HK1028750A1 - Electrolytic in-process dressing apparatus - Google Patents

Electrolytic in-process dressing apparatus

Info

Publication number
HK1028750A1
HK1028750A1 HK00108189A HK00108189A HK1028750A1 HK 1028750 A1 HK1028750 A1 HK 1028750A1 HK 00108189 A HK00108189 A HK 00108189A HK 00108189 A HK00108189 A HK 00108189A HK 1028750 A1 HK1028750 A1 HK 1028750A1
Authority
HK
Hong Kong
Prior art keywords
electrolytic
dressing apparatus
process dressing
dressing
Prior art date
Application number
HK00108189A
Other languages
English (en)
Inventor
Hitoshi Ohmori
Original Assignee
Riken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riken filed Critical Riken
Publication of HK1028750A1 publication Critical patent/HK1028750A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/001—Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
HK00108189A 1999-04-14 2000-12-19 Electrolytic in-process dressing apparatus HK1028750A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11106920A JP2000296413A (ja) 1999-04-14 1999-04-14 卓上ｅｌｉｄ加工装置

Publications (1)

Publication Number Publication Date
HK1028750A1 true HK1028750A1 (en) 2001-03-02

Family

ID=14445869

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00108189A HK1028750A1 (en) 1999-04-14 2000-12-19 Electrolytic in-process dressing apparatus

Country Status (7)

Country Link
EP (1) EP1044767B1 (xx)
JP (1) JP2000296413A (xx)
KR (1) KR100561291B1 (xx)
CA (1) CA2305832A1 (xx)
DE (1) DE60036506T2 (xx)
HK (1) HK1028750A1 (xx)
SG (1) SG109419A1 (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112894585A (zh) * 2021-01-31 2021-06-04 重庆电子工程职业学院 一种集成电路板用覆铜板氧化膜处理装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4215228B2 (ja) * 1999-10-26 2009-01-28 独立行政法人理化学研究所 卓上４軸鏡面加工装置
JP2004322234A (ja) * 2003-04-22 2004-11-18 Fukuoka Prefecture 導電性砥石の加工装置及び加工方法
KR100574083B1 (ko) * 2004-05-31 2006-04-27 주식회사 대산정밀 3차원 마이크로 방전 가공 장치
US8162825B2 (en) 2005-02-15 2012-04-24 Olympus Corporation Endoscope
KR100972158B1 (ko) * 2008-05-13 2010-07-26 삼성중공업 주식회사 와이어 컨트롤을 이용한 자율이동장치의 와이어 고정장치
CN102229075B (zh) * 2011-05-16 2013-01-09 湘潭三峰数控机床有限公司 多拖板对称式数控坐标磨床
CN108436205B (zh) * 2018-03-07 2019-09-17 大连海事大学 一种电解加工气缸套表面微织构的装置及方法
CN112008167B (zh) * 2019-05-31 2022-03-15 中国石油大学(华东) 一种新型电弧增材与气中电火花电弧铣削减材复合制造装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236784A (en) * 1987-02-09 1993-08-17 Kabushiki Kaisha Sankyo Seiki Seisakusho Bearing material and plastic bearing
JPH01115534A (ja) * 1987-10-28 1989-05-08 Nissei Plastics Ind Co 複合加工機
JPH03287373A (ja) * 1990-04-04 1991-12-18 Hitachi Ltd ダイアモンド砥石の成形方法
DE69306049T2 (de) * 1992-06-19 1997-03-13 Rikagaku Kenkyusho Vorrichtung zum Schleifen von Spiegeloberfläche
JPH0760642A (ja) * 1993-08-30 1995-03-07 Rikagaku Kenkyusho 電解ドレッシング研削方法及び装置
JPH08276363A (ja) * 1995-04-10 1996-10-22 Olympus Optical Co Ltd 研削加工方法および装置
JPH10249689A (ja) * 1997-03-10 1998-09-22 Tokyo Seimitsu Co Ltd ウェーハ面取方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112894585A (zh) * 2021-01-31 2021-06-04 重庆电子工程职业学院 一种集成电路板用覆铜板氧化膜处理装置
CN112894585B (zh) * 2021-01-31 2022-02-08 重庆电子工程职业学院 一种集成电路板用覆铜板氧化膜处理装置

Also Published As

Publication number Publication date
KR20010020726A (ko) 2001-03-15
CA2305832A1 (en) 2000-10-14
DE60036506T2 (de) 2008-01-31
EP1044767A2 (en) 2000-10-18
JP2000296413A (ja) 2000-10-24
DE60036506D1 (de) 2007-11-08
KR100561291B1 (ko) 2006-03-15
SG109419A1 (en) 2005-03-30
EP1044767A3 (en) 2003-05-14
EP1044767B1 (en) 2007-09-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110413