HK1038795A1 - Scan test machine for densely spaced test sites - Google Patents

Scan test machine for densely spaced test sites

Info

Publication number
HK1038795A1
HK1038795A1 HK01109061A HK01109061A HK1038795A1 HK 1038795 A1 HK1038795 A1 HK 1038795A1 HK 01109061 A HK01109061 A HK 01109061A HK 01109061 A HK01109061 A HK 01109061A HK 1038795 A1 HK1038795 A1 HK 1038795A1
Authority
HK
Hong Kong
Prior art keywords
densely spaced
test
sites
scan
machine
Prior art date
Application number
HK01109061A
Other languages
English (en)
Inventor
Mark A Swart
Original Assignee
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capital Formation Inc filed Critical Capital Formation Inc
Publication of HK1038795A1 publication Critical patent/HK1038795A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
HK01109061A 2000-02-02 2001-12-27 Scan test machine for densely spaced test sites HK1038795A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/496,878 US6268719B1 (en) 1998-09-23 2000-02-02 Printed circuit board test apparatus

Publications (1)

Publication Number Publication Date
HK1038795A1 true HK1038795A1 (en) 2002-03-28

Family

ID=23974557

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01109061A HK1038795A1 (en) 2000-02-02 2001-12-27 Scan test machine for densely spaced test sites

Country Status (6)

Country Link
US (1) US6268719B1 (xx)
EP (1) EP1122546B1 (xx)
JP (1) JP4216482B2 (xx)
DE (1) DE60134688D1 (xx)
HK (1) HK1038795A1 (xx)
TW (1) TW594031B (xx)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL124961A (en) * 1998-06-16 2006-10-05 Orbotech Ltd Contactless test method and system
US6788078B2 (en) * 2001-11-16 2004-09-07 Delaware Capital Formation, Inc. Apparatus for scan testing printed circuit boards
JP2004264035A (ja) * 2003-01-27 2004-09-24 Agilent Technol Inc プローブ装置及びそれを用いたディスプレイ基板の試験装置
EP1612571A4 (en) * 2003-04-04 2010-03-03 Advantest Corp CONNECTION UNIT, TEST HEAD AND TEST UNIT
GB0308550D0 (en) * 2003-04-10 2003-05-21 Barker Colin Improvements to an automatic test machine
US7224173B2 (en) * 2003-10-01 2007-05-29 Taiwan Semiconductor Manufacturing Co., Ltd. Electrical bias electrical test apparatus and method
US7227365B2 (en) * 2004-10-28 2007-06-05 Hewlett-Packard Development Company, L.P. Connector insertion apparatus for connecting a testing apparatus to a unit under test
US7301356B2 (en) * 2004-10-28 2007-11-27 Hewlett-Packard Development Company, L.P. Support for a receptacle block of a unit under test
US7463042B2 (en) * 2005-06-30 2008-12-09 Northrop Grumman Corporation Connector probing system
US7355417B1 (en) * 2005-09-20 2008-04-08 Emc Corporation Techniques for obtaining electromagnetic data from a circuit board
DE102006006255A1 (de) * 2006-02-10 2007-08-23 Atg Test Systems Gmbh Fingertester zum Prüfen von unbestückten Leiterplatten und Verfahren zum Prüfen unbestückter Leiterplatten mit einem Fingertester
US7443179B2 (en) * 2006-11-30 2008-10-28 Electro Scientific Industries, Inc. Zero motion contact actuation
DE102010023187A1 (de) * 2010-06-09 2011-12-15 Dtg International Gmbh Vorrichtung und Verfahren zum Untersuchen von Leiterplatten
US8742777B2 (en) 2010-12-29 2014-06-03 The Board Of Trustees Of The University Of Alabama For And On Behalf Of The University Of Alabama Method and system for testing an electric circuit
US9274643B2 (en) 2012-03-30 2016-03-01 Synaptics Incorporated Capacitive charge measurement
US10948534B2 (en) * 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
CN111836533B (zh) * 2019-04-15 2022-11-25 中兴通讯股份有限公司 一种叠放系统和方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61274278A (ja) 1985-05-30 1986-12-04 Nec Corp 基板の導通測定治具
JPS62285072A (ja) 1986-06-04 1987-12-10 Hitachi Ltd プリント基板の配線パタ−ン検査装置
US4771230A (en) * 1986-10-02 1988-09-13 Testamatic Corporation Electro-luminescent method and testing system for unpopulated printed circuit boards, ceramic substrates, and the like having both electrical and electro-optical read-out
JP2767593B2 (ja) 1988-11-11 1998-06-18 東京エレクトロン株式会社 プリント配線基板検査方法および検査装置
US4970461A (en) * 1989-06-26 1990-11-13 Lepage Andrew J Method and apparatus for non-contact opens/shorts testing of electrical circuits
US5032788A (en) * 1989-06-26 1991-07-16 Digital Equipment Corp. Test cell for non-contact opens/shorts testing of electrical circuits
JP2881860B2 (ja) 1989-11-09 1999-04-12 日本電気株式会社 フライング・プローブ・ヘッド
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5113133A (en) 1990-12-20 1992-05-12 Integri-Test Corporation Circuit board test probe
JPH04259862A (ja) 1991-02-15 1992-09-16 Fujitsu Ltd プリント基板試験装置
EP0508062B1 (de) * 1991-04-10 1995-07-19 atg test systems GmbH Verfahren und Vorrichtung zur Prüfung einer elektrischen Leiteranordnung
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
IL101063A (en) 1992-02-25 1995-03-30 Orbotech Ltd Verification and repair station for pcbs
US5202623A (en) * 1992-02-26 1993-04-13 Digital Equipment Corporation Laser-activated plasma chamber for non-contact testing
GB2265224B (en) 1992-03-20 1996-04-10 Centalic Tech Dev Ltd Testing apparatus
JPH0792227A (ja) 1993-09-24 1995-04-07 Toyota Motor Corp 回路基板の検査装置及び検査方法
US5508627A (en) * 1994-05-11 1996-04-16 Patterson; Joseph M. Photon assisted sub-tunneling electrical probe, probe tip, and probing method
JPH0815361A (ja) 1994-06-30 1996-01-19 Matsushita Electric Works Ltd プリント配線板の検査方法
GB9503953D0 (en) 1995-02-28 1995-04-19 Plessey Semiconductors Ltd An mcm-d probe tip
KR100197936B1 (ko) 1995-03-31 1999-06-15 전주범 카오디오의 회로기판 접점 청소장치
US5587664A (en) * 1995-07-12 1996-12-24 Exsight Ltd. Laser-induced metallic plasma for non-contact inspection
US5773988A (en) 1996-10-29 1998-06-30 Hewlett-Packard Company Standard- and limited-access hybrid test fixture
KR20010043017A (ko) * 1998-04-27 2001-05-25 야코브 레비 상호 연결된 회로망을 테스트하는 방법 및 장치

Also Published As

Publication number Publication date
EP1122546A3 (en) 2004-04-21
TW594031B (en) 2004-06-21
JP4216482B2 (ja) 2009-01-28
DE60134688D1 (de) 2008-08-21
JP2001272431A (ja) 2001-10-05
EP1122546B1 (en) 2008-07-09
US6268719B1 (en) 2001-07-31
EP1122546A2 (en) 2001-08-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120202