HK106497A - Solid state image pickup device - Google Patents

Solid state image pickup device

Info

Publication number
HK106497A
HK106497A HK106497A HK106497A HK106497A HK 106497 A HK106497 A HK 106497A HK 106497 A HK106497 A HK 106497A HK 106497 A HK106497 A HK 106497A HK 106497 A HK106497 A HK 106497A
Authority
HK
Hong Kong
Prior art keywords
image pickup
solid state
pickup device
state image
transparent substrate
Prior art date
Application number
HK106497A
Other languages
English (en)
Inventor
Shigeo Seiko Epson Corporation Toda
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63205542A external-priority patent/JPH0254580A/ja
Priority claimed from JP63214452A external-priority patent/JPH0263167A/ja
Priority claimed from JP63214443A external-priority patent/JPH0263166A/ja
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of HK106497A publication Critical patent/HK106497A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14825—Linear CCD imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
HK106497A 1988-08-18 1997-06-26 Solid state image pickup device HK106497A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63205542A JPH0254580A (ja) 1988-08-18 1988-08-18 イメージセンサ
JP63214452A JPH0263167A (ja) 1988-08-29 1988-08-29 イメージセンサ
JP63214443A JPH0263166A (ja) 1988-08-29 1988-08-29 イメージセンサ

Publications (1)

Publication Number Publication Date
HK106497A true HK106497A (en) 1997-08-22

Family

ID=27328514

Family Applications (1)

Application Number Title Priority Date Filing Date
HK106497A HK106497A (en) 1988-08-18 1997-06-26 Solid state image pickup device

Country Status (4)

Country Link
US (1) US5068713A (de)
EP (1) EP0355522B1 (de)
DE (1) DE68911420T2 (de)
HK (1) HK106497A (de)

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JP2710174B2 (ja) * 1991-06-27 1998-02-10 日本電気株式会社 一次元イメージセンサ
US5434524A (en) * 1992-09-16 1995-07-18 International Business Machines Corporation Method of clocking integrated circuit chips
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JP3805031B2 (ja) 1995-10-20 2006-08-02 キヤノン株式会社 光電変換装置
DE19616969A1 (de) * 1996-04-27 1997-10-30 Bosch Gmbh Robert Optische Baugruppe zur Ankopplung eines Lichtwellenleiters und Verfahren zur Herstellung derselben
US5962810A (en) * 1997-09-09 1999-10-05 Amkor Technology, Inc. Integrated circuit package employing a transparent encapsulant
JPH1197656A (ja) * 1997-09-22 1999-04-09 Fuji Electric Co Ltd 半導体光センサデバイス
JP3400340B2 (ja) * 1998-02-20 2003-04-28 株式会社新川 フリップチップボンディング方法及び装置
DE19812008A1 (de) * 1998-03-19 1999-09-23 Heidenhain Gmbh Dr Johannes Optoelektronische Bauelementanordnung
DE19942470B4 (de) * 1998-09-08 2013-04-11 Fujitsu Ltd. Optisches Halbeitermodul und Verfahren zum Herstellen eines optischen Halbleitermoduls
US6588949B1 (en) 1998-12-30 2003-07-08 Honeywell Inc. Method and apparatus for hermetically sealing photonic devices
US6483101B1 (en) 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
US6483030B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Snap lid image sensor package
US6792178B1 (en) 2000-01-12 2004-09-14 Finisar Corporation Fiber optic header with integrated power monitor
US6518659B1 (en) 2000-05-08 2003-02-11 Amkor Technology, Inc. Stackable package having a cavity and a lid for an electronic device
US6424031B1 (en) 2000-05-08 2002-07-23 Amkor Technology, Inc. Stackable package with heat sink
US6667544B1 (en) 2000-06-30 2003-12-23 Amkor Technology, Inc. Stackable package having clips for fastening package and tool for opening clips
US7059040B1 (en) 2001-01-16 2006-06-13 Amkor Technology, Inc. Optical module with lens integral holder fabrication method
KR100401020B1 (ko) 2001-03-09 2003-10-08 앰코 테크놀로지 코리아 주식회사 반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지
US6906403B2 (en) * 2002-06-04 2005-06-14 Micron Technology, Inc. Sealed electronic device packages with transparent coverings
US7146106B2 (en) * 2002-08-23 2006-12-05 Amkor Technology, Inc. Optic semiconductor module and manufacturing method
ITMI20022467A1 (it) * 2002-11-20 2004-05-21 St Microelectronics Srl Processo per realizzare un transistore di selezione di byte per
JP4203374B2 (ja) * 2003-08-06 2008-12-24 豊田合成株式会社 発光装置
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US20060261458A1 (en) * 2003-11-12 2006-11-23 Amkor Technology, Inc. Semiconductor package and manufacturing method thereof
US7359579B1 (en) 2004-10-08 2008-04-15 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070210246A1 (en) * 2005-04-14 2007-09-13 Amkor Technology, Inc. Stacked image sensor optical module and fabrication method
US7227236B1 (en) 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070272827A1 (en) * 2005-04-27 2007-11-29 Amkor Technology, Inc. Image sensor package having mount holder attached to image sensor die
US7576401B1 (en) 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
US20080237824A1 (en) * 2006-02-17 2008-10-02 Amkor Technology, Inc. Stacked electronic component package having single-sided film spacer
US7675180B1 (en) 2006-02-17 2010-03-09 Amkor Technology, Inc. Stacked electronic component package having film-on-wire spacer
US7633144B1 (en) 2006-05-24 2009-12-15 Amkor Technology, Inc. Semiconductor package
CN101499446B (zh) * 2009-02-26 2013-10-16 光宝电子(广州)有限公司 导线架料片、封装结构以及发光二极管封装结构
DE102009042479A1 (de) * 2009-09-24 2011-03-31 Msg Lithoglas Ag Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug

