HK1121714A1 - Equipment for manufacturing electronic component, and method for ; controlling equipment for manufacturing electronic component - Google Patents

Equipment for manufacturing electronic component, and method for ; controlling equipment for manufacturing electronic component

Info

Publication number
HK1121714A1
HK1121714A1 HK08113200.1A HK08113200A HK1121714A1 HK 1121714 A1 HK1121714 A1 HK 1121714A1 HK 08113200 A HK08113200 A HK 08113200A HK 1121714 A1 HK1121714 A1 HK 1121714A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
manufacturing electronic
equipment
controlling
controlling equipment
Prior art date
Application number
HK08113200.1A
Inventor
Hideo Minami
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of HK1121714A1 publication Critical patent/HK1121714A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B23P21/006—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed the conveying means comprising a rotating table

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Process Working Machines And Systems (AREA)
HK08113200.1A 2005-08-04 2008-12-04 Equipment for manufacturing electronic component, and method for ; controlling equipment for manufacturing electronic component HK1121714A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/014277 WO2007015300A1 (en) 2005-08-04 2005-08-04 Equipment for manufacturing electronic component, and method and program for controlling equipment for manufacturing electronic component

Publications (1)

Publication Number Publication Date
HK1121714A1 true HK1121714A1 (en) 2009-04-30

Family

ID=37708583

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08113200.1A HK1121714A1 (en) 2005-08-04 2008-12-04 Equipment for manufacturing electronic component, and method for ; controlling equipment for manufacturing electronic component

Country Status (5)

Country Link
JP (1) JP4057643B2 (en)
KR (1) KR100992655B1 (en)
CN (1) CN101267912B (en)
HK (1) HK1121714A1 (en)
WO (1) WO2007015300A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5051714B2 (en) * 2007-12-04 2012-10-17 上野精機株式会社 Holding means driving apparatus, control method thereof, and control program
JP5534294B2 (en) * 2008-12-02 2014-06-25 上野精機株式会社 Holding means driving apparatus, control method thereof, and control program
JP2010162653A (en) * 2009-01-16 2010-07-29 Tesetsuku:Kk Handling device and electronic component inspection system
JP2011014582A (en) * 2009-06-30 2011-01-20 Tesetsuku:Kk Electronic component carrier
JP2011014583A (en) * 2009-06-30 2011-01-20 Tesetsuku:Kk Electronic component transfer device
JP5674060B2 (en) * 2011-02-09 2015-02-25 上野精機株式会社 Electronic component transfer device and taping unit
CN102303207A (en) * 2011-08-18 2012-01-04 苏州安捷伦精密机械有限公司 Post-processing equipment for shock absorber
CN102873993A (en) * 2012-10-22 2013-01-16 江阴格朗瑞科技有限公司 Turntable type testing, printing and braiding all in one machine
CN103707061B (en) * 2013-12-19 2017-06-06 周俊雄 The automatic assembling of the magnet coil assembly of adjuster
CN103707064B (en) * 2014-01-02 2016-01-20 上海理工大学 Cylinder shape assembly automatic Composition streamline mechanism arrangement
JP6057303B2 (en) * 2014-06-04 2017-01-11 上野精機株式会社 Electronic component process processing apparatus, process processing method, and process processing program
CN104400418B (en) * 2014-09-26 2018-04-13 黄国峰 A kind of height of electromechanical equipment refines prosecutor method
JP5999795B1 (en) * 2015-12-11 2016-09-28 上野精機株式会社 Processing unit and electronic component transfer device
CN106455474A (en) * 2016-08-23 2017-02-22 中国电子科技集团公司第二研究所 Locating jig for full-automatic eutectic replacement machine of laser device during replacement of suction nozzle
CN106670803B (en) * 2017-02-27 2018-07-27 常熟市天银机电股份有限公司 The protector Automated assembly device of release function is extracted with protector pedestal
CN112222825B (en) * 2020-10-16 2022-06-24 浙江金麦特自动化系统有限公司 Assembly processing line and assembly process of left gear lever handle for automobile steering wheel

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797019B2 (en) * 1986-06-12 1995-10-18 松下電器産業株式会社 Illumination method and device for component recognition
CN1086328C (en) * 1996-06-13 2002-06-19 丰田自动车株式会社 Parts assembling equipment and process
JP2004182388A (en) * 2002-12-03 2004-07-02 Ueno Seiki Kk Driving controller for electronic part holding means, its method, and program for it
JP3927180B2 (en) * 2004-01-19 2007-06-06 上野精機株式会社 Semiconductor device manufacturing apparatus and manufacturing method

Also Published As

Publication number Publication date
JP4057643B2 (en) 2008-03-05
JPWO2007015300A1 (en) 2009-02-19
CN101267912B (en) 2010-05-12
CN101267912A (en) 2008-09-17
KR20080037067A (en) 2008-04-29
WO2007015300A1 (en) 2007-02-08
KR100992655B1 (en) 2010-11-05

Similar Documents

Publication Publication Date Title
HK1121714A1 (en) Equipment for manufacturing electronic component, and method for ; controlling equipment for manufacturing electronic component
EP2012352A4 (en) Electronic component, electronic component device using same, and method for manufacturing same
EP1772878A4 (en) Method for manufacturing electronic component, parent board and electronic component
EP1843391A4 (en) Stacked electronic component, electronic device and method for manufacturing stacked electronic component
EP1965447A4 (en) Laminated electronic component and method for manufacturing same
TWI373105B (en) Electronic component embedded substrate and method for manufacturing the same
EP1890302A4 (en) Ceramic electronic component and method for manufacturing same
EP2164311A4 (en) Circuit board and method for manufacturing the same
EP2217044A4 (en) Circuit board and method for manufacturing the same
EP2003735A4 (en) Terminal and method for producing the same
EP2360026A4 (en) Exterior component, manufacturing method thereof, and electronic equipment
EP1818979A4 (en) Electronic component and production method therefor
GB2441265B (en) Method for manufacturing a circuit board structure, and a circuit board structure
HK1113521A1 (en) Soft-start circuit and method therefor
EP1921904A4 (en) Ceramic electronic component and method for manufacturing the same
EP1835513A4 (en) Electronic device and method for manufacturing same
EP2084745A4 (en) Device, and method for manufacturing the same
EP1860691A4 (en) Electronic circuit and method for manufacturing same
EP2043120A4 (en) Keytop and method for manufacturing the same
EP2053462A4 (en) Electronic circuit device and method for fabricating the same
PL1779512T3 (en) Method for operating an electronic valve
EP2006906A4 (en) Electronic component and method for manufacturing same
EP1926138A4 (en) Device identifying method, device manufacturing method and electronic device
EP2182093A4 (en) Metal material, method for producing the same, and electrical electronic component using the same
HK1092956A1 (en) Translator circuit and method for forming the translator circuit

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180804