HK1004001A1 - Resin formulation - Google Patents

Resin formulation

Info

Publication number
HK1004001A1
HK1004001A1 HK98103257A HK98103257A HK1004001A1 HK 1004001 A1 HK1004001 A1 HK 1004001A1 HK 98103257 A HK98103257 A HK 98103257A HK 98103257 A HK98103257 A HK 98103257A HK 1004001 A1 HK1004001 A1 HK 1004001A1
Authority
HK
Hong Kong
Prior art keywords
mixture
epoxy resin
resin formulation
curing
thickens
Prior art date
Application number
HK98103257A
Other languages
English (en)
Inventor
Paul Terrence Wombwell
Philip David Willis
Christopher Herbert Bull
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of HK1004001A1 publication Critical patent/HK1004001A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
HK98103257A 1991-09-20 1998-04-17 Resin formulation HK1004001A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB919120078A GB9120078D0 (en) 1991-09-20 1991-09-20 Resin formulation

Publications (1)

Publication Number Publication Date
HK1004001A1 true HK1004001A1 (en) 1998-11-13

Family

ID=10701710

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98103257A HK1004001A1 (en) 1991-09-20 1998-04-17 Resin formulation

Country Status (16)

Country Link
EP (1) EP0533465B1 (es)
JP (1) JP3368306B2 (es)
KR (1) KR100228227B1 (es)
AT (1) ATE146506T1 (es)
AU (1) AU651731B2 (es)
CA (1) CA2078603A1 (es)
DE (1) DE69216024T2 (es)
DK (1) DK0533465T3 (es)
ES (1) ES2097883T3 (es)
GB (1) GB9120078D0 (es)
GR (1) GR3022189T3 (es)
HK (1) HK1004001A1 (es)
MX (1) MX9205283A (es)
MY (1) MY108735A (es)
NO (1) NO923640L (es)
TW (1) TW240238B (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19810549A1 (de) 1998-03-11 1999-09-16 Delo Industrieklebstoffe Gmbh Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung
JP4319332B2 (ja) * 2000-06-29 2009-08-26 株式会社東芝 電気絶縁材料およびその製造方法
KR100442564B1 (ko) * 2001-10-23 2004-07-30 엘지전선 주식회사 아연-코발트-비소 합금의 배리어층이 형성된 피씨비용전해동박 및 그 표면 처리방법
EP1557455A1 (de) * 2004-01-23 2005-07-27 Sika Technology AG Thixotrope reaktive Zusammensetzung
BRPI1015324A2 (pt) * 2009-05-05 2019-04-09 Huntsman Advanced Materials (Switzerland) Gmbh sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável
JP6779476B2 (ja) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材
DE102015119775A1 (de) * 2015-11-16 2017-05-18 Osram Opto Semiconductors Gmbh Epoxidharzsystem, Epoxidharz, Verwendung eines Epoxidharzsystems, Bauelement mit einem Epoxidharz und Verfahren zur Herstellung eines Epoxidharzes
DE102016102685B4 (de) * 2016-02-16 2024-02-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Epoxidharzsystem, Verwendung eines Epoxidharzsystems und Verfahren zur Herstellung eines Epoxidharzsystems
KR102382554B1 (ko) * 2019-03-27 2022-04-04 주식회사 엘지화학 수지 조성물

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB939737A (en) * 1959-11-20 1963-10-16 Gen Electric Resin compositions and their preparation
ES335564A1 (es) * 1966-01-13 1968-03-16 Ciba Geigy Procedimiento para preparar mezclas tixotropicas endureci- bles.
LU83226A1 (fr) * 1981-03-18 1983-02-22 Sigma Coatings Bv Isolation de rails conducteurs de courant electrique
US4451591A (en) * 1982-06-16 1984-05-29 Mobil Oil Corporation Two-component high solids coating for rusty steels
GB8806299D0 (en) * 1988-03-17 1988-04-13 Glynwed Consumer & Building Process of manufacturing thin-walled plastics moulding
EP0348193A3 (en) * 1988-06-24 1990-09-12 Somar Corporation Epoxy resin composition
GB8904862D0 (en) * 1989-03-03 1989-04-12 Ciba Geigy Ag Compositions

Also Published As

Publication number Publication date
JPH05222271A (ja) 1993-08-31
AU2520992A (en) 1993-04-01
DE69216024D1 (de) 1997-01-30
KR100228227B1 (ko) 1999-11-01
MY108735A (en) 1996-11-30
KR930006103A (ko) 1993-04-20
JP3368306B2 (ja) 2003-01-20
NO923640D0 (no) 1992-09-18
NO923640L (no) 1993-03-22
AU651731B2 (en) 1994-07-28
DK0533465T3 (da) 1997-01-06
ES2097883T3 (es) 1997-04-16
TW240238B (es) 1995-02-11
ATE146506T1 (de) 1997-01-15
GB9120078D0 (en) 1991-11-06
EP0533465A3 (en) 1993-11-10
CA2078603A1 (en) 1993-03-21
EP0533465B1 (en) 1996-12-18
GR3022189T3 (en) 1997-03-31
MX9205283A (es) 1993-03-01
EP0533465A2 (en) 1993-03-24
DE69216024T2 (de) 1997-07-03

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)