GB975987A - A process for use in the production of a semi-conductor device - Google Patents

A process for use in the production of a semi-conductor device

Info

Publication number
GB975987A
GB975987A GB26729/62A GB2672962A GB975987A GB 975987 A GB975987 A GB 975987A GB 26729/62 A GB26729/62 A GB 26729/62A GB 2672962 A GB2672962 A GB 2672962A GB 975987 A GB975987 A GB 975987A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
gold
wafer
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB26729/62A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB975987A publication Critical patent/GB975987A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07331Connecting techniques
    • H10W72/07336Soldering or alloying
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/321Structures or relative sizes of die-attach connectors
    • H10W72/325Die-attach connectors having a filler embedded in a matrix
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/351Materials of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/351Materials of die-attach connectors
    • H10W72/352Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Die Bonding (AREA)
GB26729/62A 1961-07-14 1962-07-11 A process for use in the production of a semi-conductor device Expired GB975987A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES74813A DE1172378B (de) 1961-07-14 1961-07-14 Verfahren zur Herstellung einer elektrisch unsymmetrisch leitenden Halbleiteranordnung

Publications (1)

Publication Number Publication Date
GB975987A true GB975987A (en) 1964-11-25

Family

ID=7504914

Family Applications (1)

Application Number Title Priority Date Filing Date
GB26729/62A Expired GB975987A (en) 1961-07-14 1962-07-11 A process for use in the production of a semi-conductor device

Country Status (9)

Country Link
US (1) US3233309A (https=)
JP (1) JPS4820946B1 (https=)
BE (1) BE620118A (https=)
CH (1) CH400371A (https=)
DE (1) DE1172378B (https=)
FR (1) FR1374985A (https=)
GB (1) GB975987A (https=)
NL (1) NL279651A (https=)
SE (1) SE218102C1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL136731C (https=) * 1965-06-23
US3409809A (en) * 1966-04-06 1968-11-05 Irc Inc Semiconductor or write tri-layered metal contact
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
DE1935143C3 (de) * 1969-07-11 1975-04-17 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Hartlotverbindung bei Halbleiter-Bauelementen und Verfahren zu ihrer Herstellung
GB1337283A (en) * 1969-12-26 1973-11-14 Hitachi Ltd Method of manufacturing a semiconductor device
US3614547A (en) * 1970-03-16 1971-10-19 Gen Electric Tungsten barrier electrical connection
US4552301A (en) * 1984-05-17 1985-11-12 U.S. Philips Corporation Method of bonding ceramic components together or to metallic components
JPS6196410A (ja) * 1984-10-17 1986-05-15 Asahi Chem Ind Co Ltd ロ−タリ−エンコ−ダ−用デイスクの製造法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE505958A (https=) * 1950-09-21
NL177655B (nl) * 1952-04-19 Johnson & Johnson Chirurgisch laken.
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
US2794942A (en) * 1955-12-01 1957-06-04 Hughes Aircraft Co Junction type semiconductor devices and method of making the same
US2960419A (en) * 1956-02-08 1960-11-15 Siemens Ag Method and device for producing electric semiconductor devices
NL113327C (https=) * 1956-10-31 1900-01-01
US2930950A (en) * 1956-12-10 1960-03-29 Teszner Stanislas High power field-effect transistor
US2964830A (en) * 1957-01-31 1960-12-20 Westinghouse Electric Corp Silicon semiconductor devices
NL225331A (https=) * 1957-03-01 1900-01-01
US2994627A (en) * 1957-05-08 1961-08-01 Gen Motors Corp Manufacture of semiconductor devices
BE575275A (https=) * 1958-02-03 1900-01-01
NL241492A (https=) * 1958-07-21
NL242265A (https=) * 1958-09-30 1900-01-01

Also Published As

Publication number Publication date
FR1374985A (fr) 1964-10-16
NL279651A (nl) 1964-11-25
CH400371A (de) 1965-10-15
US3233309A (en) 1966-02-08
SE218102C1 (sv) 1968-01-09
JPS4820946B1 (https=) 1973-06-25
DE1172378B (de) 1964-06-18
BE620118A (fr) 1963-01-14

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