HK1082638A1 - Heat sink having folded fin heat exchanger core - Google Patents

Heat sink having folded fin heat exchanger core

Info

Publication number
HK1082638A1
HK1082638A1 HK06102623A HK06102623A HK1082638A1 HK 1082638 A1 HK1082638 A1 HK 1082638A1 HK 06102623 A HK06102623 A HK 06102623A HK 06102623 A HK06102623 A HK 06102623A HK 1082638 A1 HK1082638 A1 HK 1082638A1
Authority
HK
Hong Kong
Prior art keywords
exchanger core
heat exchanger
folded fin
heat sink
fin heat
Prior art date
Application number
HK06102623A
Other languages
English (en)
Inventor
Taban Vahid
Original Assignee
Tandis Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tandis Inc filed Critical Tandis Inc
Publication of HK1082638A1 publication Critical patent/HK1082638A1/xx

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK06102623A 2002-08-28 2006-02-28 Heat sink having folded fin heat exchanger core HK1082638A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/228,565 US6575229B1 (en) 2002-08-28 2002-08-28 Heat sink having folded fin heat exchanger core
PCT/US2003/026061 WO2004021756A1 (en) 2002-08-28 2003-08-19 Heat sink having folded fin heat exchanger core

Publications (1)

Publication Number Publication Date
HK1082638A1 true HK1082638A1 (en) 2006-06-09

Family

ID=22857685

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06102623A HK1082638A1 (en) 2002-08-28 2006-02-28 Heat sink having folded fin heat exchanger core

Country Status (11)

Country Link
US (1) US6575229B1 (ko)
EP (1) EP1547456A4 (ko)
JP (1) JP2005537666A (ko)
KR (1) KR20050059147A (ko)
CN (1) CN100347850C (ko)
AU (1) AU2003258300A1 (ko)
CA (1) CA2496042A1 (ko)
HK (1) HK1082638A1 (ko)
MX (1) MXPA05002291A (ko)
TW (1) TWI233011B (ko)
WO (1) WO2004021756A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7088582B2 (en) * 2004-01-22 2006-08-08 Kocam International Co., Ltd. Heat-dissipating device
TWI289648B (en) * 2005-07-07 2007-11-11 Ama Precision Inc Heat sink structure
US20100282443A1 (en) * 2007-12-27 2010-11-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
JP5100524B2 (ja) * 2008-06-17 2012-12-19 古河電気工業株式会社 ファン付ヒートシンク
TWM358337U (en) * 2008-11-18 2009-06-01 Asia Vital Components Co Ltd Structure of heat sink fin assembly and its radiator and cooling module
TWI410601B (zh) * 2009-06-26 2013-10-01 Cpumate Inc A large area of ​​cooling fins, and a radiator with the fins
US8375584B2 (en) * 2009-07-29 2013-02-19 Cpumate Inc Method for manufacturing large-area heat sink having heat-dissipating fins
US8325480B2 (en) * 2010-05-20 2012-12-04 International Business Machines Corporation Heat sink for distributing a thermal load
CN102692979A (zh) * 2011-03-21 2012-09-26 鸿富锦精密工业（深圳）有限公司 散热装置
US10986756B2 (en) * 2017-12-28 2021-04-20 Hughes Network Systems Llc Cooling apparatus for an electrical component
DE102018101453A1 (de) * 2018-01-23 2019-07-25 Borgwarner Ludwigsburg Gmbh Heizvorrichtung und Verfahren zum Herstellung eines Heizstabes
CN111212544A (zh) * 2018-11-21 2020-05-29 英业达科技有限公司 电子装置
US11523539B2 (en) * 2019-10-07 2022-12-06 Nvidia Corporation Shroud for an integrated circuit heat exchanger
CN113266541B (zh) * 2021-05-19 2022-05-31 上海芯物科技有限公司 一种热驱动微型气体泵送器件及泵送器件加工方法
CN115464874A (zh) * 2022-08-29 2022-12-13 黄山学院 3d打印喷头、3d打印喷头系统及3d打印机
CN115740987A (zh) * 2022-12-06 2023-03-07 东方电气集团东方汽轮机有限公司 一种用于燃机高精度翅形薄壁异形件制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777560A (en) * 1987-09-02 1988-10-11 Microelectronics And Computer Technology Corporation Gas heat exchanger
JPH0636632Y2 (ja) * 1989-09-19 1994-09-21 松下電器産業株式会社 プリント基板保持装置
US5706169A (en) * 1996-05-15 1998-01-06 Yeh; Robin Cooling apparatus for a computer central processing unit
EP0809287A1 (en) * 1996-05-22 1997-11-26 Jean Amigo Heat dissipation device for an integrated circuit
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
US6125921A (en) * 1999-03-16 2000-10-03 Chaun-Choung Industrial Corp. Radiator
JP3996338B2 (ja) * 2000-10-19 2007-10-24 日本電産株式会社 ファン冷却装置
US20020109970A1 (en) * 2000-12-18 2002-08-15 Samsung Electro-Mechanics Co., Ltd. Heat sink for cooling electronic chip
US6826050B2 (en) * 2000-12-27 2004-11-30 Fujitsu Limited Heat sink and electronic device with heat sink
US6401810B1 (en) * 2001-08-16 2002-06-11 Chaun-Choung Technology Corp. Retaining structure of heat-radiating fins

Also Published As

Publication number Publication date
KR20050059147A (ko) 2005-06-17
TW200416520A (en) 2004-09-01
WO2004021756A1 (en) 2004-03-11
CN1679384A (zh) 2005-10-05
EP1547456A4 (en) 2007-11-07
CA2496042A1 (en) 2004-03-11
AU2003258300A1 (en) 2004-03-19
US6575229B1 (en) 2003-06-10
CN100347850C (zh) 2007-11-07
MXPA05002291A (es) 2005-08-18
TWI233011B (en) 2005-05-21
EP1547456A1 (en) 2005-06-29
JP2005537666A (ja) 2005-12-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110819