HK1201982A1 - System and method for inspecting a wafer - Google Patents
System and method for inspecting a waferInfo
- Publication number
- HK1201982A1 HK1201982A1 HK15101274.8A HK15101274A HK1201982A1 HK 1201982 A1 HK1201982 A1 HK 1201982A1 HK 15101274 A HK15101274 A HK 15101274A HK 1201982 A1 HK1201982 A1 HK 1201982A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- inspecting
- wafer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10141—Special mode during image acquisition
- G06T2207/10152—Varying illumination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20212—Image combination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200900229-6A SG163442A1 (en) | 2009-01-13 | 2009-01-13 | System and method for inspecting a wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1201982A1 true HK1201982A1 (en) | 2015-09-11 |
Family
ID=54196599
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11103913.5A HK1149632A1 (en) | 2009-01-13 | 2011-04-19 | System and method for inspecting a wafer |
HK15101274.8A HK1201982A1 (en) | 2009-01-13 | 2015-02-05 | System and method for inspecting a wafer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11103913.5A HK1149632A1 (en) | 2009-01-13 | 2011-04-19 | System and method for inspecting a wafer |
Country Status (11)
Country | Link |
---|---|
US (1) | US9863889B2 (xx) |
EP (1) | EP2387794A4 (xx) |
JP (1) | JP5672240B2 (xx) |
KR (1) | KR101638883B1 (xx) |
CN (2) | CN101924053B (xx) |
HK (2) | HK1149632A1 (xx) |
IL (1) | IL214512A0 (xx) |
MY (1) | MY149581A (xx) |
SG (1) | SG163442A1 (xx) |
TW (1) | TWI658524B (xx) |
WO (1) | WO2010082900A2 (xx) |
Families Citing this family (54)
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US8945361B2 (en) * | 2005-09-20 | 2015-02-03 | ProteinSimple | Electrophoresis standards, methods and kits |
US8681215B2 (en) * | 2011-04-29 | 2014-03-25 | ProteinSimple | Method and particle analyzer for determining a broad particle size distribution |
KR101877468B1 (ko) | 2011-12-29 | 2018-07-12 | 삼성전자주식회사 | 광원 장치 및 광 생성 방법 |
US9553034B1 (en) * | 2012-03-27 | 2017-01-24 | Kla-Tencor Corporation | Combined semiconductor metrology system |
CN103364403A (zh) * | 2012-04-06 | 2013-10-23 | 鸿富锦精密工业(深圳)有限公司 | 产品质量自动化控管系统及方法 |
US9239295B2 (en) | 2012-04-09 | 2016-01-19 | Kla-Tencor Corp. | Variable polarization wafer inspection |
TWI460394B (zh) * | 2012-07-20 | 2014-11-11 | Test Research Inc | 三維影像量測裝置 |
CN102854196B (zh) * | 2012-09-24 | 2014-06-25 | 江苏物联网研究发展中心 | Mems结构缺陷的晶圆级自动检测方法 |
US9322777B2 (en) * | 2012-10-29 | 2016-04-26 | Tokitae Llc | Systems, devices, and methods employing angular-resolved scattering and spectrally resolved measurements for classification of objects |
US9354185B2 (en) * | 2012-12-21 | 2016-05-31 | Advanced Micro Devices, Inc. | 3D imaging with multiple irradiation frequencies |
CN106062509B (zh) * | 2013-11-20 | 2019-03-08 | 联达科技设备私人有限公司 | 用于选择性地检验部件侧壁的装置和方法 |
TWI489098B (zh) * | 2014-03-11 | 2015-06-21 | Utechzone Co Ltd | Defect detection method and defect detection device |
CN104977306A (zh) * | 2014-04-08 | 2015-10-14 | 上海微电子装备有限公司 | 一种表面缺陷检测系统及方法 |
JP6370177B2 (ja) * | 2014-09-05 | 2018-08-08 | 株式会社Screenホールディングス | 検査装置および検査方法 |
JP6486050B2 (ja) * | 2014-09-29 | 2019-03-20 | 株式会社Screenホールディングス | 検査装置および検査方法 |
US9816940B2 (en) * | 2015-01-21 | 2017-11-14 | Kla-Tencor Corporation | Wafer inspection with focus volumetric method |
