HK1129759A1 - Manufacturing method for rfid tags rfid - Google Patents

Manufacturing method for rfid tags rfid

Info

Publication number
HK1129759A1
HK1129759A1 HK09107035.3A HK09107035A HK1129759A1 HK 1129759 A1 HK1129759 A1 HK 1129759A1 HK 09107035 A HK09107035 A HK 09107035A HK 1129759 A1 HK1129759 A1 HK 1129759A1
Authority
HK
Hong Kong
Prior art keywords
rfid
manufacturing
tags
rfid tags
tags rfid
Prior art date
Application number
HK09107035.3A
Other languages
English (en)
Inventor
Noboru Fujimaki
Hiroshi Iinaga
Kiyoshi Koike
Original Assignee
Oki Printed Circuits Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Printed Circuits Co Ltd filed Critical Oki Printed Circuits Co Ltd
Publication of HK1129759A1 publication Critical patent/HK1129759A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
HK09107035.3A 2007-07-25 2009-07-31 Manufacturing method for rfid tags rfid HK1129759A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007193305A JP5155616B2 (ja) 2007-07-25 2007-07-25 Ｒｆｉｄタグ、ｒｆｉｄシステムおよびｒｆｉｄタグの製造方法

Publications (1)

Publication Number Publication Date
HK1129759A1 true HK1129759A1 (en) 2009-12-04

Family

ID=39684442

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09107035.3A HK1129759A1 (en) 2007-07-25 2009-07-31 Manufacturing method for rfid tags rfid

Country Status (6)

Country Link
US (1) US20090027204A1 (xx)
EP (1) EP2023276B1 (xx)
JP (1) JP5155616B2 (xx)
HK (1) HK1129759A1 (xx)
SG (1) SG149755A1 (xx)
TW (1) TW200905573A (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
WO2011113278A1 (zh) * 2010-03-19 2011-09-22 上海集成电路研发中心有限公司 一种多系统、多频段的rfid天线
US10026035B2 (en) * 2011-03-24 2018-07-17 Avery Dennison Retail Information Services, Llc RFID tag including a coating
US8994511B2 (en) * 2011-09-12 2015-03-31 The Boeing Company Electronic identification package
US9425122B2 (en) 2012-12-21 2016-08-23 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing the same
JP5624697B1 (ja) * 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
US9825209B2 (en) 2012-12-21 2017-11-21 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing the same
US9449944B2 (en) 2012-12-21 2016-09-20 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing same
KR102231101B1 (ko) * 2014-11-18 2021-03-23 삼성전기주식회사 소자 내장형 인쇄회로기판 및 그 제조방법

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3150575B2 (ja) * 1995-07-18 2001-03-26 沖電気工業株式会社 タグ装置及びその製造方法
US6027027A (en) * 1996-05-31 2000-02-22 Lucent Technologies Inc. Luggage tag assembly
JPH10193849A (ja) * 1996-12-27 1998-07-28 Rohm Co Ltd 回路チップ搭載カードおよび回路チップモジュール
WO1999026195A1 (fr) * 1997-11-14 1999-05-27 Toppan Printing Co., Ltd. Module ci composite et carte ci composite
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
JP4177509B2 (ja) * 1999-03-10 2008-11-05 株式会社東芝 無線情報記憶媒体及びその製造方法
JP2000332523A (ja) * 1999-05-24 2000-11-30 Hitachi Ltd 無線タグ、その製造方法及びその配置方法
DE10012967A1 (de) * 2000-03-16 2001-09-20 Andreas Plettner Transponder
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
DE102004011702B4 (de) * 2004-03-10 2006-02-16 Circle Smart Card Ag Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte
JP2006031336A (ja) * 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
US7253736B2 (en) * 2004-08-26 2007-08-07 Sdgi Holdings, Inc. RFID tag for instrument handles
JPWO2006049068A1 (ja) * 2004-11-08 2008-05-29 松下電器産業株式会社 アンテナ装置およびそれを用いた無線通信システム
US7863718B2 (en) * 2005-02-16 2011-01-04 Hitachi, Ltd. Electronic tag chip
WO2006112447A1 (ja) * 2005-04-18 2006-10-26 Hallys Corporation 電子部品及び、この電子部品の製造方法
WO2006118293A1 (en) * 2005-04-27 2006-11-09 Semiconductor Energy Laboratory Co., Ltd. Wireless chip
US7660145B2 (en) * 2005-07-01 2010-02-09 Semiconductor Energy Laboratory Co., Ltd. Storage device and semiconductor device
US7705841B2 (en) 2006-01-20 2010-04-27 Novatek Microelectronics Corp. Display system and method for embeddedly transmitting data signals, control signals, clock signals and setting signals
JP2009524226A (ja) * 2006-01-21 2009-06-25 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 有機半導体配合物を備える電子短チャネル装置
TWI431726B (zh) * 2006-06-01 2014-03-21 Semiconductor Energy Lab 非揮發性半導體記憶體裝置
US20080296567A1 (en) * 2007-06-04 2008-12-04 Irving Lyn M Method of making thin film transistors comprising zinc-oxide-based semiconductor materials
US7858970B2 (en) * 2007-06-29 2010-12-28 Eastman Kodak Company Heterocycloalkyl-substituted naphthalene-based tetracarboxylic diimide compounds as N-type semiconductor materials for thin film transistors

Also Published As

Publication number Publication date
SG149755A1 (en) 2009-02-27
JP5155616B2 (ja) 2013-03-06
JP2009031907A (ja) 2009-02-12
EP2023276A3 (en) 2009-08-12
EP2023276B1 (en) 2012-03-21
US20090027204A1 (en) 2009-01-29
EP2023276A2 (en) 2009-02-11
TW200905573A (en) 2009-02-01

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