GR3003964T3 - - Google Patents
Info
- Publication number
- GR3003964T3 GR3003964T3 GR910401675T GR910401675T GR3003964T3 GR 3003964 T3 GR3003964 T3 GR 3003964T3 GR 910401675 T GR910401675 T GR 910401675T GR 910401675 T GR910401675 T GR 910401675T GR 3003964 T3 GR3003964 T3 GR 3003964T3
- Authority
- GR
- Greece
- Prior art keywords
- solutions
- stabilized
- strippers
- etchants
- developers
- Prior art date
Links
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 abstract 1
- 239000002585 base Substances 0.000 abstract 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 abstract 1
- 229960001231 choline Drugs 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000012458 free base Substances 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/18—Diazo-type processes, e.g. thermal development, or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/887,674 US4686002A (en) | 1986-07-18 | 1986-07-18 | Stabilized choline base solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
GR3003964T3 true GR3003964T3 (el) | 1993-03-16 |
Family
ID=25391630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GR910401675T GR3003964T3 (el) | 1986-07-18 | 1992-03-05 |
Country Status (9)
Country | Link |
---|---|
US (1) | US4686002A (el) |
EP (1) | EP0253675B1 (el) |
JP (1) | JP2572069B2 (el) |
KR (1) | KR950007339B1 (el) |
AT (1) | ATE73126T1 (el) |
CA (1) | CA1306660C (el) |
DE (1) | DE3776995D1 (el) |
ES (1) | ES2030430T3 (el) |
GR (1) | GR3003964T3 (el) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3638629A1 (de) * | 1986-11-11 | 1988-05-26 | Schering Ag | Mittel und verfahren zur entfernung von fotoresisten |
DE3740369A1 (de) * | 1987-11-25 | 1989-06-08 | Schering Ag | Verfahren zur vorbehandlung von kunststoffen |
US4931103A (en) * | 1988-08-11 | 1990-06-05 | E. I. Du Pont De Nemours And Company | Tricholine phosphate surface treating agent |
US4964919A (en) * | 1988-12-27 | 1990-10-23 | Nalco Chemical Company | Cleaning of silicon wafers with an aqueous solution of KOH and a nitrogen-containing compound |
JP2653511B2 (ja) * | 1989-03-30 | 1997-09-17 | 株式会社東芝 | 半導体装置の洗浄方法及びその洗浄装置 |
US5110367A (en) * | 1990-04-12 | 1992-05-05 | Mallinckrodt Specialty Chemicals Company | Method for precision cleaning of medical devices |
AU7659391A (en) * | 1990-04-12 | 1991-11-11 | Mallinckrodt Specialty Chemicals Company | Method for precision cleaning of medical devices |
JP2906590B2 (ja) * | 1990-06-14 | 1999-06-21 | 三菱瓦斯化学株式会社 | アルミニウム配線半導体基板の表面処理剤 |
US5139607A (en) * | 1991-04-23 | 1992-08-18 | Act, Inc. | Alkaline stripping compositions |
CA2081220A1 (en) * | 1991-10-29 | 1993-04-30 | Llandro Castillo Santos | Single-phase developers for lithographic printing elements |
US5554320A (en) * | 1993-11-22 | 1996-09-10 | Yianakopoulos; Georges | Liquid cleaning compositions |
US5683192A (en) * | 1996-04-15 | 1997-11-04 | Kilfoil; Dennis C. | Toothbrush system with an internal water delivery system operable from a shower |
JPH10289891A (ja) * | 1997-04-11 | 1998-10-27 | Mitsubishi Gas Chem Co Inc | 半導体回路用洗浄剤及びそれを用いた半導体回路の製造方法 |
US6348239B1 (en) | 2000-04-28 | 2002-02-19 | Simon Fraser University | Method for depositing metal and metal oxide films and patterned films |
US6417112B1 (en) | 1998-07-06 | 2002-07-09 | Ekc Technology, Inc. | Post etch cleaning composition and process for dual damascene system |
AU2003256748B2 (en) * | 2001-08-22 | 2007-12-06 | Instrumentation Laboratory Company | Compositions and method for reducing the rate of oxygen loss from aqueous solutions |
US20030073242A1 (en) * | 2001-10-11 | 2003-04-17 | Kitchens Keith G. | Apparatus for controlling stripping solutions methods thereof |
US20040074519A1 (en) * | 2002-10-17 | 2004-04-22 | Moore John C. | Metal safe stabilized stripper for removing cured polymeric layers and negative tone acrylic photoresists |
