DK0839440T3 - Kobberfolie til fremstilling af trykte kredsløb og fremgangsmåde til fremstilling af samme - Google Patents

Kobberfolie til fremstilling af trykte kredsløb og fremgangsmåde til fremstilling af samme

Info

Publication number
DK0839440T3
DK0839440T3 DK95924475T DK95924475T DK0839440T3 DK 0839440 T3 DK0839440 T3 DK 0839440T3 DK 95924475 T DK95924475 T DK 95924475T DK 95924475 T DK95924475 T DK 95924475T DK 0839440 T3 DK0839440 T3 DK 0839440T3
Authority
DK
Denmark
Prior art keywords
copper foil
making
protective layer
printed circuits
electrodeposited
Prior art date
Application number
DK95924475T
Other languages
Danish (da)
English (en)
Inventor
Kurt Acx
Paul Dufresne
Michel Mathieu
Michel Streel
Adam M Wolski
Original Assignee
Circuit Foil Luxembourg Trading Sarl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Luxembourg Trading Sarl filed Critical Circuit Foil Luxembourg Trading Sarl
Application granted granted Critical
Publication of DK0839440T3 publication Critical patent/DK0839440T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DK95924475T 1995-07-20 1995-07-20 Kobberfolie til fremstilling af trykte kredsløb og fremgangsmåde til fremstilling af samme DK0839440T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN95197959A CN1088323C (zh) 1995-07-20 1995-07-20 用于制造印刷电路板的铜箔表面上形成防护层的方法
CA002227179A CA2227179A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same
PCT/IB1995/000571 WO1997004627A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same

Publications (1)

Publication Number Publication Date
DK0839440T3 true DK0839440T3 (da) 2000-03-20

Family

ID=27170600

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95924475T DK0839440T3 (da) 1995-07-20 1995-07-20 Kobberfolie til fremstilling af trykte kredsløb og fremgangsmåde til fremstilling af samme

Country Status (15)

Country Link
EP (1) EP0839440B1 (de)
JP (1) JP3363155B2 (de)
CN (1) CN1088323C (de)
AT (1) ATE186443T1 (de)
AU (1) AU2896995A (de)
BR (1) BR9510620A (de)
CA (1) CA2227179A1 (de)
DE (1) DE69513202T2 (de)
DK (1) DK0839440T3 (de)
ES (1) ES2140690T3 (de)
FI (1) FI980099A (de)
HK (1) HK1016407A1 (de)
PL (1) PL177139B1 (de)
RU (1) RU2138932C1 (de)
WO (1) WO1997004627A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
JP4492434B2 (ja) * 2005-05-16 2010-06-30 日立電線株式会社 プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
US20130306486A1 (en) * 2010-06-30 2013-11-21 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing copper foil for negative electrode current collector
JP5325175B2 (ja) 2010-07-15 2013-10-23 Ｊｘ日鉱日石金属株式会社 銅箔複合体、及び成形体の製造方法
RU2447210C1 (ru) * 2010-12-28 2012-04-10 Вадим Эдуардович Карташян Ткань техническая полиамидная для изготовления грунтозаполняемых конструкций
EP2695733B1 (de) 2011-05-13 2020-09-16 JX Nippon Mining & Metals Corporation Kupferfolienkomplex, in diesem kupferfolienkomplex verwendete kupferfolie, formkörper und verfahren zur herstellung des formkörpers
HUE030342T2 (en) 2012-01-13 2017-05-29 Jx Nippon Mining & Metals Corp Copper-foil composite, extruded body, and method for producing it
US9981450B2 (en) 2012-01-13 2018-05-29 Jx Nippon Mining & Metals Corporation Copper foil composite, formed product and method of producing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength

Also Published As

Publication number Publication date
EP0839440A1 (de) 1998-05-06
BR9510620A (pt) 1999-01-12
JP3363155B2 (ja) 2003-01-08
HK1016407A1 (en) 1999-10-29
CA2227179A1 (en) 1997-02-06
DE69513202T2 (de) 2000-05-11
DE69513202D1 (de) 1999-12-09
WO1997004627A1 (en) 1997-02-06
EP0839440B1 (de) 1999-11-03
CN1198293A (zh) 1998-11-04
ES2140690T3 (es) 2000-03-01
PL177139B1 (pl) 1999-09-30
PL324464A1 (en) 1998-05-25
FI980099A (fi) 1998-02-27
AU2896995A (en) 1997-02-18
FI980099A0 (fi) 1998-01-19
CN1088323C (zh) 2002-07-24
RU2138932C1 (ru) 1999-09-27
ATE186443T1 (de) 1999-11-15

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