JPH10135622A - Manufacture of high frequency apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of deformation, looseness and backlash of terminals, by cutting selvage part of a printed wiring board material, after a frame body is engaged with the printed wiring board selvage material which covers the end portions of terminals with the selvage part, and connecting the frame body with the board mother material by using solder. SOLUTION: In a printed wiring board material 20, a selvage part 20b is formed in a unified body with a printed wiring board part 20a to which terminals are fixed, and end portions of the terminals are covered with the part 20b. A frame body is engaged with the wiring board material 20. The frame body is connected with the wiring board part 20a by using solder, and the part 20b of the wiring board material 20 is cut. When the wiring board part 20a is built in the frame body, or in the connection process using solder, the selvage part 20b is arranged, so that terminals are protected by the part 20b. Thereby deformation, looseness and backlash of the terminals can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a high-frequency device in which a printed circuit board on which electric components such as chip components and discrete components are mounted is engaged and fixed to a frame.

[0002]

2. Description of the Related Art First, an outline of the structure of a conventional high-frequency device will be described. FIG. 20 is a plan view showing a completed product of a conventional high-frequency device used for a television receiver,
FIG. 21 is a bottom view and FIG. 22 is a front view. In the figure, first, a high-frequency device A 'such as a television tuner used for a television receiver includes a frame 10 made of a flat metal material and a printed wiring board portion 20a made of a glass epoxy resin or the like. Then, the frame body 10 is formed by punching or bending.
An outer wall 11 surrounding the four sides of the formed quadrilateral, and a plurality of inner walls 12 partitioning the inside surrounded by the outer wall 11 ...
, And a plurality of legs 13 projecting downward from the inner wall 12 (see FIG. 22).

The printed wiring board 20a
Is a wiring circuit 51 having a desired pattern shape made of copper foil.
(Only a part is shown), an earth pattern 50 is provided at a specific location, and a cylindrical or prismatic chip resistor 21b or chip capacitor 21c is formed in the wiring circuit 51.
And a second surface 22a on which discrete components 22 such as a coil 22b and a transformer 22c are mounted. Further, on the second surface 22a, a plurality of terminals 31 used for inputting and outputting signals and the like are fixed so as to protrude outward along one side of the printed wiring board portion 20a. . The printed wiring board 20a is provided with a plurality of holes 24 through which the legs 13 of the frame 10 are inserted.

[0004] The frame 10 and the printed wiring board portion 20a having the above-described configuration are arranged such that the second surface 22a of the printed wiring board portion 20a on which the discrete component 22 is placed is disposed on the upper surface. It is engaged and fixed to the outer wall 11 of the frame 10. Further, the leg 1 of the frame 10 inserted into the hole 24 of the printed wiring board 20a.
3 and the ground pattern 50 of the printed wiring board 20a are connected by solder 40. As described above, the high-frequency device A ′ having the structure, for example, performs signal processing such as frequency conversion and amplification of an input signal from an antenna (not shown) of a television receiver. The terminals 31,... Are soldered to a motherboard (not shown) of the television receiver.

Next, a description will be given of a conventional manufacturing process for assembling the high-frequency device A 'configured as described above.
2 to 5 and 14 show a conventional method for manufacturing the high-frequency device.
This will be described in detail with reference to FIG. FIG. 2 is a plan view showing a conventional printed wiring board base material coated with primary cream solder, FIG. 3 is a plan view showing a state where chip components are mounted on a conventional printed wiring board base material, and FIG. 1 is a plan view showing a printed wiring board base material to which the secondary cream solder is applied, FIG. 5 is a plan view showing a state where discrete components are mounted on a conventional printed wiring board base material, and FIG.
FIG. 4 is a diagram for explaining a manufacturing process of a conventional high-frequency device, and FIG.
5 is a plan view showing a state in which a bridge portion of a conventional printed wiring board base material is cut, FIG. 16 is a partially enlarged view illustrating a state in which a bridge portion of the printed wiring board base material in FIG. 15 is cut,
FIG. 17 is an exploded perspective view showing a state where a conventional printed wiring board base material and a frame are engaged, and FIG. 18 is a plan view showing a state where a conventional printed wiring board base material and a frame are engaged. FIG. 19 is a bottom view showing a state where a conventional tertiary cream solder is applied.

