HK1026067A1 - Chemical mechanical abrasive composition for use in semiconductor processing - Google Patents

Chemical mechanical abrasive composition for use in semiconductor processing

Info

Publication number
HK1026067A1
HK1026067A1 HK00105270A HK00105270A HK1026067A1 HK 1026067 A1 HK1026067 A1 HK 1026067A1 HK 00105270 A HK00105270 A HK 00105270A HK 00105270 A HK00105270 A HK 00105270A HK 1026067 A1 HK1026067 A1 HK 1026067A1
Authority
HK
Hong Kong
Prior art keywords
chemical mechanical
semiconductor processing
abrasive composition
mechanical abrasive
composition
Prior art date
Application number
HK00105270A
Other languages
English (en)
Inventor
Tsung-Ho Lee
Tsui-Ping Yeh
Original Assignee
Eternal Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eternal Chemical Co Ltd filed Critical Eternal Chemical Co Ltd
Publication of HK1026067A1 publication Critical patent/HK1026067A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
HK00105270A 1998-08-31 2000-08-22 Chemical mechanical abrasive composition for use in semiconductor processing HK1026067A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 98117452 CN1126152C (zh) 1998-08-31 1998-08-31 半导体制程用的化学机械研磨组合物

Publications (1)

Publication Number Publication Date
HK1026067A1 true HK1026067A1 (en) 2000-12-01

Family

ID=5225529

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00105270A HK1026067A1 (en) 1998-08-31 2000-08-22 Chemical mechanical abrasive composition for use in semiconductor processing

Country Status (6)

Country Link
EP (1) EP0984049B1 (fr)
CN (1) CN1126152C (fr)
DE (1) DE69831150T2 (fr)
HK (1) HK1026067A1 (fr)
MY (1) MY133054A (fr)
SG (1) SG99280A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
TWI227726B (en) 1999-07-08 2005-02-11 Eternal Chemical Co Ltd Chemical-mechanical abrasive composition and method
CN1107097C (zh) * 1999-07-28 2003-04-30 长兴化学工业股份有限公司 化学机械研磨组合物及方法
WO2001012739A1 (fr) 1999-08-13 2001-02-22 Cabot Microelectronics Corporation Systemes de polissage mecanico-chimique et leurs procedes d'utilisation
US6443812B1 (en) 1999-08-24 2002-09-03 Rodel Holdings Inc. Compositions for insulator and metal CMP and methods relating thereto
KR100799965B1 (ko) * 2000-07-08 2008-02-01 에포크 머티리얼 컴퍼니, 리미티드 화학-기계적 연마제 조성물 및 연마 방법
JP2002075927A (ja) * 2000-08-24 2002-03-15 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
US6805812B2 (en) 2001-10-11 2004-10-19 Cabot Microelectronics Corporation Phosphono compound-containing polishing composition and method of using same
TWI339680B (en) * 2002-02-19 2011-04-01 Kanto Kagaku Washing liquid composition for semiconductor substrate
GB2393447B (en) 2002-08-07 2006-04-19 Kao Corp Polishing composition
US7300603B2 (en) * 2003-08-05 2007-11-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers
US7214623B2 (en) * 2003-10-13 2007-05-08 International Business Machines Corporation Planarization system and method using a carbonate containing fluid
CN104031609B (zh) * 2008-07-11 2016-08-03 霓达哈斯股份有限公司 研磨组合物
CN102477261B (zh) * 2010-11-26 2015-06-17 安集微电子（上海）有限公司 一种化学机械抛光液
CN102477258B (zh) * 2010-11-26 2015-05-27 安集微电子（上海）有限公司 一种化学机械抛光液
KR101922289B1 (ko) * 2015-11-26 2018-11-27 삼성에스디아이 주식회사 Ｃｍｐ 슬러리 조성물 및 이를 이용한 유기막 연마방법
CN106590439B (zh) * 2016-12-07 2019-02-05 中国电子科技集团公司第十一研究所 一种抛光液及应用该抛光液对锑化镓晶片进行抛光的方法
FR3067034B1 (fr) * 2017-06-02 2019-12-20 Treliant Fang Sels halites servant d'agents de gravure du carbure de silicium pour augmenter la vitesse d'elimination de materiau par cmp pour une tranche de sic

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0325232B1 (fr) * 1988-01-19 1996-09-11 Fujimi Incorporated Composition de polissage
US5783489A (en) * 1996-09-24 1998-07-21 Cabot Corporation Multi-oxidizer slurry for chemical mechanical polishing
US6039891A (en) * 1996-09-24 2000-03-21 Cabot Corporation Multi-oxidizer precursor for chemical mechanical polishing
US6068787A (en) * 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
US6309560B1 (en) * 1996-12-09 2001-10-30 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates

Also Published As

Publication number Publication date
DE69831150T2 (de) 2006-06-08
EP0984049B1 (fr) 2005-08-10
DE69831150D1 (de) 2005-09-15
CN1126152C (zh) 2003-10-29
MY133054A (en) 2007-10-31
SG99280A1 (en) 2003-10-27
CN1246725A (zh) 2000-03-08
EP0984049A1 (fr) 2000-03-08

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20070831