HK1023586A1 - Latent catalysts for epoxy curing systems. - Google Patents

Latent catalysts for epoxy curing systems.

Info

Publication number
HK1023586A1
HK1023586A1 HK00102612A HK00102612A HK1023586A1 HK 1023586 A1 HK1023586 A1 HK 1023586A1 HK 00102612 A HK00102612 A HK 00102612A HK 00102612 A HK00102612 A HK 00102612A HK 1023586 A1 HK1023586 A1 HK 1023586A1
Authority
HK
Hong Kong
Prior art keywords
epoxy curing
epoxy resin
curing systems
latent catalysts
composition
Prior art date
Application number
HK00102612A
Other languages
English (en)
Inventor
Joseph Gan
John P Everett
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26310844&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1023586(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GBGB9701294.2A external-priority patent/GB9701294D0/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of HK1023586A1 publication Critical patent/HK1023586A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
HK00102612A 1997-01-21 2000-04-28 Latent catalysts for epoxy curing systems. HK1023586A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3594897P 1997-01-21 1997-01-21
GBGB9701294.2A GB9701294D0 (en) 1997-01-22 1997-01-22 Latent catalysts for epoxy curing systems
PCT/US1998/001041 WO1998031750A1 (en) 1997-01-21 1998-01-20 Latent catalysts for epoxy curing systems

Publications (1)

Publication Number Publication Date
HK1023586A1 true HK1023586A1 (en) 2000-09-15

Family

ID=26310844

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00102612A HK1023586A1 (en) 1997-01-21 2000-04-28 Latent catalysts for epoxy curing systems.

Country Status (10)

Country Link
EP (1) EP0954553B2 (de)
JP (1) JP4080546B2 (de)
KR (1) KR100569617B1 (de)
CN (1) CN1129648C (de)
AT (1) ATE273348T1 (de)
DE (1) DE69825561T3 (de)
HK (1) HK1023586A1 (de)
MY (1) MY128727A (de)
TW (1) TW503246B (de)
WO (1) WO1998031750A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60023752T2 (de) * 1999-12-13 2006-04-20 Dow Global Technologies, Inc., Midland Feuerhemmende phosporenthaltende epoxidharzzusammensetzung
US6641923B2 (en) 2001-07-31 2003-11-04 Ppg Industries Ohio, Inc. Weldable coating compositions having improved intercoat adhesion
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6617400B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
ATE279474T1 (de) * 2002-10-19 2004-10-15 Leuna Harze Gmbh Härtbare epoxidharzzusammensetzung
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
JP4895487B2 (ja) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法
WO2005118604A1 (en) 2004-05-28 2005-12-15 Dow Global Technologies Inc. Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
CN101273076B (zh) * 2005-09-27 2011-01-19 住友电木株式会社 潜伏性催化剂的制造方法和环氧树脂组合物
BRPI0621083A2 (pt) * 2005-12-22 2011-11-29 Dow Global Technologies Inc composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina
US8053546B2 (en) * 2007-06-11 2011-11-08 Basf Se Catalyst for curing epoxides
EP2698393B1 (de) 2007-07-26 2015-08-19 Ajinomoto Co., Inc. Harzzusammensetzung
JP5144572B2 (ja) * 2009-03-26 2013-02-13 太陽ホールディングス株式会社 熱硬化性樹脂組成物
WO2011005420A1 (en) * 2009-06-22 2011-01-13 Dow Global Technologies Inc. Hardener composition for epoxy resins
US8980376B2 (en) 2009-11-06 2015-03-17 Dow Global Technologies Llc Storage stable epoxy resin compositions for electrical laminates
CN102031082B (zh) * 2010-12-10 2013-04-03 东华大学 苯并咪唑二胺固化型环氧胶粘剂及其制备方法
CN103492483A (zh) * 2011-05-02 2014-01-01 陶氏环球技术有限责任公司 环氧树脂中的硼酸三甲酯
WO2013122800A1 (en) * 2012-02-17 2013-08-22 Huntsman Advanced Materials Americas Llc Mixture of benzoxazine, epoxy and anhydride
DK2695903T3 (en) 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
DK2695727T3 (en) 2012-08-08 2018-02-12 Siemens Ag Process for accelerating the curing process in resino overflow systems for use in casting processes and resino overflow containers
US10662304B2 (en) 2013-12-31 2020-05-26 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
US11550220B2 (en) 2019-10-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Negative tone photoresist for EUV lithography
CN113278251A (zh) * 2021-04-26 2021-08-20 厦门理工学院 柔性线路板使用的环氧树脂及其制备方法、装置、计算机设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3732332A (en) † 1970-10-16 1973-05-08 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US3997499A (en) * 1974-08-29 1976-12-14 Gulf Oil Corporation Resin-forming homogeneous solutions of styrene, maleic anhydride and copolymers thereof
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
JPS62207320A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd 熱硬化性樹脂組成物で封止してなる半導体装置
US4873273A (en) * 1986-03-20 1989-10-10 James River-Norwalk, Inc. Epoxide coating composition
JPH072829B2 (ja) † 1987-11-04 1995-01-18 株式会社日立製作所 積層板
IL89183A (en) * 1988-02-12 1992-09-06 Dow Chemical Co Catalysts and epoxy resin composition containing the same
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
ZA913801B (en) * 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
ATE243227T1 (de) † 1990-05-21 2003-07-15 Dow Global Technologies Inc Latente katalysatoren, härtungsinhibierte epoxyharzzusammensetzungen und daraus hergestellte laminate
WO1995012627A1 (en) † 1993-11-02 1995-05-11 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
CA2199390A1 (en) † 1994-09-08 1996-03-14 Jan Andre Jozef Schutyser Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
GB9421405D0 (en) † 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations

Also Published As

Publication number Publication date
ATE273348T1 (de) 2004-08-15
JP2001508828A (ja) 2001-07-03
CN1129648C (zh) 2003-12-03
EP0954553B1 (de) 2004-08-11
EP0954553B2 (de) 2008-12-10
EP0954553A1 (de) 1999-11-10
TW503246B (en) 2002-09-21
WO1998031750A1 (en) 1998-07-23
DE69825561T3 (de) 2009-07-09
MY128727A (en) 2007-02-28
CN1249772A (zh) 2000-04-05
DE69825561T2 (de) 2005-08-11
KR20000070360A (ko) 2000-11-25
DE69825561D1 (de) 2004-09-16
JP4080546B2 (ja) 2008-04-23
KR100569617B1 (ko) 2006-04-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140120