HK113894A - A device for applying a solder paste, a glue or the like in patches on a substrate - Google Patents
A device for applying a solder paste, a glue or the like in patches on a substrateInfo
- Publication number
- HK113894A HK113894A HK113894A HK113894A HK113894A HK 113894 A HK113894 A HK 113894A HK 113894 A HK113894 A HK 113894A HK 113894 A HK113894 A HK 113894A HK 113894 A HK113894 A HK 113894A
- Authority
- HK
- Hong Kong
- Prior art keywords
- pct
- outlet
- conveying conduit
- patches
- glue
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9000749A SE465756B (sv) | 1990-03-02 | 1990-03-02 | Anordning foer flaeckvis applicering av loedpasta, lim, e d, paa ett substrat |
PCT/SE1991/000155 WO1991012921A1 (en) | 1990-03-02 | 1991-02-27 | A device for applying a solder paste, a glue or the like in patches on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
HK113894A true HK113894A (en) | 1994-10-27 |
Family
ID=20378745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK113894A HK113894A (en) | 1990-03-02 | 1994-10-20 | A device for applying a solder paste, a glue or the like in patches on a substrate |
Country Status (10)
Country | Link |
---|---|
US (1) | US5338360A (ja) |
EP (1) | EP0517767B1 (ja) |
JP (1) | JP2939332B2 (ja) |
AT (1) | ATE101071T1 (ja) |
CA (1) | CA2077449A1 (ja) |
DE (1) | DE69101143T2 (ja) |
ES (1) | ES2048590T3 (ja) |
HK (1) | HK113894A (ja) |
SE (1) | SE465756B (ja) |
WO (1) | WO1991012921A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5320250A (en) * | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
DE4325143C1 (de) * | 1993-07-27 | 1994-12-22 | Itw Dynatec Gmbh Klebetechnik | Auftragseinheit für Leim |
DE9405332U1 (de) * | 1994-03-29 | 1994-07-28 | Siemens AG, 80333 München | Düse zum dosierten Auftragen von Klebstofftropfen |
DE4411569C1 (de) * | 1994-04-02 | 1995-07-20 | Itw Dynatec Gmbh Klebetechnik | Auftragskopf zur dosierten Abgabe von strömenden Medien |
DE19540237C1 (de) * | 1995-10-19 | 1996-10-24 | Montblanc Simplo Gmbh | Vorrichtung zur Mikrodosierung von sedimentierenden Suspensionen oder Emulsionen in Gravurgräben eines Werkstücks, insbesondere eines Schreibgeräts |
SE507519C2 (sv) * | 1996-10-16 | 1998-06-15 | Mydata Automation Ab | Anordning för att anbringa ett visköst medium på ett underlag |
FR2791280B1 (fr) * | 1999-03-23 | 2001-04-13 | Commissariat Energie Atomique | Dispositif d'ejection de gouttes de liquide |
KR20050008733A (ko) * | 2002-05-24 | 2005-01-21 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 캐리어에 의해 지지되는 구성요소를 기판 상의 원하는위치로 이전하기에 적합한 방법, 및 이를 위해 설계된디바이스 |
AU2003294990A1 (en) * | 2003-12-24 | 2005-07-21 | Jesus Sanchez Renasco | Machine for the in-situ gluing of corner pieces which are intended to protect palletised loads |
CN101267894B (zh) * | 2005-11-10 | 2010-11-03 | 株式会社爱发科 | 涂布装置、分散液移动方法 |
JP2007208108A (ja) * | 2006-02-03 | 2007-08-16 | Tamura Seisakusho Co Ltd | 材料供給装置及び方法 |
US7980197B2 (en) | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
KR101196284B1 (ko) | 2012-09-18 | 2012-11-06 | 이동주 | 솔더 페이스트 공급장치 |
CN110899057B (zh) * | 2019-12-13 | 2021-03-30 | 苏州迪泰奇自动化科技有限公司 | 一种基于往复运动进行定量点胶的智能点胶装置 |
CN111389671B (zh) * | 2020-03-19 | 2021-04-23 | 宁波铂汉科技有限公司 | 一种电子元器件生产加工用刮胶装置 |
CN113878196B (zh) * | 2021-11-03 | 2023-03-14 | 深圳市思创新精密科技有限公司 | 一种smt激光模板表面锡膏涂抹装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667877A (en) * | 1985-08-15 | 1987-05-26 | Carnegie-Mellon University | Multi-orifice impulsed spray generator |
DE3637631C1 (de) * | 1986-11-05 | 1987-08-20 | Philips Patentverwaltung | Verfahren zum Aufbringen kleiner schmelzfluessiger,tropfenfoermiger Lotmengen aus einer Duese auf zu benetzende Flaechen und Vorrichtung zur Durchfuehrung des Verfahrens |
SE8704685D0 (sv) * | 1987-11-25 | 1987-11-25 | Mytronic Ab | Anordning for att med tvangsstyrd slangvolym snabbt legga ut pastor och lim |
SE461822B (sv) * | 1988-07-08 | 1990-03-26 | Mydata Automation Ab | Anordning foer att laegga ut pastor och lim i diskreta punkter, foeretraedesvis vid ytmontering av komponenter paa kretskort |
-
1990
- 1990-03-02 SE SE9000749A patent/SE465756B/sv not_active IP Right Cessation
-
1991
- 1991-02-27 EP EP91905127A patent/EP0517767B1/en not_active Expired - Lifetime
- 1991-02-27 ES ES91905127T patent/ES2048590T3/es not_active Expired - Lifetime
- 1991-02-27 AT AT91905127T patent/ATE101071T1/de not_active IP Right Cessation
- 1991-02-27 US US07/956,872 patent/US5338360A/en not_active Expired - Lifetime
- 1991-02-27 CA CA002077449A patent/CA2077449A1/en not_active Abandoned
- 1991-02-27 WO PCT/SE1991/000155 patent/WO1991012921A1/en active IP Right Grant
- 1991-02-27 DE DE91905127T patent/DE69101143T2/de not_active Expired - Fee Related
- 1991-02-27 JP JP3505218A patent/JP2939332B2/ja not_active Expired - Fee Related
-
1994
- 1994-10-20 HK HK113894A patent/HK113894A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69101143T2 (de) | 1994-05-11 |
JPH05505065A (ja) | 1993-07-29 |
SE465756B (sv) | 1991-10-28 |
WO1991012921A1 (en) | 1991-09-05 |
ATE101071T1 (de) | 1994-02-15 |
EP0517767B1 (en) | 1994-02-02 |
EP0517767A1 (en) | 1992-12-16 |
DE69101143D1 (de) | 1994-03-17 |
CA2077449A1 (en) | 1991-09-03 |
ES2048590T3 (es) | 1994-03-16 |
US5338360A (en) | 1994-08-16 |
JP2939332B2 (ja) | 1999-08-25 |
SE9000749L (sv) | 1991-09-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |