HK1009305A1 - Circuit protection device - Google Patents

Circuit protection device

Info

Publication number
HK1009305A1
HK1009305A1 HK98110131A HK98110131A HK1009305A1 HK 1009305 A1 HK1009305 A1 HK 1009305A1 HK 98110131 A HK98110131 A HK 98110131A HK 98110131 A HK98110131 A HK 98110131A HK 1009305 A1 HK1009305 A1 HK 1009305A1
Authority
HK
Hong Kong
Prior art keywords
main part
electrode
resistive element
protection device
leg
Prior art date
Application number
HK98110131A
Other languages
English (en)
Inventor
Gregory A Graves
Michael Zhang
Daniel Chandler
Chi-Ming Chang
Shou-Mean Fang
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25429551&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1009305(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of HK1009305A1 publication Critical patent/HK1009305A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H01C7/005—Polymer thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10469—Asymmetrically mounted component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10643—Disc shaped leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Details Of Resistors (AREA)
  • Fuses (AREA)
  • Amplifiers (AREA)
  • Air Bags (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Developing Agents For Electrophotography (AREA)
HK98110131A 1992-07-09 1998-08-24 Circuit protection device HK1009305A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US91095092A 1992-07-09 1992-07-09
PCT/US1993/006480 WO1994001876A1 (en) 1992-07-09 1993-07-08 Electrical devices

Publications (1)

Publication Number Publication Date
HK1009305A1 true HK1009305A1 (en) 1999-05-28

Family

ID=25429551

Family Applications (2)

Application Number Title Priority Date Filing Date
HK99105496A HK1020388A1 (en) 1992-07-09 1998-08-24 Electrical devices
HK98110131A HK1009305A1 (en) 1992-07-09 1998-08-24 Circuit protection device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK99105496A HK1020388A1 (en) 1992-07-09 1998-08-24 Electrical devices

Country Status (9)

Country Link
EP (3) EP0811993B1 (ko)
JP (1) JPH07509347A (ko)
KR (1) KR100275161B1 (ko)
AT (2) ATE163796T1 (ko)
CA (1) CA2139330C (ko)
DE (2) DE69333211T2 (ko)
ES (1) ES2114062T3 (ko)
HK (2) HK1020388A1 (ko)
WO (1) WO1994001876A1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5852397A (en) 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
US5451921A (en) * 1993-10-04 1995-09-19 Raychem Corporation Electrical devices
CN1054941C (zh) * 1994-05-16 2000-07-26 雷伊化学公司 有聚合物正温度系数电阻元件的电路保护器件
US5582770A (en) * 1994-06-08 1996-12-10 Raychem Corporation Conductive polymer composition
JP3605115B2 (ja) * 1994-06-08 2004-12-22 レイケム・コーポレイション 導電性ポリマーを含有する電気デバイス
CN1113369C (zh) 1994-06-09 2003-07-02 雷伊化学公司 包含正温度系数导电聚合物元件的电路保护器件和制造该器件的方法
US5691688A (en) * 1994-07-20 1997-11-25 Therm-O-Disc, Incorporated PTC device
DE69633718T2 (de) * 1995-03-22 2006-02-02 Tyco Electronics Corp. Leitfähige polymerzusammensetzung und vorrichtung
EP0815568B1 (en) * 1995-03-22 2005-05-25 Tyco Electronics Corporation Electrical device
US5884391A (en) * 1996-01-22 1999-03-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US5900800A (en) * 1996-01-22 1999-05-04 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
US5699607A (en) * 1996-01-22 1997-12-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US6215388B1 (en) * 1996-09-27 2001-04-10 Therm-Q-Disc, Incorporated Parallel connected PTC elements
CN1135570C (zh) 1997-06-04 2004-01-21 泰科电子有限公司 电路保护器件
DE69838727T2 (de) * 1997-07-07 2008-03-06 Matsushita Electric Industrial Co., Ltd., Kadoma Ptc thermistorchip sowie seine herstellungsmethode
US6606023B2 (en) 1998-04-14 2003-08-12 Tyco Electronics Corporation Electrical devices
EP1102338B1 (en) * 1998-05-18 2009-05-06 Tyco Electronics Raychem K.K. Ptc element, ptc element-mounted pcb board, secondary cell protection circuit device and secondary cell assembly
US6300859B1 (en) 1999-08-24 2001-10-09 Tyco Electronics Corporation Circuit protection devices
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
TW487272U (en) * 2001-03-20 2002-05-11 Polytronics Technology Corp Multilayer circuit boards
US7931124B2 (en) 2007-12-12 2011-04-26 United Technologies Corporation On-demand lubrication system and method for improved flow management and containment

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497859A (en) * 1968-05-28 1970-02-24 Stackpole Carbon Co Electrical resistors for printed circuits
GB1415454A (en) * 1973-05-04 1975-11-26 Welwyn Electric Ltd Mounting means of electrical components
JPS5545629A (en) * 1978-09-28 1980-03-31 Nippon Soda Co Ltd Preparation of 4-aminopyridine
US4237441A (en) * 1978-12-01 1980-12-02 Raychem Corporation Low resistivity PTC compositions
US4475138A (en) * 1980-04-21 1984-10-02 Raychem Corporation Circuit protection devices comprising PTC element
JPS59147430A (ja) * 1983-02-10 1984-08-23 Oki Electric Ind Co Ltd 微細回路の形成方法
JPS6443038A (en) * 1987-08-06 1989-02-15 Sawafuji Electric Co Ltd On-vehicle load power supplying circuit
FR2620561B1 (fr) * 1987-09-15 1992-04-24 Europ Composants Electron Thermistance ctp pour le montage en surface
JPH01143203A (ja) * 1987-11-27 1989-06-05 Murata Mfg Co Ltd 有機正特性サーミスタ
AU637370B2 (en) * 1989-05-18 1993-05-27 Fujikura Ltd. Ptc thermistor and manufacturing method for the same
US5122775A (en) * 1990-02-14 1992-06-16 Raychem Corporation Connection device for resistive elements
JPH0448701A (ja) * 1990-06-15 1992-02-18 Daito Tsushinki Kk 自己復帰形過電流保護素子

Also Published As

Publication number Publication date
HK1020388A1 (en) 2000-04-14
CA2139330C (en) 2004-10-12
EP0811993A2 (en) 1997-12-10
DE69333211D1 (de) 2003-10-23
KR950702738A (ko) 1995-07-29
JPH07509347A (ja) 1995-10-12
ATE250274T1 (de) 2003-10-15
EP0811993B1 (en) 2003-09-17
EP0649562A1 (en) 1995-04-26
EP1347470A1 (en) 2003-09-24
DE69317288D1 (de) 1998-04-09
DE69333211T2 (de) 2004-07-01
ATE163796T1 (de) 1998-03-15
EP0649562B1 (en) 1998-03-04
KR100275161B1 (ko) 2000-12-15
CA2139330A1 (en) 1994-01-20
WO1994001876A1 (en) 1994-01-20
EP0811993A3 (en) 1998-11-25
DE69317288T2 (de) 1998-11-12
ES2114062T3 (es) 1998-05-16

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120708