GB0026927D0 - Wafer processing apparatus - Google Patents

Wafer processing apparatus

Info

Publication number
GB0026927D0
GB0026927D0 GB0026927A GB0026927A GB0026927D0 GB 0026927 D0 GB0026927 D0 GB 0026927D0 GB 0026927 A GB0026927 A GB 0026927A GB 0026927 A GB0026927 A GB 0026927A GB 0026927 D0 GB0026927 D0 GB 0026927D0
Authority
GB
United Kingdom
Prior art keywords
processing apparatus
wafer processing
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0026927A
Other versions
GB2361807A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB0026927D0 publication Critical patent/GB0026927D0/en
Publication of GB2361807A publication Critical patent/GB2361807A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
GB0026927A 1999-11-05 2000-11-03 Wafer processing apparatus having wafer lift pins with slant portions for wafer alignment Withdrawn GB2361807A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31601199A JP2001135712A (en) 1999-11-05 1999-11-05 Vacuum-processing device

Publications (2)

Publication Number Publication Date
GB0026927D0 true GB0026927D0 (en) 2000-12-20
GB2361807A GB2361807A (en) 2001-10-31

Family

ID=18072267

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0026927A Withdrawn GB2361807A (en) 1999-11-05 2000-11-03 Wafer processing apparatus having wafer lift pins with slant portions for wafer alignment

Country Status (3)

Country Link
JP (1) JP2001135712A (en)
KR (1) KR20010051372A (en)
GB (1) GB2361807A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110718496A (en) * 2019-09-20 2020-01-21 深圳市矽电半导体设备有限公司 Wafer center alignment method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030083502A (en) * 2002-04-23 2003-10-30 주식회사 디엠에스 Manufacturing method of liquid crystal display device using emitted fluid
JP4502199B2 (en) 2004-10-21 2010-07-14 ルネサスエレクトロニクス株式会社 Etching apparatus and etching method
CN105084000B (en) * 2015-06-23 2017-04-19 武汉华星光电技术有限公司 Glass placing and taking-out method
JP7266015B2 (en) 2020-09-18 2023-04-27 株式会社Ｓｃｒｅｅｎホールディングス Vacuum processing equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688043A1 (en) * 1990-04-20 1995-12-20 Applied Materials, Inc. Wafer processing apparatus
JPH06204323A (en) * 1992-10-27 1994-07-22 Applied Materials Inc Clampling for dome-shaped heated pedistal within wafer process chamber
JPH06340333A (en) * 1993-05-31 1994-12-13 Hitachi Ltd Conveying device by gas flow

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110718496A (en) * 2019-09-20 2020-01-21 深圳市矽电半导体设备有限公司 Wafer center alignment method

Also Published As

Publication number Publication date
GB2361807A (en) 2001-10-31
JP2001135712A (en) 2001-05-18
KR20010051372A (en) 2001-06-25

Similar Documents

Publication Publication Date Title
SG102704A1 (en) Substrate processing apparatus
TW504041U (en) Wafer processing apparatus
EP1193746A4 (en) Apparatus for plasma processing
EP1069603A4 (en) Processing apparatus
EP1187187A4 (en) Plasma processing apparatus
GB9930731D0 (en) Voice processing apparatus
GB9929284D0 (en) Voice processing apparatus
GB9908545D0 (en) Image processing apparatus
GB9913687D0 (en) Image processing apparatus
EP1189655A4 (en) Implanter apparatus
EP1061155A4 (en) Vacuum processing apparatus
TW540987U (en) Heatsink apparatus
GB2349839B (en) Apparatus for polishing wafers
DE60032324D1 (en) Wafer processing apparatus
GB9929957D0 (en) Image processing apparatus
GB2350005B (en) Image processing apparatus
GB9929193D0 (en) Video processing apparatus
IL149081A0 (en) Apparatus for processing fluids
GB2351462B (en) Apparatus for polishing wafers
GB0026927D0 (en) Wafer processing apparatus
GB9927678D0 (en) Image processing apparatus
GB2358307B (en) Image processing apparatus
GB2351627B (en) Image processing apparatus
EP1083591A4 (en) Device for plasma processing
GB2349764B (en) Image processing apparatus

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)