ES2048590T3 - Un dispositivo para aplicar una pasta de soldar, un pegamento o similar en parches sobre un sustrato. - Google Patents

Un dispositivo para aplicar una pasta de soldar, un pegamento o similar en parches sobre un sustrato.

Info

Publication number
ES2048590T3
ES2048590T3 ES91905127T ES91905127T ES2048590T3 ES 2048590 T3 ES2048590 T3 ES 2048590T3 ES 91905127 T ES91905127 T ES 91905127T ES 91905127 T ES91905127 T ES 91905127T ES 2048590 T3 ES2048590 T3 ES 2048590T3
Authority
ES
Spain
Prior art keywords
pct
outlet
conveying conduit
patches
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91905127T
Other languages
English (en)
Inventor
Kenth Ake Sune Nilsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qenico AB
Original Assignee
Qenico AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qenico AB filed Critical Qenico AB
Application granted granted Critical
Publication of ES2048590T3 publication Critical patent/ES2048590T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

SE PRESENTA UN DISPOSITIVO PARA APLICAR UNA PASTA DE SOLDADURA, UN PEGAMENTO U OTRO MATERIAL SIMILAR EN FORMA DE PARCHES SOBRE UN SUBSTRATO (24), EL DISPOSITIVO COMPRENDE UN MEDIO DE SUMINISTRO (10) DE DICHO MATERIAL, UNA SALIDA (16), CONECTADA A DICHO MEDIO DE SUMINISTRO POR MEDIO DE UN CONDUCTO DE TRANSPORTE (14), Y MEDIOS (18) PARA DESCARGAR DE FORMA INTERMITENTE Y FORZADA EL MATERIAL EN SUCESIVAS PEQUEÑAS CANTIDADES A TRAVES DE LA SALIDA (16). PARA EVITAR CUALQUIER SEDIMENTACION DENTRO DEL CONDUCTO DE TRANSPORTE (14), DICHO CONDUCTO ESTA FORMADO COMO UN CIRCUITO CERRADO QUE CONTIENE MEDIOS (13) PARA SUMINISTRAR EL MATERIAL EN UN FLUJO CONTINUAMENTE CIRCULANTE A TRAVES DEL MISMO Y LA SALIDA (16) COMPRENDE UNA ABERTURA DE DESCARGA (17), SITUADA EN LA PARED DEL CONDUCTO DE TRANSPORTE (14) Y A TRAVES DE LA CUAL EL MATERIAL SALE EN PEQUEÑAS CANTIDADES CON LA AYUDA DE MEDIOS (18) PARA INCREMENTAR DE FORMA TRANSITORIA E INTERMITENTE LA PRESION EN EL CONDUCTO DE TRANSPORTE (14) DENTRO DE UNA ZONA SITUADA DE FORMA ADYACENTE A LA ABERTURA DE DESCARGA (17).
ES91905127T 1990-03-02 1991-02-27 Un dispositivo para aplicar una pasta de soldar, un pegamento o similar en parches sobre un sustrato. Expired - Lifetime ES2048590T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9000749A SE465756B (sv) 1990-03-02 1990-03-02 Anordning foer flaeckvis applicering av loedpasta, lim, e d, paa ett substrat

Publications (1)

Publication Number Publication Date
ES2048590T3 true ES2048590T3 (es) 1994-03-16

Family

ID=20378745

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91905127T Expired - Lifetime ES2048590T3 (es) 1990-03-02 1991-02-27 Un dispositivo para aplicar una pasta de soldar, un pegamento o similar en parches sobre un sustrato.