First, as shown in FIG. 14 for explaining the manufacturing process in FIG. 14 and a plan view showing a printed wiring board base material to which the primary cream solder is applied in FIG. This is a step of applying a primary (first) cream solder to the first surface 21a of the base material 20. This application is performed at a predetermined place (not shown) where the electric component 21 is placed.

[0007] Next, as shown in FIG. 3, a second step 2 'is a printed wiring board section 2 on which primary cream solder is applied.
This is a step of placing the chip-shaped electric component 21 on the first surface 21a of the first chip 21a.

Next, in a third step 3 ′, although not shown, the first surface 21 a of the printed wiring board base material 20 on which the electric component 21 is mounted is primarily (first time) in a reflow furnace. This is a step of soldering the electric component 21 by reflow.

Next, in a fourth step 4 ', as shown in FIG. 4, the printed wiring board base material 2 to which the electric parts 21 are soldered is formed.
This is a step of applying a secondary (second) cream solder to the first surface 21a of the No. 0. The place where the cream solder is applied in this step 4 'is a place where a lead wire of the discrete component 22 (see FIG. 5) such as the coil 22b and a continuous terminal are inserted.

Next, as shown in FIG. 5, a fifth step 5 'is to form a plurality of sets of continuous components 22 such as the coil 22b and the transformer 22c on the second surface 22a of the printed wiring board base material 20. 30.

Next, in a sixth step 6 ', although not shown, the printed wiring board base material 20 on which the discrete components 22 are mounted on the second surface 22a is subjected to a secondary (secondary) process in a reflow furnace. The second is a step of soldering the discrete component 22 by reflow.

Next, a seventh step 7 'is shown in FIGS.
(C) cutting the ears (bridges) of the printed wiring board base material, as shown in FIG. 7, wherein the bridging parts connect the printed wiring board parts 20a and the ear parts 20b, 20b of the printed wiring board base material 20 20c is cut with a punch (not shown). By cutting the bridging part 20c, the printed wiring board base material 20 becomes only the printed wiring board part 20a.
The cut portion of the bridging portion 20c is a location along the side end surface B of the printed wiring board portion 20a as shown in FIG.

Next, an eighth step 8 'is shown in FIGS.
Is a process of incorporating the printed wiring board portion into the frame body as shown in FIG. 3, wherein the outer walls 11, 11 and the inner walls 12,.
, A plurality of legs 13,... On a lower surface of the frame body 10, with the second surface 22 a on which the discrete component 22 of the printed wiring substrate 20 a is placed as an upper surface, 20a is assembled and engaged. At this time, the plurality of legs 13 of the frame 10 are inserted into the holes 24 of the printed wiring board 20a.

Next, a ninth step 9 'is a step of applying a tertiary (third) cream solder as shown in FIG. 19, where the cream solder 40 is applied to the first surface 21a.
Around the legs 13,... Of the frame body 10, which are inserted into the holes 24 of the printed wiring board section 20a, the soldered portions 32 of the terminals 31,. Body 1
0 conductive portion 50a between outer wall 11 and ground pattern 50
It is.

Next, a tenth step 10 ′ is a step of tertiary reflow in a reflow furnace (not shown), in which the cream solder applied in the tertiary cream solder application step is applied to the legs 13,. This is a step of soldering to the soldering portion 32. This means that the frame 10 incorporating the printed wiring board 20a coated with the cream solder 40 is
The printed wiring board 20a and the frame 10 are heated in a reflow furnace (not shown), and are heated in the reflow furnace.
Due to the heating in the reflow furnace, the cream solder 40 is turned into the leg portions 13 and the terminals 31 of the frame body 10 and the soldering portions 32 of the terminals 31.
And the wiring circuit 51 or the ground pattern 50 disposed close to the hole 24 of the printed wiring board 20a. In this step, the electric components 21 that have been soldered earlier do not fall or shift due to the surface tension of the solder.

