HK1001936A1 - Lead frame assembly process - Google Patents

Lead frame assembly process

Info

Publication number
HK1001936A1
HK1001936A1 HK98100678A HK98100678A HK1001936A1 HK 1001936 A1 HK1001936 A1 HK 1001936A1 HK 98100678 A HK98100678 A HK 98100678A HK 98100678 A HK98100678 A HK 98100678A HK 1001936 A1 HK1001936 A1 HK 1001936A1
Authority
HK
Hong Kong
Prior art keywords
lead frame
frame assembly
assembly process
lead
frame
Prior art date
Application number
HK98100678A
Other languages
English (en)
Inventor
Mitsuharu Shimizu
Yoshiki Takeda
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of HK1001936A1 publication Critical patent/HK1001936A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49527—Additional leads the additional leads being a multilayer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
HK98100678A 1990-05-18 1998-01-26 Lead frame assembly process HK1001936A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2130083A JP2828318B2 (ja) 1990-05-18 1990-05-18 多層リードフレームの製造方法

Publications (1)

Publication Number Publication Date
HK1001936A1 true HK1001936A1 (en) 1998-07-17

Family

ID=15025576

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98100678A HK1001936A1 (en) 1990-05-18 1998-01-26 Lead frame assembly process

Country Status (6)

Country Link
US (1) US5281556A (de)
EP (1) EP0457593B1 (de)
JP (1) JP2828318B2 (de)
KR (1) KR950006981B1 (de)
DE (1) DE69127316T2 (de)
HK (1) HK1001936A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2120464A1 (en) * 1992-02-18 1993-08-19 Bidyut K. Bhattacharyya Advance multilayer molded plastic package using mesic technology
JPH0653394A (ja) * 1992-07-28 1994-02-25 Shinko Electric Ind Co Ltd 多層リードフレーム用プレーン支持体
US5854094A (en) * 1992-07-28 1998-12-29 Shinko Electric Industries Co., Ltd. Process for manufacturing metal plane support for multi-layer lead frames
US5484097A (en) * 1994-07-12 1996-01-16 General Instrument Corp. Fabrication of hybrid semiconductor devices
US5498576A (en) * 1994-07-22 1996-03-12 Texas Instruments Incorporated Method and apparatus for affixing spheres to a foil matrix
US5486494A (en) * 1994-07-22 1996-01-23 Texas Instruments Incorporated Method and apparatus for affixing spheres to a conductive sheet
US5508556A (en) * 1994-09-02 1996-04-16 Motorola, Inc. Leaded semiconductor device having accessible power supply pad terminals
US5965936A (en) 1997-12-31 1999-10-12 Micron Technology, Inc. Multi-layer lead frame for a semiconductor device
WO1996015555A1 (en) * 1994-11-10 1996-05-23 Micron Technology, Inc. Multi-layer lead frame for a semiconductor device
US6049972A (en) * 1997-03-04 2000-04-18 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US6687980B1 (en) 1997-03-04 2004-02-10 Tessera, Inc. Apparatus for processing flexible tape for microelectronic assemblies
US6054754A (en) 1997-06-06 2000-04-25 Micron Technology, Inc. Multi-capacitance lead frame decoupling device
US6515359B1 (en) * 1998-01-20 2003-02-04 Micron Technology, Inc. Lead frame decoupling capacitor semiconductor device packages including the same and methods
US6114756A (en) * 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
WO2004097896A2 (en) * 2003-04-26 2004-11-11 Freescale Semiconductor, Inc. A packaged integrated circuit having a heat spreader and method therefor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3526568A (en) * 1969-06-11 1970-09-01 Westinghouse Electric Corp Flexible foil clad laminates
US4835120A (en) * 1987-01-12 1989-05-30 Debendra Mallik Method of making a multilayer molded plastic IC package
JPS6484689A (en) * 1987-09-28 1989-03-29 Toshiba Corp Printed wiring board for high speed signal transmission
JPH0294464A (ja) * 1988-09-29 1990-04-05 Matsushita Electron Corp 半導体装置用リードフレーム
JPH02143466A (ja) * 1988-11-25 1990-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
US5043227A (en) * 1989-05-15 1991-08-27 The Dow Chemical Company Polyimide and copper metal laminates
US5023202A (en) * 1989-07-14 1991-06-11 Lsi Logic Corporation Rigid strip carrier for integrated circuits

Also Published As

Publication number Publication date
JPH0425163A (ja) 1992-01-28
DE69127316D1 (de) 1997-09-25
EP0457593B1 (de) 1997-08-20
JP2828318B2 (ja) 1998-11-25
KR910020867A (ko) 1991-12-20
EP0457593A3 (en) 1992-12-02
EP0457593A2 (de) 1991-11-21
US5281556A (en) 1994-01-25
KR950006981B1 (ko) 1995-06-26
DE69127316T2 (de) 1997-12-18

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)