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JPS57164585A (en) * 1981-04-02 1982-10-09 Toshiba Corp Photosemiconductor device
JPS57190455A (en) * 1981-05-19 1982-11-24 Nippon Telegr & Teleph Corp <Ntt> Adhesion type image sensor
JPS5986363A (ja) * 1982-11-09 1984-05-18 Toshiba Corp 密着センサ用レンズ調整装置
JPS59167037A (ja) * 1983-03-14 1984-09-20 Oki Electric Ind Co Ltd 半導体装置
JPS6062278A (ja) * 1983-09-14 1985-04-10 Toshiba Corp イメ−ジセンサ
JPS60123059A (ja) * 1983-12-08 1985-07-01 Toshiba Corp 密着型カラ−イメ−ジセンサ
JPS6132469A (ja) * 1984-07-24 1986-02-15 Toppan Printing Co Ltd カラー固体撮像素子の製造方法
JPS61126861A (ja) * 1984-11-22 1986-06-14 Toshiba Corp 密着型イメ−ジセンサ
JPS61135280A (ja) * 1984-12-06 1986-06-23 Toshiba Corp 三次元撮像素子
JPS61234161A (ja) * 1985-04-10 1986-10-18 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサ
JPS62104044A (ja) * 1985-10-30 1987-05-14 Nec Corp パツシベ−シヨン方法
JPS62241358A (ja) * 1986-04-14 1987-10-22 Hitachi Ltd ワンタイムプログラム型半導体装置
US4877306A (en) * 1987-09-30 1989-10-31 Corning Glass Works Coated optical waveguide fibers

Also Published As

Publication number Publication date
US5068713A (en) 1991-11-26
EP0355522B1 (de) 1993-12-15
DE68911420T2 (de) 1994-05-11
EP0355522A3 (en) 1990-08-22
EP0355522A2 (de) 1990-02-28
DE68911420D1 (de) 1994-01-27

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080803