Next, an eleventh step 11 'is a step of cutting the connection portion of the terminal (see FIG. 10), and is formed at the tip of each of the plurality of sets of the continuous terminals 30,. The connecting portion 30a is cut along the cutting line C to form one, one independent terminal 31,.

In this way, the high-frequency device A 'in which the frame 10 and the printed wiring board portion 20a to which the terminals 31,... Are fixed and engaged is manufactured and completed.

[0018]

However, in the above-mentioned conventional manufacturing method, the printed wiring board portion 20a is connected to the frame 1
Before assembling to 0, the ear 2 of the printed wiring board 20a
0b, 20b, the printed wiring board section 20
When a is incorporated into the frame body 10 or when the terminal 31 is transported to a reflow furnace, an external force is applied to the terminal 31 of the printed wiring board section 20a when the operator's finger or the like collides with the terminal 31 and the terminal 31 is deformed. The force is applied to the hole 24 of the printed wiring board portion 20a in which the soldering portion 32 is tightly fitted, so that the hole 24 is deformed and the mounting strength of the soldering portion 32 of the terminal 31 is deteriorated. there were.

In the heating by the tertiary reflow (tenth step 10 ') in the reflow furnace, the printed wiring board portion 20a is directly radiated to the entire terminal 31 by the radiant heat from the lower surface of the reflow furnace. The oxidation of the terminal 31 proceeds. The oxidized terminal 31 is attached to the high-frequency device A provided with the terminal 31 on a mother printed board (not shown), and the oxidized terminal 31 is soldered when the terminal 31 is soldered to the mother printed board. Is deteriorated, so that the solderability deteriorates, and it becomes difficult to perform stable soldering.

[0020]

According to the manufacturing method of the present invention, a lug portion is provided integrally with a printed wiring board portion to which a terminal is fixed,
A step of engaging a frame with a printed wiring board base material in which the ends of the terminals are covered with the ears, and thereafter, connecting the frame and the printed wiring board with solder And cutting the ears of the printed wiring board base material thereafter.

According to a manufacturing method of the present invention, there is provided a printed wiring board base material in which a discrete part and a terminal are fixedly attached to a printed wiring board part, an ear part is provided integrally, and an end part of the terminal is covered with the ear part. The step of engaging with the frame, and thereafter, the step of simultaneously connecting the frame, the discrete component and the terminal to the printed wiring board portion by soldering, and thereafter, Cutting the ears. Further, in the manufacturing method of the present invention, the step of connecting with the solder is performed by a reflow furnace.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a high-frequency device A according to an embodiment of the present invention will be described in detail with reference to FIGS. In the present invention, the same drawings are used for those which can be shared with the drawings described in the conventional example. Also, the same reference numerals are given to the same components as those in the related art.

FIG. 1 is a view for explaining a manufacturing process of a high-frequency device according to an embodiment of the present invention. FIG. 2 is a plan view showing a printed wiring board base material to which the primary cream solder of the present invention has been applied.
FIG. 3 is a plan view showing a state where chip components are mounted on the printed wiring board base material of the present invention. FIG. 4 is a plan view showing a printed wiring board base material coated with the secondary cream solder of the present invention. FIG. 6 is a plan view showing a state where discrete components are mounted on the printed wiring board base material of the present invention.
Is an exploded perspective view showing a state where the printed wiring board base material of the present invention is engaged with the frame, and FIG. 7 is a plan view showing a state where the printed wiring board base material of the present invention is engaged with the frame. , FIG.
FIG. 9 is a plan view showing a state where the bridge portion of the printed wiring board base material is cut from the state of FIG. 6, and FIG. 9 is a partially enlarged view illustrating a state where the bridge portion of the printed wiring board base material of FIG. 8 is cut. FIGS. 10 and 10 are partially enlarged views for explaining a state of cutting the connection portion of the terminal of the present invention. FIG. 11 is a plan view showing the high-frequency device of the present invention. FIG. 12 is a bottom view showing the high-frequency device of the present invention. FIG. 13 and FIG. 13 are front views showing the high-frequency device of the present invention.

