JPS4820946B1 - - Google Patents

Info

Publication number
JPS4820946B1
JPS4820946B1 JP37029995A JP2999562A JPS4820946B1 JP S4820946 B1 JPS4820946 B1 JP S4820946B1 JP 37029995 A JP37029995 A JP 37029995A JP 2999562 A JP2999562 A JP 2999562A JP S4820946 B1 JPS4820946 B1 JP S4820946B1
Authority
JP
Japan
Prior art keywords
semi
conductor
gold
wafer
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP37029995A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4820946B1 publication Critical patent/JPS4820946B1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
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    • H01L2924/00013—Fully indexed content
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    • H01L2924/014—Solder alloys
JP37029995A 1961-07-14 1962-07-14 Pending JPS4820946B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES74813A DE1172378B (de) 1961-07-14 1961-07-14 Verfahren zur Herstellung einer elektrisch unsymmetrisch leitenden Halbleiteranordnung

Publications (1)

Publication Number Publication Date
JPS4820946B1 true JPS4820946B1 (ja) 1973-06-25

Family

ID=7504914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37029995A Pending JPS4820946B1 (ja) 1961-07-14 1962-07-14

Country Status (7)

Country Link
US (1) US3233309A (ja)
JP (1) JPS4820946B1 (ja)
BE (1) BE620118A (ja)
CH (1) CH400371A (ja)
DE (1) DE1172378B (ja)
GB (1) GB975987A (ja)
NL (1) NL279651A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL136731C (ja) * 1965-06-23
US3409809A (en) * 1966-04-06 1968-11-05 Irc Inc Semiconductor or write tri-layered metal contact
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
DE1935143C3 (de) * 1969-07-11 1975-04-17 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Hartlotverbindung bei Halbleiter-Bauelementen und Verfahren zu ihrer Herstellung
GB1337283A (en) * 1969-12-26 1973-11-14 Hitachi Ltd Method of manufacturing a semiconductor device
US3614547A (en) * 1970-03-16 1971-10-19 Gen Electric Tungsten barrier electrical connection
US4552301A (en) * 1984-05-17 1985-11-12 U.S. Philips Corporation Method of bonding ceramic components together or to metallic components
JPS6196410A (ja) * 1984-10-17 1986-05-15 Asahi Chem Ind Co Ltd ロ−タリ−エンコ−ダ−用デイスクの製造法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE505958A (ja) * 1950-09-21
NL95545C (ja) * 1952-04-19
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
US2794942A (en) * 1955-12-01 1957-06-04 Hughes Aircraft Co Junction type semiconductor devices and method of making the same
US2960419A (en) * 1956-02-08 1960-11-15 Siemens Ag Method and device for producing electric semiconductor devices
NL219101A (ja) * 1956-10-31 1900-01-01
US2930950A (en) * 1956-12-10 1960-03-29 Teszner Stanislas High power field-effect transistor
US2964830A (en) * 1957-01-31 1960-12-20 Westinghouse Electric Corp Silicon semiconductor devices
NL111799C (ja) * 1957-03-01 1900-01-01
US2994627A (en) * 1957-05-08 1961-08-01 Gen Motors Corp Manufacture of semiconductor devices
BE575275A (ja) * 1958-02-03 1900-01-01
NL241492A (ja) * 1958-07-21
NL242265A (ja) * 1958-09-30 1900-01-01

Also Published As

Publication number Publication date
GB975987A (en) 1964-11-25
US3233309A (en) 1966-02-08
CH400371A (de) 1965-10-15
DE1172378B (de) 1964-06-18
BE620118A (ja)
NL279651A (ja)

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