GB9721521D0 - Method of manufacturing high-frequency device - Google Patents

Method of manufacturing high-frequency device

Info

Publication number
GB9721521D0
GB9721521D0 GBGB9721521.4A GB9721521A GB9721521D0 GB 9721521 D0 GB9721521 D0 GB 9721521D0 GB 9721521 A GB9721521 A GB 9721521A GB 9721521 D0 GB9721521 D0 GB 9721521D0
Authority
GB
United Kingdom
Prior art keywords
frequency device
manufacturing high
manufacturing
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9721521.4A
Other versions
GB2318690B (en
GB2318690A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17893929&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=GB9721521(D0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9721521D0 publication Critical patent/GB9721521D0/en
Publication of GB2318690A publication Critical patent/GB2318690A/en
Application granted granted Critical
Publication of GB2318690B publication Critical patent/GB2318690B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/006Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/64Constructional details of receivers, e.g. cabinets or dust covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1034Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3415Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
GB9721521A 1996-10-25 1997-10-13 Method of manufacturing high-frequency device Expired - Fee Related GB2318690B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30119596A JP3333811B2 (en) 1996-10-25 1996-10-25 Manufacturing method of high frequency equipment

Publications (3)

Publication Number Publication Date
GB9721521D0 true GB9721521D0 (en) 1997-12-10
GB2318690A GB2318690A (en) 1998-04-29
GB2318690B GB2318690B (en) 2001-02-07

Family

ID=17893929

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9721521A Expired - Fee Related GB2318690B (en) 1996-10-25 1997-10-13 Method of manufacturing high-frequency device

Country Status (4)

Country Link
JP (1) JP3333811B2 (en)
KR (1) KR100266725B1 (en)
GB (1) GB2318690B (en)
MY (1) MY120432A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116641A (en) * 1997-06-24 1999-01-22 Alps Electric Co Ltd High frequency connector fitting structure
DE10326388A1 (en) * 2003-01-03 2004-07-15 Rohde & Schwarz Gmbh & Co. Kg Measuring device modules and measuring device
JP3096172U (en) * 2003-02-27 2003-09-05 アルプス電気株式会社 Television tuner
JP4170862B2 (en) * 2003-09-05 2008-10-22 アルプス電気株式会社 Electronic circuit unit
CN101273673B (en) * 2005-08-30 2010-12-08 松下电器产业株式会社 Board structure and electronic device
JP4745142B2 (en) * 2006-06-09 2011-08-10 株式会社東芝 Processing method of printed wiring board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099585U (en) * 1983-12-12 1985-07-06 アルプス電気株式会社 case for electronic equipment
JPH09260884A (en) * 1996-03-18 1997-10-03 Alps Electric Co Ltd Fixing structure of printed board

Also Published As

Publication number Publication date
KR100266725B1 (en) 2000-09-15
GB2318690B (en) 2001-02-07
JP3333811B2 (en) 2002-10-15
MY120432A (en) 2005-10-31
MX9708233A (en) 1998-08-30
KR19980033128A (en) 1998-07-25
JPH10135622A (en) 1998-05-22
GB2318690A (en) 1998-04-29

Similar Documents

Publication Publication Date Title
HK1019462A1 (en) Method of fabricating an electron-emitting device
HK1019167A1 (en) Refrigeration apparatus and method of manufacturing same
GB9617780D0 (en) Method of treatment
GB2313476B (en) Method of manufacturing a mosfet
PL318452A1 (en) Method of obtaining peroxyperfluoropolyoxyalkylenes
PL330400A1 (en) Method of obtaining azacyclohexapeptides
PL320699A1 (en) Method of obtaining cephotaxime
GB2313708B (en) Method of fabricating semiconductor device
EP0713247A3 (en) Method of fabricating semiconductor device and method of fabricating high-frequency semiconductor device
GB2318690B (en) Method of manufacturing high-frequency device
PL332077A1 (en) Method of obtaining omepraole
PL313419A1 (en) Method of obtaining beta-naphtole
PL333977A1 (en) Method of obtaining benzisothiazolyn-3-ones
GB9618341D0 (en) Method of treatment
ZA973988B (en) Method of treatment
TW310120U (en) High-frequency circuit device and manufacturing method thereof
GB9724513D0 (en) Method of manufacturing coils
EP0874707A4 (en) Method of manufacturing slotted component
GB2318451B (en) Method of fabricating semiconductor device
HK1021017A1 (en) High-frequency cooker and method of manufacturing the same
PL332075A1 (en) Method of obtaining nizathidine
PL317788A1 (en) Method of obtaining 3-isocyanate-propylsilane
GB2289372B (en) Method of manufacturing semiconductor device
PL301929A1 (en) Method of obtaining epichlorohydine
KR100239411B1 (en) Method of manufacturing semiconductor device

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20081013