First, as shown in FIGS. 1 to 5, the first to fifth steps 1 to 5 are the same as the above-described first to fifth steps 5 'to 5' of the conventional example. It is a process. More specifically, the first step 1 is a step of applying a primary (first) cream solder to the printed wiring board base material 20 as shown in FIG. This application is performed by printing. Here, the printed wiring board base material 20 is provided with a pair of protruding ears 20b, 20b which are connected and formed by a bridging part 20c to an edge on the longitudinal side of the substantially rectangular printed wiring board part 20a. . That is, the printed wiring board base material 20 includes a printed wiring board part 20a, ear parts 20b and 20b, and a bridging part 20c.

A hole 53 serving as a reference for forming the wiring circuit 51 and the like and the printed wiring board base material 20 are transported to the pair of ears 20b, 20b by a transport jig (not shown). An engagement hole 54 or the like that sometimes engages is provided. Further, the printed wiring board section 20a
A predetermined wiring circuit 51 (see FIG. 21) is formed on the first surface 21a of the first circuit board 21. A chip resistor 21b, a chip capacitor 21c, an integrated circuit 21d, etc. In this step, primary cream solder is applied to solder the chip-shaped electric component 21.

Next, in a second step 2, as shown in FIG. 3, the printed wiring board section 20 to which the primary cream solder has been applied
a of the electrical component 21 in the form of a chip or the like on the first surface 21a of the
Is a step of mounting. In this step 2,
The chip resistor 21b and the integrated circuit 21d are mounted on the applied cream solder using a mounter (not shown).

Next, in a third step 3, although not shown, the first surface 21a of the printed wiring board base material 20 on which the electric components 21 are mounted is firstly (first time) in a reflow furnace. This is a step of soldering the electric component 21 by reflow.

Next, in a fourth step 4, as shown in FIG. 4, the printed wiring board base material 20 to which the electric parts 21 are soldered is formed.
(Second) cream solder 40 on the first surface 21a
Is a step of applying The place where the cream solder is applied in this step 4 is the place 40a where the lead wire of the discrete component 22 (see FIG. 5) such as the coil 22b is inserted.
And a location 40b where the printed wiring board 20a is electrically connected to the frame 10, and a location 40c where the terminal 31 is electrically connected to the printed wiring board 20a.

Next, a fifth step 5 is a step of mounting the discrete component 22 on the second surface 22a of the printed wiring board base material 20, as shown in FIG. The discrete component 22 includes a coil 22b, a transformer 2
2c and an electrolytic capacitor 22d. In addition, the terminals 31 of a plurality of sets of the continuous terminals 30 connected by the connecting portion 30a are fixed by strong fitting.

As described above, the printed wiring board base material 20
Are the printed wiring board section 20a, the ear section 20b, and the bridge section 2
0c, an electric component 21 such as a chip resistor 21b or a chip capacitor 21c is mounted on a first surface 21a of the printed wiring board portion 20a, and a discrete component 22 such as a coil 22b or a transformer 22c is mounted on a second surface 22a. Is placed. One of the ear portions 20b is provided to face the plurality of sets of the continuous terminals 30 in parallel, and covers the end of the continuous terminals 30. The pair of ears 2
The electric component 21 and the discrete component 22 are not mounted on 0b and 20b.

Next, a sixth step 6 is a step of assembling the printed circuit board base material into the frame body, as shown in FIGS. 6 and 7, made of a metal material and formed by punching or bending. Outer side wall 11, inner wall 12, ... and a plurality of legs 1
The second surface 22a on which the discrete component 22 of the printed wiring board base material 20 formed in each of the above steps 1 to 5 is placed on the lower surface of the frame body 10 provided with 3,. Assemble and engage. The legs 13 of the inner wall 12 of the frame 10 are inserted into the holes 24 of the printed wiring board 20a.

