HK1040877A1 - 組裝裝置 - Google Patents

組裝裝置

Info

Publication number
HK1040877A1
HK1040877A1 HK02100613.5A HK02100613A HK1040877A1 HK 1040877 A1 HK1040877 A1 HK 1040877A1 HK 02100613 A HK02100613 A HK 02100613A HK 1040877 A1 HK1040877 A1 HK 1040877A1
Authority
HK
Hong Kong
Prior art keywords
component
assembly
products
components
transport system
Prior art date
Application number
HK02100613.5A
Other languages
English (en)
Inventor
Feraric Johann
Waitl Gunter
Original Assignee
Simotec Gmbh
Osram Opto Semiconductors Gmbh & Co Ohg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8238763&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1040877(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Simotec Gmbh, Osram Opto Semiconductors Gmbh & Co Ohg filed Critical Simotec Gmbh
Publication of HK1040877A1 publication Critical patent/HK1040877A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
HK02100613.5A 1999-08-11 2002-01-25 組裝裝置 HK1040877A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99115834A EP1076357A1 (de) 1999-08-11 1999-08-11 Montagevorrichtung zur Herstellung microsystemtechnischer Produkte
PCT/EP2000/007838 WO2001013697A1 (de) 1999-08-11 2000-08-11 Montagevorrichtung

Publications (1)

Publication Number Publication Date
HK1040877A1 true HK1040877A1 (zh) 2002-06-21

Family

ID=8238763

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02100613.5A HK1040877A1 (zh) 1999-08-11 2002-01-25 組裝裝置

Country Status (9)

Country Link
US (2) US6574857B1 (zh)
EP (3) EP1076357A1 (zh)
JP (2) JP2003507898A (zh)
KR (1) KR20010075618A (zh)
CN (2) CN1191607C (zh)
AT (2) ATE307388T1 (zh)
DE (3) DE50009276D1 (zh)
HK (1) HK1040877A1 (zh)
WO (2) WO2001013409A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835040B2 (en) * 2001-11-09 2004-12-28 Neil Quiring Laser cutting plate conveyor
TW508644B (en) * 2001-11-19 2002-11-01 Advanced Semiconductor Eng Die bonding device
ITMI20040597A1 (it) * 2004-03-26 2004-06-26 Bavelloni Z Spa Apparecchiatura di carico e scarico di elementi lastriformi per macchine per lavorazioni su materiali in lastra
DE102004042355B4 (de) * 2004-09-01 2009-08-13 Siemens Ag Positioniervorrichtung
DE102007020779B3 (de) * 2007-05-03 2008-12-18 Siemens Ag Bestückautomat zum Bestücken von elektrischen und/oder optischen Bauteilen auf Substrate
DE102009043347B4 (de) * 2009-09-29 2014-05-15 Asm Assembly Systems Gmbh & Co. Kg Verfahren zur Erkennung einer Pipettenkonfiguration für Bestückvorgänge
DE102009048401A1 (de) * 2009-10-06 2011-04-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
EP2766943B1 (en) 2011-09-13 2017-01-04 Solvay Specialty Polymers Italy S.p.A. Electrode-forming composition
CN102674041B (zh) * 2012-04-24 2014-07-23 华中科技大学 一种片材真空拾放装置
CN102706378B (zh) * 2012-04-28 2015-05-27 深圳光启高等理工研究院 一种超材料测试夹具装置
CN102962590B (zh) * 2012-11-27 2016-01-13 宁波金凤焊割机械制造有限公司 一种用于搭载激光器的支撑式龙门架
CN103399579B (zh) * 2013-08-14 2015-12-02 东南大学 一种led灯具组件自动定向整列系统
CN107251673B (zh) * 2015-02-12 2019-10-22 株式会社富士 元件供给装置
CN105496093B (zh) * 2016-01-19 2021-05-07 苏州復朗特精密电子科技有限公司 可自动夹取展示物的展示装置
US11282730B2 (en) 2019-08-02 2022-03-22 Rohinni, LLC Bridge apparatus for semiconductor die transfer
CN116544163B (zh) * 2023-07-04 2023-09-08 四川明泰微电子有限公司 一种引线框架输送装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4078302A (en) * 1976-11-08 1978-03-14 Wangco Incorporated Module board assembly fixture
JPS54111665A (en) * 1978-02-21 1979-09-01 Nippon Electric Co Compound positioning system
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
US4754545A (en) * 1986-05-16 1988-07-05 Western Digital Corporation Component handling machine
DE3623506A1 (de) * 1986-07-09 1988-01-28 Mannesmann Ag Fuehrung fuer einen industrieroboter
JPH0770875B2 (ja) * 1990-04-27 1995-07-31 ジューキ株式会社 チップ部品装着装置の装着ヘッド制御方法及びその装置
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
JPH066084A (ja) * 1992-06-19 1994-01-14 Olympus Optical Co Ltd 電子部品自動実装機
EP0582086B2 (en) * 1992-07-01 1999-01-13 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor
US5523591A (en) * 1995-01-25 1996-06-04 Eastman Kodak Company Assembly of led array and lens with engineered light output profile and method for making the assembly
BE1009814A5 (nl) * 1995-11-06 1997-08-05 Framatome Connectors Belgium Werkwijze en inrichting voor het aanbrengen van elektronische onderdelen in een plaat met gedrukte schakelingen.
US5739800A (en) * 1996-03-04 1998-04-14 Motorola Integrated electro-optical package with LED display chip and substrate with drivers and central opening
US5703394A (en) * 1996-06-10 1997-12-30 Motorola Integrated electro-optical package
JP3358461B2 (ja) * 1996-09-27 2002-12-16 松下電器産業株式会社 電子部品実装方法
JP3749585B2 (ja) 1997-01-17 2006-03-01 松下電器産業株式会社 部品のテーピング方法と装置
US6568069B1 (en) * 1997-02-24 2003-05-27 Siemens Aktiengesellschaft Apparatus for manufacture of electrical assemblies
JPH11121992A (ja) * 1997-10-08 1999-04-30 Fujitsu Ten Ltd 加工装置および電子回路素子の実装装置
JP4100741B2 (ja) * 1997-11-06 2008-06-11 松下電器産業株式会社 部品装着装置、及び方法
AU3292799A (en) * 1998-02-12 1999-08-30 Research Foundation Of State University Of New York, The Computer based semi-automatic focusing and assembly apparatus and method

Also Published As

Publication number Publication date
WO2001013697A1 (de) 2001-02-22
EP1118259B1 (de) 2005-01-19
CN1320273A (zh) 2001-10-31
EP1118104B1 (de) 2005-10-19
CN1191607C (zh) 2005-03-02
EP1076357A1 (de) 2001-02-14
EP1118104A1 (de) 2001-07-25
EP1118259A1 (de) 2001-07-25
DE50011373D1 (de) 2006-03-02
ATE307388T1 (de) 2005-11-15
CN1320359A (zh) 2001-10-31
WO2001013409A1 (de) 2001-02-22
JP2003507885A (ja) 2003-02-25
DE50009276D1 (de) 2005-02-24
JP2003507898A (ja) 2003-02-25
EP1118104B2 (de) 2009-11-25
US6574857B1 (en) 2003-06-10
ATE287632T1 (de) 2005-02-15
KR20010075618A (ko) 2001-08-09
US6560857B1 (en) 2003-05-13
DE20022198U1 (de) 2001-06-07

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