FR1374985A - Procédé de fabrication d'un système à semi-conducteur électriquement asymétrique - Google Patents

Procédé de fabrication d'un système à semi-conducteur électriquement asymétrique

Info

Publication number
FR1374985A
FR1374985A FR903841A FR903841A FR1374985A FR 1374985 A FR1374985 A FR 1374985A FR 903841 A FR903841 A FR 903841A FR 903841 A FR903841 A FR 903841A FR 1374985 A FR1374985 A FR 1374985A
Authority
FR
France
Prior art keywords
manufacturing
semiconductor system
asymmetric semiconductor
electrically asymmetric
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR903841A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DES74813A external-priority patent/DE1172378B/de
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Priority to FR903841A priority Critical patent/FR1374985A/fr
Application granted granted Critical
Publication of FR1374985A publication Critical patent/FR1374985A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/01063—Europium [Eu]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
FR903841A 1961-07-14 1962-07-12 Procédé de fabrication d'un système à semi-conducteur électriquement asymétrique Expired FR1374985A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR903841A FR1374985A (fr) 1961-07-14 1962-07-12 Procédé de fabrication d'un système à semi-conducteur électriquement asymétrique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES74813A DE1172378B (de) 1961-07-14 1961-07-14 Verfahren zur Herstellung einer elektrisch unsymmetrisch leitenden Halbleiteranordnung
FR903841A FR1374985A (fr) 1961-07-14 1962-07-12 Procédé de fabrication d'un système à semi-conducteur électriquement asymétrique

Publications (1)

Publication Number Publication Date
FR1374985A true FR1374985A (fr) 1964-10-16

Family

ID=25996520

Family Applications (1)

Application Number Title Priority Date Filing Date
FR903841A Expired FR1374985A (fr) 1961-07-14 1962-07-12 Procédé de fabrication d'un système à semi-conducteur électriquement asymétrique

Country Status (1)

Country Link
FR (1) FR1374985A (fr)

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