Next, a seventh step 7 is a secondary (second) reflow step (not shown) in a reflow furnace.
The printed wiring board base material 2 coated with cream solder
0 is heated in a one-sided reflow furnace (not shown) and soldered. This solder connection is made by the discrete component 22
The frame 10 is soldered to the printed wiring board portion 20a at the same time as the terminals and the terminals 31 are soldered to the printed wiring board portion 20a. The heating in the single-sided reflow furnace is performed in the reflow furnace such that the first surface 21a of the printed wiring board base material 20 on which the electric component 21 such as the chip resistor 21a is placed faces downward. It is done by loading. In the heating in the reflow furnace, the printed wiring board base material 20 is heated by radiant heat from the bottom in the furnace. At this time, the lugs 20b, which are arranged opposite to the continuous terminals 30 in parallel, directly receive the radiant heat from the bottom surface of the reflow furnace. To protect the continuous terminal 3
0 does not directly receive the radiant heat from the bottom of the reflow furnace.

Further, by the soldering in the single-sided reflow furnace, the ground pattern 50 and the through groove 23 of the printed wiring board 20a and the leg 13 of the frame 10 are electrically connected as described above (FIG. 12). And the discrete component 2 placed on the printed wiring board 20a at the same time.
2 and terminals 31 are electrically connected by soldering. Here, the high-frequency device A taken out of the single-sided reflow furnace is composed of the printed wiring board base material 20 having the ear portions 20 b and the continuous terminals 30 and the frame 10 as described above.

Next, an eighth step 8 is a step of cutting the lugs of the printed wiring board base material, and as shown in FIGS. 8 and 9, the printed wiring board section 20a and the bridging section 20c are connected to each other. The pair of ears 20b, 20b are cut along the cutting line D from the bridging part 20c by a punch (not shown), and the ears 20b, 20b are connected to the printed wiring board part 20.
a. The position of the cutting line D is a position slightly away from the outer wall 11 (distance: L1 is about 1 mm) because the cutting is performed with a punch.

Finally, a ninth step 9 is a step of cutting the connection portion of the terminal, and as shown in FIG.
The connecting portions 30a at the tips of the plurality of sets of continuous terminals 30 are cut along cutting lines C, and the plurality of terminals 31
Are independent terminals 31. As described above, the assembly and manufacture of the high-frequency device A according to the embodiment of the present invention shown in FIGS. 11 to 13 are completed by the first to ninth steps 1 to 9. The difference in the outer shape between the conventional high-frequency device A ′ and the high-frequency device A according to the present invention is a difference in the cutting position at the bridge portion 20c when the ear portion 20b is cut from the printed wiring board portion 20a. Then, although not shown, the upper and lower covers made of a flat metal material are locked to the upper and lower surfaces of the frame 10, respectively, and the high-frequency device is completed.

In the embodiment of the present invention, the number of steps is nine, which is smaller by two (tertiary cream solder application step and tertiary reflow step) than the eleven steps in the conventional example. In the present invention, this is achieved by simultaneously performing the step of applying solder to the printed wiring board portion and the step of reflowing the frame, discrete components and terminals, respectively. Can be manufactured.

[0037]

According to the method of manufacturing a high-frequency device of the present invention, the ears are still arranged at the time of assembling the printed wiring board into the frame and at the time of connecting with the solder. Since the terminal is protected by the ear, the external force such as the operator's finger is not directly applied to the terminal. For this reason, the deformation of the terminal, the loose fitting of the soldered portion of the terminal before the solder connection, and the rattling do not occur. Therefore, since there is no deformation of the terminal, the high-frequency device can be stably incorporated into the mother printed circuit board of the television receiver.