DE102015207687A1 (de) * | 2015-04-27 | 2016-10-27 | Fabryki Mebli "Forte" Sa | Verfahren und Vorrichtung zur Überprüfung der Produktqualität von zweidimensionalen Produkten |
CN117577551A (zh) * | 2015-06-05 | 2024-02-20 | 科磊股份有限公司 | 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品 |
EP3113215A1 (en) * | 2015-06-30 | 2017-01-04 | IMEC vzw | Method and device for inspection of a semiconductor device |
JP6765791B2 (ja) * | 2015-08-25 | 2020-10-07 | キヤノン株式会社 | パターンマッチング用の基準画像セットの作成方法、パターンマッチング用の基準画像セットの作成装置、ワークの認識方法、プログラム、及び記録媒体 |
TWI598624B (zh) * | 2015-08-25 | 2017-09-11 | 先進光電科技股份有限公司 | 光學成像系統 |
US10127651B2 (en) * | 2016-01-15 | 2018-11-13 | Kla-Tencor Corporation | Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data |
CN106204598B (zh) * | 2016-07-13 | 2019-02-05 | 东方晶源微电子科技(北京)有限公司 | 在自动缺陷分类流程中管理缺陷的方法及系统 |
US11815347B2 (en) * | 2016-09-28 | 2023-11-14 | Kla-Tencor Corporation | Optical near-field metrology |
US10887580B2 (en) * | 2016-10-07 | 2021-01-05 | Kla-Tencor Corporation | Three-dimensional imaging for semiconductor wafer inspection |
CN107144577B (zh) * | 2016-11-23 | 2020-04-10 | 阜宁协鑫光伏科技有限公司 | 一种硅切片穿孔判定的方法 |
US10504761B2 (en) * | 2017-02-08 | 2019-12-10 | Semiconductor Technologies & Instruments Pte. Ltd. | Method system for generating 3D composite images of objects and determining object properties based thereon |
US10989656B2 (en) * | 2017-05-05 | 2021-04-27 | 3M Innovative Properties Company | Scatterometry system and method of using the same |
EP3635771A4 (en) * | 2017-06-08 | 2021-03-10 | Rudolph Technologies, Inc. | SLICE INSPECTION SYSTEM INCLUDING LASER TRIANGULATION SENSOR |
DE102018106751A1 (de) * | 2017-07-31 | 2019-01-31 | Taiwan Semiconductor Manufacturing Co. Ltd. | Automatisiertes inspektionswerkzeug |
CN109387518B (zh) * | 2017-08-02 | 2022-06-17 | 上海微电子装备(集团)股份有限公司 | 自动光学检测方法 |
CN107741427B (zh) * | 2017-11-30 | 2021-02-19 | 南京航空航天大学 | 汽车发动机涡轮壳表面缺陷的机器视觉检测装置及方法 |
TWI644288B (zh) * | 2018-02-08 | 2018-12-11 | 力成科技股份有限公司 | 熱板表面之檢測方法 |
CN108732189A (zh) * | 2018-08-03 | 2018-11-02 | 江苏阿瑞斯智能设备有限公司 | 一种晶圆芯片检测设备 |
US11138722B2 (en) | 2018-12-21 | 2021-10-05 | Kla-Tencor Corporation | Differential imaging for single-path optical wafer inspection |
US11276161B2 (en) * | 2019-02-26 | 2022-03-15 | KLA Corp. | Reference image generation for semiconductor applications |
US20220214165A1 (en) * | 2019-05-21 | 2022-07-07 | Applied Materials, Inc. | Enhanced cross sectional features measurement methodology |
CN110132141B (zh) * | 2019-06-13 | 2021-07-23 | 上海电气集团股份有限公司 | 一种硅钢片测量的定位平台及方法 |
CN110501347A (zh) * | 2019-07-03 | 2019-11-26 | 深圳市一纳科技有限公司 | 一种快速自动化光学检测系统及方法 |
CN110390325B (zh) * | 2019-07-30 | 2021-07-02 | 深圳市静尚云科技有限公司 | 一种网络集中式ocr识别系统及方法 |
US20220292665A1 (en) * | 2019-10-02 | 2022-09-15 | Konica Minolta, Inc. | Workpiece surface defect detection device and detection method, workpiece surface inspection system, and program |
TWI729520B (zh) * | 2019-10-04 | 2021-06-01 | 致茂電子股份有限公司 | 電子組件檢測系統 |
CN111107324A (zh) * | 2019-12-31 | 2020-05-05 | 上海陛通半导体能源科技股份有限公司 | 晶圆传输系统的监控装置及其监控方法 |
CN111370346B (zh) * | 2020-03-19 | 2023-07-21 | 长江存储科技有限责任公司 | 晶圆翘曲度测量装置及方法 |
CN111916366B (zh) * | 2020-07-29 | 2024-04-12 | 上海果纳半导体技术有限公司 | 晶圆检测设备 |
TWI745144B (zh) * | 2020-10-30 | 2021-11-01 | 致茂電子股份有限公司 | 用於檢測晶圓吸盤殘留異物之線掃描光學檢測系統 |
CN113945572B (zh) * | 2021-10-18 | 2023-08-01 | 郑州大学 | 一种基于机器学习的气缸套表面缺陷智能标注装置 |