Country Status (10)

Country Link
US (1) US5338360A (es)
EP (1) EP0517767B1 (es)
JP (1) JP2939332B2 (es)
AT (1) ATE101071T1 (es)
CA (1) CA2077449A1 (es)
DE (1) DE69101143T2 (es)
ES (1) ES2048590T3 (es)
HK (1) HK113894A (es)
SE (1) SE465756B (es)
WO (1) WO1991012921A1 (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005063408A1 (es) * 2003-12-24 2005-07-14 Sanchez Renasco Jesus Máquina para adhesivar “in situ” cantoneras utilizables en la protección de bloques paletizados

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
DE4325143C1 (de) * 1993-07-27 1994-12-22 Itw Dynatec Gmbh Klebetechnik Auftragseinheit für Leim
DE9405332U1 (de) * 1994-03-29 1994-07-28 Siemens AG, 80333 München Düse zum dosierten Auftragen von Klebstofftropfen
DE4411569C1 (de) * 1994-04-02 1995-07-20 Itw Dynatec Gmbh Klebetechnik Auftragskopf zur dosierten Abgabe von strömenden Medien
DE19540237C1 (de) * 1995-10-19 1996-10-24 Montblanc Simplo Gmbh Vorrichtung zur Mikrodosierung von sedimentierenden Suspensionen oder Emulsionen in Gravurgräben eines Werkstücks, insbesondere eines Schreibgeräts
SE507519C2 (sv) * 1996-10-16 1998-06-15 Mydata Automation Ab Anordning för att anbringa ett visköst medium på ett underlag
FR2791280B1 (fr) * 1999-03-23 2001-04-13 Commissariat Energie Atomique Dispositif d'ejection de gouttes de liquide
KR20050008733A (ko) * 2002-05-24 2005-01-21 코닌클리케 필립스 일렉트로닉스 엔.브이. 캐리어에 의해 지지되는 구성요소를 기판 상의 원하는위치로 이전하기에 적합한 방법, 및 이를 위해 설계된디바이스
CN101267894B (zh) * 2005-11-10 2010-11-03 株式会社爱发科 涂布装置、分散液移动方法
JP2007208108A (ja) * 2006-02-03 2007-08-16 Tamura Seisakusho Co Ltd 材料供給装置及び方法
US7980197B2 (en) 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
KR101196284B1 (ko) 2012-09-18 2012-11-06 이동주 솔더 페이스트 공급장치
CN110899057B (zh) * 2019-12-13 2021-03-30 苏州迪泰奇自动化科技有限公司 一种基于往复运动进行定量点胶的智能点胶装置
CN111389671B (zh) * 2020-03-19 2021-04-23 宁波铂汉科技有限公司 一种电子元器件生产加工用刮胶装置
CN113878196B (zh) * 2021-11-03 2023-03-14 深圳市思创新精密科技有限公司 一种smt激光模板表面锡膏涂抹装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667877A (en) * 1985-08-15 1987-05-26 Carnegie-Mellon University Multi-orifice impulsed spray generator
DE3637631C1 (de) * 1986-11-05 1987-08-20 Philips Patentverwaltung Verfahren zum Aufbringen kleiner schmelzfluessiger,tropfenfoermiger Lotmengen aus einer Duese auf zu benetzende Flaechen und Vorrichtung zur Durchfuehrung des Verfahrens
SE8704685D0 (sv) * 1987-11-25 1987-11-25 Mytronic Ab Anordning for att med tvangsstyrd slangvolym snabbt legga ut pastor och lim
SE461822B (sv) * 1988-07-08 1990-03-26 Mydata Automation Ab Anordning foer att laegga ut pastor och lim i diskreta punkter, foeretraedesvis vid ytmontering av komponenter paa kretskort

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005063408A1 (es) * 2003-12-24 2005-07-14 Sanchez Renasco Jesus Máquina para adhesivar “in situ” cantoneras utilizables en la protección de bloques paletizados

Also Published As

Publication number Publication date
DE69101143T2 (de) 1994-05-11
JPH05505065A (ja) 1993-07-29
SE465756B (sv) 1991-10-28
WO1991012921A1 (en) 1991-09-05
ATE101071T1 (de) 1994-02-15
EP0517767B1 (en) 1994-02-02
EP0517767A1 (en) 1992-12-16
HK113894A (en) 1994-10-27
DE69101143D1 (de) 1994-03-17
CA2077449A1 (en) 1991-09-03
US5338360A (en) 1994-08-16
JP2939332B2 (ja) 1999-08-25
SE9000749L (sv) 1991-09-03

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