HK1016407A1 - Copper foil for the manufacture of printed circuits and method of producing same - Google Patents

Copper foil for the manufacture of printed circuits and method of producing same

Info

Publication number
HK1016407A1
HK1016407A1 HK99101282A HK99101282A HK1016407A1 HK 1016407 A1 HK1016407 A1 HK 1016407A1 HK 99101282 A HK99101282 A HK 99101282A HK 99101282 A HK99101282 A HK 99101282A HK 1016407 A1 HK1016407 A1 HK 1016407A1
Authority
HK
Hong Kong
Prior art keywords
copper foil
protective layer
manufacture
printed circuits
producing same
Prior art date
Application number
HK99101282A
Other languages
English (en)
Inventor
Kurt Acx
Paul Dufresne
Michel Mathteu
Michel Streel
Adam M Wolski
Original Assignee
Circuit Foil Trading S A R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Trading S A R L filed Critical Circuit Foil Trading S A R L
Publication of HK1016407A1 publication Critical patent/HK1016407A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
HK99101282A 1995-07-20 1999-03-29 Copper foil for the manufacture of printed circuits and method of producing same HK1016407A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN95197959A CN1088323C (zh) 1995-07-20 1995-07-20 用于制造印刷电路板的铜箔表面上形成防护层的方法
CA002227179A CA2227179A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same
PCT/IB1995/000571 WO1997004627A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same

Publications (1)

Publication Number Publication Date
HK1016407A1 true HK1016407A1 (en) 1999-10-29

Family

ID=27170600

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99101282A HK1016407A1 (en) 1995-07-20 1999-03-29 Copper foil for the manufacture of printed circuits and method of producing same

Country Status (15)

Country Link
EP (1) EP0839440B1 (de)
JP (1) JP3363155B2 (de)
CN (1) CN1088323C (de)
AT (1) ATE186443T1 (de)
AU (1) AU2896995A (de)
BR (1) BR9510620A (de)
CA (1) CA2227179A1 (de)
DE (1) DE69513202T2 (de)
DK (1) DK0839440T3 (de)
ES (1) ES2140690T3 (de)
FI (1) FI980099A (de)
HK (1) HK1016407A1 (de)
PL (1) PL177139B1 (de)
RU (1) RU2138932C1 (de)
WO (1) WO1997004627A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
JP4492434B2 (ja) * 2005-05-16 2010-06-30 日立電線株式会社 プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
US20130306486A1 (en) * 2010-06-30 2013-11-21 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing copper foil for negative electrode current collector
JP5325175B2 (ja) 2010-07-15 2013-10-23 Ｊｘ日鉱日石金属株式会社 銅箔複合体、及び成形体の製造方法
RU2447210C1 (ru) * 2010-12-28 2012-04-10 Вадим Эдуардович Карташян Ткань техническая полиамидная для изготовления грунтозаполняемых конструкций
EP2695733B1 (de) 2011-05-13 2020-09-16 JX Nippon Mining & Metals Corporation Kupferfolienkomplex, in diesem kupferfolienkomplex verwendete kupferfolie, formkörper und verfahren zur herstellung des formkörpers
HUE030342T2 (en) 2012-01-13 2017-05-29 Jx Nippon Mining & Metals Corp Copper-foil composite, extruded body, and method for producing it
US9981450B2 (en) 2012-01-13 2018-05-29 Jx Nippon Mining & Metals Corporation Copper foil composite, formed product and method of producing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength

Also Published As

Publication number Publication date
DK0839440T3 (da) 2000-03-20
EP0839440A1 (de) 1998-05-06
BR9510620A (pt) 1999-01-12
JP3363155B2 (ja) 2003-01-08
CA2227179A1 (en) 1997-02-06
DE69513202T2 (de) 2000-05-11
DE69513202D1 (de) 1999-12-09
WO1997004627A1 (en) 1997-02-06
EP0839440B1 (de) 1999-11-03
CN1198293A (zh) 1998-11-04
ES2140690T3 (es) 2000-03-01
PL177139B1 (pl) 1999-09-30
PL324464A1 (en) 1998-05-25
FI980099A (fi) 1998-02-27
AU2896995A (en) 1997-02-18
FI980099A0 (fi) 1998-01-19
CN1088323C (zh) 2002-07-24
RU2138932C1 (ru) 1999-09-27
ATE186443T1 (de) 1999-11-15

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20060720