CN114115666B (zh) * | 2021-11-26 | 2024-04-16 | 长江存储科技有限责任公司 | 半导体结构检测方法及装置 |
US11913772B2 (en) * | 2022-03-17 | 2024-02-27 | Intel Corporation | Non-destructive gap metrology |
CN115082391B (zh) * | 2022-06-13 | 2024-07-23 | 昂坤视觉(北京)科技有限公司 | 一种晶圆反射率确定方法及相关设备 |
CN115266758B (zh) * | 2022-09-27 | 2022-12-23 | 苏州高视半导体技术有限公司 | 晶圆检测系统、晶圆检测方法、电子设备及存储介质 |
CN116183623B (zh) * | 2023-01-04 | 2024-04-26 | 天津大学 | 一种晶圆表面缺陷智能检测方法、装置 |
CN118299292B (zh) * | 2024-04-01 | 2024-09-06 | 福建平潭瑞谦智能科技有限公司 | 一种用于半导体模块封装的视觉检测设备 |
CN118552528A (zh) * | 2024-07-26 | 2024-08-27 | 江苏雷博微电子设备有限公司 | 基于数据分析的晶圆翘曲度快速测量方法 |
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JP4374303B2 (ja) * | 2004-09-29 | 2009-12-02 | 株式会社日立ハイテクノロジーズ | 検査方法及びその装置 |
KR20070002249A (ko) * | 2005-06-30 | 2007-01-05 | 삼성전자주식회사 | 웨이퍼 결함 검출 방법 |
JP4734135B2 (ja) * | 2005-10-19 | 2011-07-27 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置、それに用いられるコンピュータプログラム、及び試料像観察方法 |
US7747062B2 (en) * | 2005-11-09 | 2010-06-29 | Kla-Tencor Technologies Corp. | Methods, defect review tools, and systems for locating a defect in a defect review process |
US7567344B2 (en) * | 2006-05-12 | 2009-07-28 | Corning Incorporated | Apparatus and method for characterizing defects in a transparent substrate |
JP4760564B2 (ja) * | 2006-06-20 | 2011-08-31 | 日本電気株式会社 | パターン形状の欠陥検出方法及び検出装置 |
CN101236164B (zh) * | 2006-07-31 | 2012-09-05 | 以色列商·应用材料以色列公司 | 用于缺陷检测的方法及系统 |
KR100769790B1 (ko) | 2006-09-29 | 2007-10-25 | 주식회사 하이닉스반도체 | 다크 필드 장비에서의 결함 검출 방법 |
WO2008153452A1 (en) * | 2007-06-13 | 2008-12-18 | Aktiebolaget Skf | A surface inspection device and an arrangement for inspecting a surface |
US7782452B2 (en) * | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
-
2009
- 2009-01-13 SG SG200900229-6A patent/SG163442A1/en unknown
-
2010
- 2010-01-13 CN CN201010004815.9A patent/CN101924053B/zh active Active
- 2010-01-13 EP EP10731444.5A patent/EP2387794A4/en active Pending
- 2010-01-13 TW TW099100872A patent/TWI658524B/zh active
- 2010-01-13 CN CN201410258203.0A patent/CN104091766B/zh active Active
- 2010-01-13 KR KR1020100003271A patent/KR101638883B1/ko active IP Right Grant
- 2010-01-13 MY MYPI2010000164A patent/MY149581A/en unknown
- 2010-01-13 JP JP2011545325A patent/JP5672240B2/ja active Active
- 2010-01-13 US US12/657,089 patent/US9863889B2/en active Active
- 2010-01-13 WO PCT/SG2010/000004 patent/WO2010082900A2/en active Application Filing
-
2011
- 2011-04-19 HK HK11103913.5A patent/HK1149632A1/xx unknown
- 2011-06-28 IL IL214512A patent/IL214512A0/en active IP Right Grant
-
2015
- 2015-02-05 HK HK15101274.8A patent/HK1201982A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
TW201113967A (en) | 2011-04-16 |
WO2010082900A3 (en) | 2010-09-30 |
US9863889B2 (en) | 2018-01-09 |
TWI658524B (zh) | 2019-05-01 |
EP2387794A4 (en) | 2018-01-24 |
JP2012515434A (ja) | 2012-07-05 |
CN101924053A (zh) | 2010-12-22 |
US20100188499A1 (en) | 2010-07-29 |
KR20100083743A (ko) | 2010-07-22 |
HK1149632A1 (en) | 2011-10-07 |
WO2010082900A2 (en) | 2010-07-22 |
JP5672240B2 (ja) | 2015-02-18 |
EP2387794A2 (en) | 2011-11-23 |
CN101924053B (zh) | 2014-06-25 |
MY149581A (en) | 2013-09-13 |
SG163442A1 (en) | 2010-08-30 |
IL214512A0 (en) | 2011-09-27 |
CN104091766A (zh) | 2014-10-08 |
CN104091766B (zh) | 2017-04-12 |
KR101638883B1 (ko) | 2016-07-22 |
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