HK1087090A1 - Micromechanical or microoptoelectronic devices and support for the production thereof - Google Patents
Micromechanical or microoptoelectronic devices and support for the production thereofInfo
- Publication number
- HK1087090A1 HK1087090A1 HK06107278.2A HK06107278A HK1087090A1 HK 1087090 A1 HK1087090 A1 HK 1087090A1 HK 06107278 A HK06107278 A HK 06107278A HK 1087090 A1 HK1087090 A1 HK 1087090A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- micromechanical
- production
- support
- microoptoelectronic
- devices
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000069A ITMI20030069A1 (it) | 2003-01-17 | 2003-01-17 | Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato. |
PCT/IT2003/000857 WO2004065289A2 (fr) | 2003-01-17 | 2003-12-24 | Dispositifs micro-mecaniques ou micro-optico electroniques avec depot de materiau de degazage, chauffage integre, et support de production associe |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1087090A1 true HK1087090A1 (en) | 2006-10-06 |
Family
ID=32750478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06107278.2A HK1087090A1 (en) | 2003-01-17 | 2006-06-28 | Micromechanical or microoptoelectronic devices and support for the production thereof |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP1592643A2 (fr) |
JP (1) | JP2006513046A (fr) |
KR (1) | KR20050092426A (fr) |
CN (1) | CN100453442C (fr) |
AU (1) | AU2003295223A1 (fr) |
CA (1) | CA2511836A1 (fr) |
HK (1) | HK1087090A1 (fr) |
IT (1) | ITMI20030069A1 (fr) |
MY (1) | MY157923A (fr) |
NO (1) | NO20053804L (fr) |
TW (1) | TW200500291A (fr) |
WO (1) | WO2004065289A2 (fr) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005001449B3 (de) * | 2005-01-12 | 2006-07-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Erzeugen eines vorgegebenen Innendrucks in einem Hohlraum eines Halbleiterbauelements |
ITMI20052343A1 (it) * | 2005-12-06 | 2007-06-07 | Getters Spa | Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti |
FR2898597B1 (fr) | 2006-03-16 | 2008-09-19 | Commissariat Energie Atomique | Encapsulation dans une cavite hermetique d'un compose microelectronique, notamment d'un mems |
FR2903678B1 (fr) | 2006-07-13 | 2008-10-24 | Commissariat Energie Atomique | Microcomposant encapsule equipe d'au moins un getter |
US7402905B2 (en) * | 2006-08-07 | 2008-07-22 | Honeywell International Inc. | Methods of fabrication of wafer-level vacuum packaged devices |
ITMI20070301A1 (it) | 2007-02-16 | 2008-08-17 | Getters Spa | Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel |
FR2933389B1 (fr) * | 2008-07-01 | 2010-10-29 | Commissariat Energie Atomique | Structure a base d'un materiau getter suspendu |
JP2010251702A (ja) * | 2009-03-27 | 2010-11-04 | Kyocera Corp | 電子部品、パッケージおよび赤外線センサ |
FR2956521B1 (fr) * | 2010-02-16 | 2012-08-17 | Thales Sa | Dispositif comprenant des composants electriques, electroniques, electromecaniques ou electro-optiques, a sensibilite reduite a faible debit de dose |
US9491802B2 (en) | 2012-02-17 | 2016-11-08 | Honeywell International Inc. | On-chip alkali dispenser |
EP2736071B8 (fr) | 2012-11-22 | 2017-04-19 | Tronic's Microsystems S.A. | Emballage de niveau de tranche avec un dégazeur |
JP6193480B2 (ja) | 2013-05-24 | 2017-09-06 | スナップトラック・インコーポレーテッド | 微小電気機械システムデバイスパッケージおよび微小電気機械システムデバイスパッケージを製造するための方法 |
EP2813465B1 (fr) | 2013-06-12 | 2020-01-15 | Tronic's Microsystems | Dispositif MEMS avec une couche d'absorption |
FR3008965B1 (fr) * | 2013-07-26 | 2017-03-03 | Commissariat Energie Atomique | Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter |
CN104743502A (zh) * | 2013-12-31 | 2015-07-01 | 北京有色金属研究总院 | 一种具有复合吸气剂层的mems组件及其制备方法 |
JP2017224704A (ja) | 2016-06-15 | 2017-12-21 | セイコーエプソン株式会社 | 真空パッケージ、電子デバイス、電子機器及び移動体 |
CN109173690B (zh) * | 2018-09-20 | 2020-10-09 | 内蒙古科技大学 | 一种用于金属材料热处理中的空气消耗剂 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5734226A (en) * | 1992-08-12 | 1998-03-31 | Micron Technology, Inc. | Wire-bonded getters useful in evacuated displays |
US5610438A (en) * | 1995-03-08 | 1997-03-11 | Texas Instruments Incorporated | Micro-mechanical device with non-evaporable getter |
US5837935A (en) * | 1996-02-26 | 1998-11-17 | Ford Motor Company | Hermetic seal for an electronic component having a secondary chamber |
SE9700612D0 (sv) * | 1997-02-20 | 1997-02-20 | Cecap Ab | Sensorelement med integrerat referenstryck |
US6992375B2 (en) * | 2000-11-30 | 2006-01-31 | Texas Instruments Incorporated | Anchor for device package |
-
2003
- 2003-01-17 IT IT000069A patent/ITMI20030069A1/it unknown
- 2003-12-24 JP JP2004567099A patent/JP2006513046A/ja active Pending
- 2003-12-24 WO PCT/IT2003/000857 patent/WO2004065289A2/fr active Application Filing
- 2003-12-24 KR KR1020057013228A patent/KR20050092426A/ko not_active Application Discontinuation
- 2003-12-24 AU AU2003295223A patent/AU2003295223A1/en not_active Abandoned
- 2003-12-24 CN CNB200380108858XA patent/CN100453442C/zh not_active Expired - Fee Related
- 2003-12-24 CA CA002511836A patent/CA2511836A1/fr not_active Abandoned
- 2003-12-24 EP EP03786227A patent/EP1592643A2/fr not_active Withdrawn
-
2004
- 2004-01-07 TW TW093100361A patent/TW200500291A/zh unknown
- 2004-01-15 MY MYPI20040115A patent/MY157923A/en unknown
-
2005
- 2005-08-12 NO NO20053804A patent/NO20053804L/no unknown
-
2006
- 2006-06-28 HK HK06107278.2A patent/HK1087090A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2511836A1 (fr) | 2004-08-05 |
TW200500291A (en) | 2005-01-01 |
EP1592643A2 (fr) | 2005-11-09 |
ITMI20030069A1 (it) | 2004-07-18 |
NO20053804L (no) | 2005-08-12 |
CN1738765A (zh) | 2006-02-22 |
AU2003295223A1 (en) | 2004-08-13 |
KR20050092426A (ko) | 2005-09-21 |
WO2004065289A3 (fr) | 2005-01-06 |
JP2006513046A (ja) | 2006-04-20 |
WO2004065289A2 (fr) | 2004-08-05 |
MY157923A (en) | 2016-08-15 |
CN100453442C (zh) | 2009-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20121224 |