HK1019316A1 - Termination machine for integrated passive eletment - Google Patents

Termination machine for integrated passive eletment

Info

Publication number
HK1019316A1
HK1019316A1 HK99104105A HK99104105A HK1019316A1 HK 1019316 A1 HK1019316 A1 HK 1019316A1 HK 99104105 A HK99104105 A HK 99104105A HK 99104105 A HK99104105 A HK 99104105A HK 1019316 A1 HK1019316 A1 HK 1019316A1
Authority
HK
Hong Kong
Prior art keywords
chip
marginal edge
cavity
outer marginal
inventory
Prior art date
Application number
HK99104105A
Other languages
English (en)
Inventor
Denver Braden
Romolo V Devera
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of HK1019316A1 publication Critical patent/HK1019316A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/06—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length by rubbing contact, e.g. by brushes, by pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
HK99104105A 1997-01-31 1999-09-22 Termination machine for integrated passive eletment HK1019316A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/792,492 US5863331A (en) 1996-07-11 1997-01-31 IPC (Chip) termination machine
PCT/US1997/011458 WO1998033600A1 (en) 1997-01-31 1997-06-30 Ipc (chip) termination machine

Publications (1)

Publication Number Publication Date
HK1019316A1 true HK1019316A1 (en) 2000-02-03

Family

ID=25157067

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99104105A HK1019316A1 (en) 1997-01-31 1999-09-22 Termination machine for integrated passive eletment

Country Status (10)

Country Link
US (1) US5863331A (xx)
EP (1) EP0956161B1 (xx)
JP (1) JP3167338B2 (xx)
KR (1) KR100308517B1 (xx)
CN (1) CN1091402C (xx)
AT (1) ATE333326T1 (xx)
DE (1) DE69736357T2 (xx)
HK (1) HK1019316A1 (xx)
IL (1) IL126344A (xx)
WO (1) WO1998033600A1 (xx)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121307A (ja) * 1997-10-09 1999-04-30 Taiyo Yuden Co Ltd 電子部品の外部電極形成装置
JP3446598B2 (ja) * 1998-03-23 2003-09-16 株式会社村田製作所 チップ部品の移載装置
US6204464B1 (en) * 1998-06-19 2001-03-20 Douglas J. Garcia Electronic component handler
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
TWI260657B (en) * 2002-04-15 2006-08-21 Avx Corp Plated terminations
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7576968B2 (en) 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US6982863B2 (en) 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US6960366B2 (en) * 2002-04-15 2005-11-01 Avx Corporation Plated terminations
WO2004016532A2 (en) * 2002-08-16 2004-02-26 Electro Scientific Industries, Inc. Modular belt carrier for electronic components
TW200419860A (en) * 2002-10-04 2004-10-01 Electro Scient Ind Inc Method of forming dimensionally precise slots in resilient mask of miniature component carrier
US7378337B2 (en) * 2003-11-04 2008-05-27 Electro Scientific Industries, Inc. Laser-based termination of miniature passive electronic components
KR20060098370A (ko) * 2003-11-04 2006-09-18 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저-기반의 수동 전자 소자 절단
US20060213806A1 (en) * 2005-03-25 2006-09-28 Saunders William J Configurations of electronic component-carrying apertures in a termination belt
DE102006013268B4 (de) 2005-04-20 2018-12-06 Mahle International Gmbh Verfahren zum Aufbringen von Lot
US7161346B2 (en) * 2005-05-23 2007-01-09 Electro Scientific Industries, Inc. Method of holding an electronic component in a controlled orientation during parametric testing
US7704033B2 (en) * 2006-04-21 2010-04-27 Electro Scientific Industries, Inc. Long axis component loader
CN102020336A (zh) * 2009-09-23 2011-04-20 北京石油化工学院 聚结与旋流分离一体化的采油废水处理设备与方法
KR101406267B1 (ko) * 2011-11-28 2014-06-13 송준호 페이스트 도포용 롤러구조체
JP6901931B2 (ja) * 2017-02-24 2021-07-14 太陽誘電株式会社 テーピング装置
US10683114B2 (en) * 2017-02-24 2020-06-16 Taiyo Yuden Co., Ltd. Taping apparatus
CN114684581B (zh) * 2022-05-31 2022-08-23 四川明泰微电子科技股份有限公司 一种塑封芯片检测用上料装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US764454A (en) * 1904-03-10 1904-07-05 Atlas Tack Company Coating eyelets.
US1191537A (en) * 1913-09-30 1916-07-18 Albert M Schall Gumming-machine.
US2916165A (en) * 1957-02-25 1959-12-08 United Shoe Machinery Corp Mechanisms for feeding disk-type capacitors and like articles
US3752114A (en) * 1971-06-16 1973-08-14 Portage Newspaper Supply Adhesive applying machine
US3698537A (en) * 1971-06-23 1972-10-17 Westermann Werner F Coin sorting and conveying apparatus
US4167226A (en) * 1975-12-22 1979-09-11 R. W. Hartnett Company, Inc. Capsule turning apparatus (random spin printing)
US4353456A (en) * 1979-04-27 1982-10-12 Nippon Elanco Kabushiki Kaisha Capsule orientation control method and apparatus
US4479573A (en) * 1980-04-07 1984-10-30 R. W. Hartnett Company Gauging assembly for capsule orienting and turning apparatus
US4524715A (en) * 1983-03-30 1985-06-25 Abrams William C Apparatus for applying a coating material
JPS6077831A (ja) * 1983-09-30 1985-05-02 株式会社大阪自動機製作所 カプセルのキヤツプ被冠方向取揃え方法並びに其の装置
JPS60218219A (ja) * 1984-04-11 1985-10-31 Toyo Denji Kikai Seisakusho:Kk 部品整送装置
US4657130A (en) * 1984-07-03 1987-04-14 R. Hartnett Company Discrete solid object feeding and transport apparatus and method
NL8403459A (nl) * 1984-11-13 1986-06-02 Philips Nv Werkwijze en inrichting voor het aanbrengen van een laag van fotogevoelig materiaal op een halfgeleiderschijf.
JPH066442B2 (ja) * 1985-02-14 1994-01-26 武田薬品工業株式会社 固形製剤の供給装置
US4660710A (en) * 1986-01-03 1987-04-28 Motorola Inc. Integrated circuit sleeve handler
FR2593478B1 (fr) * 1986-01-27 1988-04-29 Dubuit Mach Dispositif de distribution pour la delivrance un a un, et dresses verticalement, de quelconques objets a un quelconque convoyeur
US5090031A (en) * 1990-10-09 1992-02-18 Pyne Melvin L Can counting machine
US5226382A (en) * 1991-05-20 1993-07-13 Denver Braden Apparatus for automatically metalizing the terminal ends of monolithic capacitor chips
GB2254419B (en) * 1991-08-06 1995-08-02 Amusement Equip Co Ltd Sorting of differently identified articles
IL106222A (en) * 1992-07-07 1996-08-04 Sala Jaime Marti A machine for automatic display and the alignment of its capacity as plastic bottles

