HK1070142A1 - Radiation-curable resin composition and rapid prototyping process using the same - Google Patents

Radiation-curable resin composition and rapid prototyping process using the same

Info

Publication number
HK1070142A1
HK1070142A1 HK05102611A HK05102611A HK1070142A1 HK 1070142 A1 HK1070142 A1 HK 1070142A1 HK 05102611 A HK05102611 A HK 05102611A HK 05102611 A HK05102611 A HK 05102611A HK 1070142 A1 HK1070142 A1 HK 1070142A1
Authority
HK
Hong Kong
Prior art keywords
radiation
resin composition
same
curable resin
rapid prototyping
Prior art date
Application number
HK05102611A
Other languages
English (en)
Inventor
John Alan Lawton
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Publication of HK1070142A1 publication Critical patent/HK1070142A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
HK05102611A 2001-06-21 2005-03-29 Radiation-curable resin composition and rapid prototyping process using the same HK1070142A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29947001P 2001-06-21 2001-06-21
PCT/NL2002/000408 WO2003001295A1 (en) 2001-06-21 2002-06-20 Radiation-curable resin composition and rapid prototyping process using the same

Publications (1)

Publication Number Publication Date
HK1070142A1 true HK1070142A1 (en) 2005-06-10

Family

ID=23154931

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05102611A HK1070142A1 (en) 2001-06-21 2005-03-29 Radiation-curable resin composition and rapid prototyping process using the same

Country Status (7)

Country Link
US (1) US6811937B2 (xx)
EP (1) EP1397725B1 (xx)
JP (1) JP2004530773A (xx)
KR (1) KR20040030694A (xx)
CN (1) CN1295562C (xx)
HK (1) HK1070142A1 (xx)
WO (1) WO2003001295A1 (xx)

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US7232850B2 (en) * 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
WO2005045523A1 (en) * 2003-11-06 2005-05-19 Huntsman Advanced Materials (Switzerland) Gmbh Photocurable composition for producing cured articles having high clarity and improved mechanical properties
US7704643B2 (en) * 2005-02-28 2010-04-27 Inphase Technologies, Inc. Holographic recording medium with control of photopolymerization and dark reactions
CA2620714A1 (en) * 2005-09-13 2007-03-22 Huntsman Advanced Materials (Switzerland) Gmbh Photocurable compositions for preparing abs-like articles
US20070092733A1 (en) * 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
US20090004579A1 (en) * 2007-06-27 2009-01-01 Dsm Ip Assets B.V. Clear and colorless three-dimensional articles made via stereolithography and method of making said articles
US8377623B2 (en) * 2007-11-27 2013-02-19 3D Systems, Inc. Photocurable resin composition for producing three dimensional articles having high clarity
EP2151214B1 (de) * 2008-07-30 2013-01-23 Ivoclar Vivadent AG Lichthärtende Schlicker für die stereolithographische Herstellung von Dentalkeramiken
JP5430345B2 (ja) 2009-10-26 2014-02-26 Ｊｓｒ株式会社 光学的立体造形用放射線硬化性液状樹脂組成物及びそれを光硬化させて得られる立体造形物
AU2011207304B2 (en) * 2010-01-22 2014-07-17 Stratasys, Inc. Liquid radiation curable resins capable of curing into layers with selective visual effects and methods for the use thereof
JP6348702B2 (ja) * 2013-11-07 2018-06-27 シーメット株式会社 光学的立体造形用樹脂組成物
TW201518485A (zh) * 2013-11-08 2015-05-16 Sicpa Holding Sa 以手性液晶前驅物及修飾樹脂爲基礎的複合標記
CN103755889A (zh) * 2014-01-10 2014-04-30 上海那恒新材料有限公司 可发光的高精度三维成型光敏树脂组合物
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
JP6545261B2 (ja) 2014-10-17 2019-07-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN108290267B (zh) 2015-10-30 2021-04-20 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11602412B2 (en) 2016-12-23 2023-03-14 3M Innovative Properties Company Printable compositions including polymeric and polymerizable components, articles, and methods of making articles therefrom
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
CN108976352A (zh) * 2017-06-05 2018-12-11 惠展电子材料（上海）有限公司 一种基于丙烯酸树脂的3d打印光固化组合物
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
CN107513309B (zh) * 2017-08-01 2018-10-30 珠海赛纳打印科技股份有限公司 三维成型用光固化透明墨水组合物及其制备方法和应用
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
TWI692502B (zh) * 2017-12-29 2020-05-01 法商阿科瑪法國公司 可固化組成物
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CA3145159A1 (en) 2020-04-24 2021-10-28 Illumina Cambridge Limited Flow cells
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

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Also Published As

Publication number Publication date
KR20040030694A (ko) 2004-04-09
WO2003001295A1 (en) 2003-01-03
JP2004530773A (ja) 2004-10-07
EP1397725A1 (en) 2004-03-17
US20030104313A1 (en) 2003-06-05
CN1543590A (zh) 2004-11-03
EP1397725B1 (en) 2017-12-20
US6811937B2 (en) 2004-11-02
CN1295562C (zh) 2007-01-17

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110620