HK1001937A1 - Fusebank with esd protection - Google Patents

Fusebank with esd protection

Info

Publication number
HK1001937A1
HK1001937A1 HK98100992A HK98100992A HK1001937A1 HK 1001937 A1 HK1001937 A1 HK 1001937A1 HK 98100992 A HK98100992 A HK 98100992A HK 98100992 A HK98100992 A HK 98100992A HK 1001937 A1 HK1001937 A1 HK 1001937A1
Authority
HK
Hong Kong
Prior art keywords
guard ring
semiconductor region
doped
doped semiconductor
fusebank
Prior art date
Application number
HK98100992A
Other languages
English (en)
Inventor
Werner Reczek
Harmud Terletzki
Dominique Savignac
Heinz Hebbeker
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of HK1001937A1 publication Critical patent/HK1001937A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Fuses (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
HK98100992A 1995-06-23 1998-02-10 Fusebank with esd protection HK1001937A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP95109853A EP0750343B1 (de) 1995-06-23 1995-06-23 Bank von Schmelzsicherungen mit ESD-Schutz

Publications (1)

Publication Number Publication Date
HK1001937A1 true HK1001937A1 (en) 1998-07-17

Family

ID=8219383

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98100992A HK1001937A1 (en) 1995-06-23 1998-02-10 Fusebank with esd protection

Country Status (8)

Country Link
US (1) US5661331A (xx)
EP (1) EP0750343B1 (xx)
JP (1) JP3939783B2 (xx)
KR (1) KR100283807B1 (xx)
AT (1) ATE159616T1 (xx)
DE (1) DE59500861D1 (xx)
HK (1) HK1001937A1 (xx)
TW (1) TW386301B (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498895A (en) * 1993-07-07 1996-03-12 Actel Corporation Process ESD protection devices for use with antifuses
US5567643A (en) * 1994-05-31 1996-10-22 Taiwan Semiconductor Manufacturing Company Method of forming contamination guard ring for semiconductor integrated circuit applications
US6008523A (en) * 1998-08-26 1999-12-28 Siemens Aktiengesellschaft Electrical fuses with tight pitches and method of fabrication in semiconductors
KR100275750B1 (ko) * 1998-11-05 2000-12-15 윤종용 반도체 메모리 장치의 레이저 퓨즈 박스의 배선 배치
US6486526B1 (en) 1999-01-04 2002-11-26 International Business Machines Corporation Crack stop between neighboring fuses for protection from fuse blow damage
US6433403B1 (en) * 1999-04-21 2002-08-13 Micron Technology, Inc. Integrated circuit having temporary conductive path structure and method for forming the same
US6323535B1 (en) 2000-06-16 2001-11-27 Infineon Technologies North America Corp. Electrical fuses employing reverse biasing to enhance programming
US6876058B1 (en) 2003-10-14 2005-04-05 International Business Machines Corporation Wiring protection element for laser deleted tungsten fuse

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3276981D1 (en) * 1981-10-09 1987-09-17 Toshiba Kk Semiconductor device having a fuse element
JPS6098664A (ja) * 1983-11-02 1985-06-01 Mitsubishi Electric Corp 半導体記憶装置
JPH0828422B2 (ja) * 1988-04-30 1996-03-21 松下電子工業株式会社 半導体装置
JPH0697379A (ja) * 1992-09-16 1994-04-08 Yamaha Corp Ｌｓｉチップ等の静電破壊防止回路

Also Published As

Publication number Publication date
ATE159616T1 (de) 1997-11-15
JP3939783B2 (ja) 2007-07-04
TW386301B (en) 2000-04-01
KR100283807B1 (ko) 2001-04-02
EP0750343B1 (de) 1997-10-22
DE59500861D1 (de) 1997-11-27
EP0750343A1 (de) 1996-12-27
JPH0917879A (ja) 1997-01-17
US5661331A (en) 1997-08-26
KR970003936A (ko) 1997-01-29

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)