12-24 | Takashi Nishi | マイクロ歯車およびその製造方法 |
CN1168781C (zh) * | 2002-11-15 | 2004-09-29 | 中国科学院兰州化学物理研究所 | 自润滑纳米复合材料及其制备方法 |
JP4469194B2 (ja) * | 2004-03-12 | 2010-05-26 | セイコーインスツル株式会社 | 電鋳用型、電鋳方法、及びその電鋳用型の製造方法 |
JP4550569B2 (ja) * | 2004-12-20 | 2010-09-22 | セイコーインスツル株式会社 | 電鋳型とその製造方法 |
JP4840756B2 (ja) * | 2005-01-14 | 2011-12-21 | セイコーインスツル株式会社 | 電鋳型とその製造方法及び電鋳部品の製造方法 |
DE102005015584B4 (de) * | 2005-04-05 | 2010-09-02 | Litef Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauteils |
EP1722281A1 (fr) * | 2005-05-12 | 2006-11-15 | ETA SA Manufacture Horlogère Suisse | Organe d'affichage analogique en matériau cristallin, pièce d'horlogerie pourvue d'un tel organe d'affichage, et procédé pour sa fabrication |
CH696881A5 (fr) * | 2005-06-28 | 2008-01-15 | Eta Sa Mft Horlogere Suisse | Pièce de micro-mécanique en silicium renforcé et son procédé de fabrication. |
EP2060534A1 (fr) * | 2007-11-16 | 2009-05-20 | Nivarox-FAR S.A. | Pièce de micromécanique composite silicium - métal et son procédé de fabrication |
EP2230206B1 (fr) * | 2009-03-13 | 2013-07-17 | Nivarox-FAR S.A. | Moule pour galvanoplastie et son procédé de fabrication |
EP2230207A1 (fr) * | 2009-03-13 | 2010-09-22 | Nivarox-FAR S.A. | Moule pour galvanoplastie et son procédé de fabrication |
-
2009
- 2009-06-09 EP EP09162292A patent/EP2263971A1/fr not_active Withdrawn
-
2010
- 2010-05-18 TW TW099115818A patent/TWI555698B/zh active
- 2010-05-25 EP EP10163789A patent/EP2261171B1/fr active Active
- 2010-05-25 EP EP12172452.0A patent/EP2518011B1/fr active Active
- 2010-06-08 RU RU2010123368/28A patent/RU2544289C2/ru active
- 2010-06-09 KR KR1020100054127A patent/KR20100132463A/ko not_active Application Discontinuation
- 2010-06-09 CN CN2010102002501A patent/CN101920928B/zh active Active
- 2010-06-09 US US12/797,389 patent/US9045333B2/en active Active
- 2010-06-09 JP JP2010131758A patent/JP5596426B2/ja active Active
-
2011
- 2011-06-21 HK HK11106350.8A patent/HK1152288A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP2518011A3 (fr) | 2013-01-02 |
EP2261171B1 (fr) | 2012-11-21 |
EP2261171A1 (fr) | 2010-12-15 |
EP2518011A2 (fr) | 2012-10-31 |
CN101920928B (zh) | 2013-05-22 |
EP2518011B1 (fr) | 2013-11-13 |
JP5596426B2 (ja) | 2014-09-24 |
RU2010123368A (ru) | 2011-12-20 |
RU2544289C2 (ru) | 2015-03-20 |
TW201107231A (en) | 2011-03-01 |
US20100308010A1 (en) | 2010-12-09 |
US9045333B2 (en) | 2015-06-02 |
CN101920928A (zh) | 2010-12-22 |
JP2010284794A (ja) | 2010-12-24 |
KR20100132463A (ko) | 2010-12-17 |
TWI555698B (zh) | 2016-11-01 |
EP2263971A1 (fr) | 2010-12-22 |
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