By employing the method of manufacturing a high-frequency device according to the present invention, the frame, the discrete component and the terminal are simultaneously connected to the printed wiring board by soldering. Since the number of steps can be reduced as compared with the case where soldering and soldering are performed in separate steps, there is an effect that an inexpensive high-frequency device can be manufactured by reducing man-hours.

Further, the step of connecting with the solder of the present invention comprises:
When the heating is performed by the reflow furnace, the ears block the radiant heat of the reflow furnace, so that the terminal is not directly heated, and thus the terminal can be prevented from being oxidized. The prevention of the oxidation of the terminal as described above has an effect that the solderability of the terminal does not deteriorate.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a manufacturing process of a high-frequency device according to an embodiment of the present invention.

FIG. 2 is a plan view showing a printed wiring board base material to which a primary cream solder according to the related art and the present invention is applied.

FIG. 3 is a plan view showing a state in which a chip component is mounted on a printed wiring board base material according to the related art and the present invention.

FIG. 4 is a plan view showing a printed wiring board base material coated with a secondary cream solder according to the related art and the present invention.

FIG. 5 is a plan view showing a state where discrete components are mounted on a printed wiring board base material according to the related art and the present invention.

FIG. 6 is an exploded perspective view showing a state in which the printed wiring board base material and the frame of the present invention are engaged with each other.

FIG. 7 is a plan view showing a state where the printed wiring board base material and the frame of the present invention are engaged.

FIG. 8 is a plan view showing a state where a bridge portion of a printed wiring board base material is cut from the state of FIG. 6;

9 is a partially enlarged view illustrating a state in which a bridge portion of the printed wiring board base material in FIG. 8 is cut.

FIG. 10 is a partially enlarged view illustrating a state in which a connection portion of a terminal according to the present invention is disconnected.

FIG. 11 is a plan view showing a high-frequency device according to the present invention.

FIG. 12 is a bottom view showing the high-frequency device of the present invention.

FIG. 13 is a front view showing the high-frequency device of the present invention.

FIG. 14 is a diagram illustrating a manufacturing process of a conventional high-frequency device.

FIG. 15 is a plan view showing a state where a bridge portion of a conventional printed wiring board base material is cut.

16 is a partially enlarged view illustrating a state in which a bridge portion of the printed wiring board base material in FIG. 15 is cut.

FIG. 17 is an exploded perspective view showing a state in which a conventional printed wiring board base material and a frame are engaged with each other.

FIG. 18 is a plan view showing a state where a conventional printed wiring board base material and a frame are engaged.

FIG. 19 is a bottom view showing a state where a conventional tertiary cream solder is applied.

FIG. 20 is a plan view showing a conventional high-frequency device.

FIG. 21 is a bottom view showing a conventional high-frequency device.

FIG. 22 is a front view showing a conventional high-frequency device.

[Explanation of symbols]

 A High-frequency device 10 Frame 11 Outer side wall 12 Inner wall 13 Leg 20 Printed wiring board base material 20a Printed wiring board 20b Ear 20c Bridge 21 Electrical component 21a First surface 22 Discrete component 22a Second surface 23 Penetration Groove 24 hole 30 continuous terminal 30a connecting part 31 terminal 32 soldering part 40 solder 50 ground pattern

Claims (3)

[Claims] 1. A step of engaging a frame with a printed wiring board base material provided with ears integrally with a printed wiring board part to which terminals are fixed, the end of the terminal being covered with the ears. And thereafter, a step of connecting the frame body and the printed wiring board section with solder, and a step of subsequently cutting the ears of the printed wiring board base material. Manufacturing method of high frequency equipment. 2. A printed wiring board base material having a lug integrally provided on a printed wiring board portion to which a discrete component and a terminal are fixed, and an end portion of the terminal covered by the ear, and a frame body. Engaging, and then, simultaneously connecting the frame, the discrete component, and the terminal to the printed wiring board by soldering, and thereafter cutting the ears of the printed wiring board base material A method for manufacturing a high-frequency device. 3. The method for manufacturing a high-frequency device according to claim 1, wherein the step of connecting with a solder is performed by a reflow furnace.