HK1149632A1 - System and method for inspecting a wafer - Google Patents

System and method for inspecting a wafer

Info

Publication number
HK1149632A1
HK1149632A1 HK11103913.5A HK11103913A HK1149632A1 HK 1149632 A1 HK1149632 A1 HK 1149632A1 HK 11103913 A HK11103913 A HK 11103913A HK 1149632 A1 HK1149632 A1 HK 1149632A1
Authority
HK
Hong Kong
Prior art keywords
inspecting
wafer
Prior art date
Application number
HK11103913.5A
Other languages
English (en)
Chinese (zh)
Inventor
阿傑亞拉裡‧阿曼努拉
葛漢成
Original Assignee
聯達科技設備私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 聯達科技設備私人有限公司 filed Critical 聯達科技設備私人有限公司
Publication of HK1149632A1 publication Critical patent/HK1149632A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
HK11103913.5A 2009-01-13 2011-04-19 System and method for inspecting a wafer HK1149632A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200900229-6A SG163442A1 (en) 2009-01-13 2009-01-13 System and method for inspecting a wafer

Publications (1)

Publication Number Publication Date
HK1149632A1 true HK1149632A1 (en) 2011-10-07

Family

ID=54196599

Family Applications (2)

Application Number Title Priority Date Filing Date
HK11103913.5A HK1149632A1 (en) 2009-01-13 2011-04-19 System and method for inspecting a wafer
HK15101274.8A HK1201982A1 (en) 2009-01-13 2015-02-05 System and method for inspecting a wafer

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK15101274.8A HK1201982A1 (en) 2009-01-13 2015-02-05 System and method for inspecting a wafer

Country Status (11)

Country Link
US (1) US9863889B2 (ja)
EP (1) EP2387794A4 (ja)
JP (1) JP5672240B2 (ja)
KR (1) KR101638883B1 (ja)
CN (2) CN104091766B (ja)
HK (2) HK1149632A1 (ja)
IL (1) IL214512A0 (ja)
MY (1) MY149581A (ja)
SG (1) SG163442A1 (ja)
TW (1) TWI658524B (ja)
WO (1) WO2010082900A2 (ja)

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Also Published As

Publication number Publication date
JP5672240B2 (ja) 2015-02-18
IL214512A0 (en) 2011-09-27
JP2012515434A (ja) 2012-07-05
CN104091766B (zh) 2017-04-12
US9863889B2 (en) 2018-01-09
SG163442A1 (en) 2010-08-30
MY149581A (en) 2013-09-13
WO2010082900A3 (en) 2010-09-30
KR20100083743A (ko) 2010-07-22
TWI658524B (zh) 2019-05-01
TW201113967A (en) 2011-04-16
CN101924053A (zh) 2010-12-22
HK1201982A1 (en) 2015-09-11
EP2387794A4 (en) 2018-01-24
CN101924053B (zh) 2014-06-25
KR101638883B1 (ko) 2016-07-22
US20100188499A1 (en) 2010-07-29
EP2387794A2 (en) 2011-11-23
WO2010082900A2 (en) 2010-07-22
CN104091766A (zh) 2014-10-08

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