EP1781594A1 (en) * | 2004-07-09 | 2007-05-09 | Akzo Nobel N.V. | Composition comprising choline hydroxide and process for preparing the same |
CA2855935A1 (en) * | 2011-11-22 | 2013-05-30 | Taminco N.V. | Stabilized choline solutions and methods for preparing the same |
RU2678972C2 (ru) | 2013-04-11 | 2019-02-05 | Таминко | Усовершенствованный способ получения холингидроксида |
US9297081B2 (en) * | 2014-02-21 | 2016-03-29 | Ecolab Usa Inc. | Use of neutralizing agent in olefin or styrene production |
JP6296974B2 (ja) * | 2014-12-25 | 2018-03-20 | 四日市合成株式会社 | 安定化四級アンモニウム水酸化物水溶液及びその製造方法 |
US11492277B2 (en) | 2015-07-29 | 2022-11-08 | Ecolab Usa Inc. | Heavy amine neutralizing agents for olefin or styrene production |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB700115A (en) * | 1951-03-16 | 1953-11-25 | Evan Jones | Improvements in disinfectants and deodorizers |
US2823166A (en) * | 1954-11-17 | 1958-02-11 | Walter H Hoffman | Choline ascorbate, methods for producing same, and compositions thereof |
US3897485A (en) * | 1966-10-18 | 1975-07-29 | J Berthier Lab | Choline compounds |
US3549370A (en) * | 1966-11-23 | 1970-12-22 | Hunt Chem Corp Philip A | Quaternary ammonium bisulfites,sulfites or pyrosulfites as developer preservatives |
NL7007023A (el) * | 1969-05-16 | 1970-11-18 | ||
US3947491A (en) * | 1972-03-24 | 1976-03-30 | The Purdue Frederick Company | Stabilized choline salicylate compounds |
US4339340A (en) * | 1975-11-26 | 1982-07-13 | Tokyo Shibaura Electric Co., Ltd. | Surface-treating agent adapted for intermediate products of a semiconductor device |
GB1573206A (en) * | 1975-11-26 | 1980-08-20 | Tokyo Shibaura Electric Co | Method of trating surfaces of intermediate products obtained in the manufacture of semiconductor devices |
JPS5351970A (en) * | 1976-10-21 | 1978-05-11 | Toshiba Corp | Manufacture for semiconductor substrate |
US4294911A (en) * | 1979-06-18 | 1981-10-13 | Eastman Kodak Company | Development of light-sensitive quinone diazide compositions using sulfite stabilizer |
IT1141651B (it) * | 1980-06-24 | 1986-10-08 | Giuseppe Riva | Procedimento per la stabilizzazione di vitamine |
US4425202A (en) * | 1982-08-18 | 1984-01-10 | Thiokol Corporation | Method of making and color stabilization of choline base |
JPS59182444A (ja) * | 1983-04-01 | 1984-10-17 | Sumitomo Chem Co Ltd | ポジ型フオトレジストの改良現像液 |
US4464461A (en) * | 1983-07-22 | 1984-08-07 | Eastman Kodak Company | Development of light-sensitive quinone diazide compositions |
-
1986
- 1986-07-18 US US06/887,674 patent/US4686002A/en not_active Expired - Lifetime
-
1987
- 1987-07-16 KR KR1019870007711A patent/KR950007339B1/ko not_active IP Right Cessation
- 1987-07-17 ES ES198787306347T patent/ES2030430T3/es not_active Expired - Lifetime
- 1987-07-17 DE DE8787306347T patent/DE3776995D1/de not_active Expired - Lifetime
- 1987-07-17 AT AT87306347T patent/ATE73126T1/de not_active IP Right Cessation
- 1987-07-17 CA CA000542450A patent/CA1306660C/en not_active Expired - Lifetime
- 1987-07-17 EP EP87306347A patent/EP0253675B1/en not_active Expired - Lifetime
- 1987-07-17 JP JP62178844A patent/JP2572069B2/ja not_active Expired - Lifetime
-
1992
- 1992-03-05 GR GR910401675T patent/GR3003964T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
DE3776995D1 (de) | 1992-04-09 |
EP0253675B1 (en) | 1992-03-04 |
KR950007339B1 (ko) | 1995-07-10 |
CA1306660C (en) | 1992-08-25 |
US4686002A (en) | 1987-08-11 |
JPS6354344A (ja) | 1988-03-08 |
EP0253675A1 (en) | 1988-01-20 |
ATE73126T1 (de) | 1992-03-15 |
KR880002049A (ko) | 1988-04-28 |
ES2030430T3 (es) | 1992-11-01 |
JP2572069B2 (ja) | 1997-01-16 |
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