HK1050376A1 - Flame-retardant polyamide resin composition, and electrical parts employing the same - Google Patents

Flame-retardant polyamide resin composition, and electrical parts employing the same

Info

Publication number
HK1050376A1
HK1050376A1 HK03102448A HK03102448A HK1050376A1 HK 1050376 A1 HK1050376 A1 HK 1050376A1 HK 03102448 A HK03102448 A HK 03102448A HK 03102448 A HK03102448 A HK 03102448A HK 1050376 A1 HK1050376 A1 HK 1050376A1
Authority
HK
Hong Kong
Prior art keywords
flame
resin composition
same
polyamide resin
electrical parts
Prior art date
Application number
HK03102448A
Other languages
English (en)
Inventor
Toshihiro Arai
Tadashi Takeda
Katsuo Kobori
Osamu Hamazoe
Original Assignee
Ec Showa Denko K K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ec Showa Denko K K filed Critical Ec Showa Denko K K
Publication of HK1050376A1 publication Critical patent/HK1050376A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • C08K5/3492Triazines
    • C08K5/34928Salts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/5205Salts of P-acids with N-bases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fireproofing Substances (AREA)
HK03102448A 1999-11-19 2003-04-07 Flame-retardant polyamide resin composition, and electrical parts employing the same HK1050376A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32961899A JP4718659B2 (ja) 1999-11-19 1999-11-19 難燃性ポリアミド系樹脂組成物およびそれを用いた電気部品
PCT/JP2000/008174 WO2001038439A1 (en) 1999-11-19 2000-11-20 Flame-retardant polyamide resin composition, and electrical parts employing the same

Publications (1)

Publication Number Publication Date
HK1050376A1 true HK1050376A1 (en) 2003-06-20

Family

ID=18223376

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03102448A HK1050376A1 (en) 1999-11-19 2003-04-07 Flame-retardant polyamide resin composition, and electrical parts employing the same

Country Status (6)

Country Link
US (1) US6815477B1 (xx)
EP (1) EP1248818B1 (xx)
JP (1) JP4718659B2 (xx)
DE (1) DE60029009T2 (xx)
HK (1) HK1050376A1 (xx)
WO (1) WO2001038439A1 (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007138743A1 (ja) * 2006-05-30 2007-12-06 Mitsubishi Engineering-Plastics Corporation ポリアミド樹脂組成物および成形品
DE102012004357B4 (de) 2012-03-07 2016-04-07 Trovotech Gmbh Flammschutzmittelzusammensetzung für thermoplastische Polymere bestehend aus porösem, amorphen Glaspulver und Melamincyanurat, deren Verwendung sowie damit ausgerüstete Formkörper, Fasern und Folien
WO2015042560A1 (en) * 2013-09-23 2015-03-26 Sabic Global Technologies B.V. Nitrogen containing polymer compositions having reduced combustion toxicity
CN104004352A (zh) * 2014-01-15 2014-08-27 温州聚兴塑化有限公司 一种改性尼龙材料及其制备方法
CN104004347B (zh) * 2014-05-28 2016-08-24 广东银禧科技股份有限公司 一种pa6复合材料及其制备方法
CN104086985A (zh) * 2014-06-09 2014-10-08 江苏欣润塑胶有限公司 一种阻燃塑胶
CN104004350B (zh) * 2014-06-20 2017-02-15 江苏兆鋆新材料股份有限公司 一种玻纤增强无卤阻燃聚酰胺6复合材料及其制备方法
DE102015015710B4 (de) 2015-12-07 2018-07-26 Trovotech Gmbh Komplexe halogenfreie feste Flammschutzmittelzusammensetzung, Verfahren zu deren Herstellung sowie Polymerformmassen und deren Verwendung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349054A (en) * 1976-10-18 1978-05-04 Asahi Chem Ind Co Ltd Thermosetting composition
JPH07138473A (ja) * 1993-11-19 1995-05-30 Mitsubishi Chem Corp ポリアミド樹脂組成物
AT405288B (de) 1994-09-21 1999-06-25 Chemie Linz Gmbh Flammfeste, glasfaserverstärkte polyamidharzmasse mit melamin- oder melem-phosphorsäure-umsetzungsprodukten als flammhemmer
JP3421155B2 (ja) * 1994-12-14 2003-06-30 三菱エンジニアリングプラスチックス株式会社 難燃性ポリアミド樹脂組成物
JP4072242B2 (ja) * 1997-05-26 2008-04-09 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物
EP0881264A3 (en) * 1997-05-26 1999-02-24 Mitsubishi Engineering-Plastics Corporation Resin composition comprising polyamide resin
JPH11106646A (ja) * 1997-10-07 1999-04-20 Mitsubishi Eng Plast Corp ポリアミド樹脂組成物
JP2000178459A (ja) * 1998-10-08 2000-06-27 Polyplastics Co 難燃性樹脂組成物
JP4260284B2 (ja) * 1999-05-19 2009-04-30 ポリプラスチックス株式会社 難燃剤及び難燃性樹脂組成物
JP4278779B2 (ja) * 1999-06-03 2009-06-17 旭化成ケミカルズ株式会社 難燃性ポリアミド樹脂組成物

Also Published As

Publication number Publication date
EP1248818A1 (en) 2002-10-16
JP4718659B2 (ja) 2011-07-06
DE60029009T2 (de) 2007-01-11
JP2001146550A (ja) 2001-05-29
EP1248818B1 (en) 2006-06-21
US6815477B1 (en) 2004-11-09
DE60029009D1 (de) 2006-08-03
WO2001038439A1 (en) 2001-05-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20171120