Also Published As

Publication number Publication date
US5863331A (en) 1999-01-26
ATE333326T1 (de) 2006-08-15
CN1091402C (zh) 2002-09-25
DE69736357D1 (de) 2006-08-31
JP3167338B2 (ja) 2001-05-21
WO1998033600A1 (en) 1998-08-06
KR20000068825A (ko) 2000-11-25
DE69736357T2 (de) 2007-07-12
EP0956161B1 (en) 2006-07-19
JP2000503620A (ja) 2000-03-28
IL126344A0 (en) 1999-05-09
CN1218425A (zh) 1999-06-02
EP0956161A4 (en) 2002-05-02
EP0956161A1 (en) 1999-11-17
KR100308517B1 (ko) 2001-09-26
IL126344A (en) 2001-07-24

Similar Documents

Publication Publication Date Title
HK1019316A1 (en) Termination machine for integrated passive eletment
WO2004095537A3 (en) Semiconductor multipackage module including processor and memory package assemblies
USD404372S (en) Ring for use in a semiconductor wafer heat processing apparatus
MY126728A (en) Carrier tape and die apparatus for forming same
EP0660405A3 (en) Surface mount chip package.
IE830584L (en) Dense mounting of semiconductor chip packages
EP1038314A4 (en) SUBSTRATE TRANSFER SYSTEM FOR SEMICONDUCTOR PROCESS EQUIPMENT
AU1423797A (en) A ball grid array integrated circuit package that has vias located within the solder pads
CA2075654A1 (en) Wafer suspension box
EP0473796A4 (en) Semiconductor device having a plurality of chips
EP1256808A4 (en) RECEPTACLE TRANSFER AND PROCESSING SYSTEM
NZ510934A (en) Pallet stacking device for stacked arrays of containers having container tops has a contoured surface configured with an array of indentations that cooperate with the container tops
DE60034820D1 (de) Inspektionsmachine für passives oberflächenmontiertes bauelement
IT8922776A0 (it) Dispositivo di trasporto per trasportare parti di grande superficie, anche parti doppie in una pressa progressiva
WO1990003853A3 (fr) Machine de tri automatique d'objets
SG106047A1 (en) Near chip size semiconductor package
USD405062S (en) Processing tube for use in a semiconductor wafer heat processing apparatus
TW350101B (en) A semiconductor device grinding method
TW340256B (en) Vertical package mounted on both sides of a printed circuit board
US7115817B2 (en) Heat sink and electromagnetic interference reduction device
SG124260A1 (en) Moisture resistant integrated circuit leadframe package
EP1207554A4 (en) ELECTRONIC COMPONENT
USD271296S (en) Combined integrated circuit package carrier and socket
EP1301062A3 (en) Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
CN214929893U (zh) 一种用于放置印制电路板的转运车

Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20070630