MXPA97008233A - Method for manufacturing high frequency device - Google Patents

Abstract

One method for manufacturing a high frequency device includes the steps of hooking a printed circuit board body, wherein a section of printed circuit board with a fixed terminal thereon, is integrally provided with an edge section, and the end of the terminal is covered with the edge section, with a frame, connecting the frame and the printed circuit board section by welding and then cutting the edge section of the printed circuit board body

Description

METHOD FOR MANUFACTURING HIGH FREQUENCY DEVICE BACKGROUND OF THE INVENTION FIELD OF THE INVENTION The present invention relates to a method for manufacturing a high frequency device in which a section of printed circuit board with electrical components, such as plate components and defined components mounted on the same, is hooked and fixed to a frame.

DESCRIPTION OF THE RELATED TECHNIQUE The schematic structure of a conventional high frequency device will be described first. Figure 20 is a plan view showing a finished product of a conventional high frequency device for use in a television receiver; the Figure 21 is a bottom view of the device; and Figure 22 is a front view of the device. In the figures, a high frequency device A ', such as a television tuner used in a television receiver, is composed of a frame 10 made of a flat metallic material, and a section of printed circuit board 20a made of resin epoxy glass, or its similar. The frame 10 comprises an external side wall 11 formed by stamping, bending and the like, to encircle the interior space on all sides in the square shape, a plurality of internal walls 12 for dividing the interior space surrounded by the external side wall 11. , and a plurality of support sections 13 projecting downwards from the internal walls 12 (see Fig. 22). The printed circuit board section 20a is composed of a first surface 21a, on which an electrical installation circuit 51 (shown partially) made of thin copper sheet is formed in a desired pattern, ground patterns 50 are located in positions specific, and electrical components 21, such as a cylindrical and prismatic plate rheostat 21b, a plate capacitor 21c and an integrated circuit 21d, are mounted on the electrical installation circuit 51, and a second surface 22a on which components are mounted defined 22, such as a coil 22b and a transformer 22c. In addition, a plurality of terminals 31, to be used for the input and output of signals and the like, are fixed on the second surface 22a to project outwardly along one side of the printed circuit board section 20a. Still, a plurality of holes 24, through which the support sections 13 of the frame 10 are inserted, and a through hole 23, are formed on the printed circuit board section Co or in the case of the frame 10 and the printed circuit board section 20a thus constructed, the printed circuit board section 20a engages and fi xes the outer side wall 11 of the frame 10, so that the second surface 22a with the defined components 22 mounted thereon, they look up. In addition, the support sections 13 of the frame 10 inserted into the holes 24 of the printed circuit board section 20a and the ground patterns 50 of the printed circuit board section 20a, are connected by welding 40. The device A ' High frequency, having the aforementioned structure works, for example, to subject an input signal of an antenna (not shown) of the television receiver to signal processing, such as frequency conversion and amplification. This is followed by soldering of the terminals 31 on a mother board (not shown) of the television receiver. Next, a conventional method for manufacturing the high frequency device A 'thus constructed in relation to Figures 2 to 5 and 14 to 22 will be described in detail. Figure 2 is a plan view of a conventional printed circuit board body. on which primary solder paste is applied; Figure 3 is a plan view showing the state in which the plate components are mounted on the conventional printed circuit board body; Figure 4 is a plan view of the conventional printed circuit board body onto which secondary solder paste is applied; Figure 5 is a plan view showing the state in which the defined components are mounted on the conventional printed circuit board body; Figure 14 is a diagram explaining the conventional method for manufacturing the conventional high frequency device; Figure 15 is a plan view showing the state in which the bridge sections of the conventional printed circuit board body have been cut; Figure 16 is a partially enlarged view showing the state in which the bridge sections of the printed circuit board body in Figure 15 are to be cut; Figure 17 is a schematic perspective view showing the state in which the conventional printed circuit board body and a frame are to be hooked together; Figure 18 is a plan view showing the state in which the conventional printed circuit board body and the frame have been hooked together; and Figure 19 is a bottom view showing the state in which conventional tertiary solder paste is applied. First, as shown in the diagram of Figure 14 to explain the manufacturing process and the plan view of Figure 2 showing the printed circuit board body with primary solder paste applied thereto, a first step 1 'is a step of applying primary solder paste to the first surface 21a of the printed circuit board body 20. This application is carried out at necessary positions, although not shown, where the electrical components 21 are to be mounted. Then, a second step 2 'is a step consisting of mounting the plate-like electrical components 21 on the first surface 21a of the printed circuit board section 20a with the primary solder paste applied thereto, as shown in Figure 3. A third step 3 'is a step of welding the electrical components 21 onto the first surface 21a of the printed circuit board body 20 by primary reflux in a reflow oven, even though this is not shown. A fourth step 4 'is a step of applying secondary solder paste to the first surface 21a of the printed circuit board body 20 to which the electrical components 21 are welded, as shown in Figure 4. In this step 4 ', the solder paste is applied to points where the main conductors of the defined components 22 are inserted, such as the aforementioned coil 22b (see Figure 5) and the continuous terminals. A fifth step 5 'is a step consisting in mounting the defined components 22, such as the coil 22b and the transformer 22c, and a plurality of continuous terminals 30 on the second surface 22a of the printed circuit board body 20, as shown in FIG. shows in Figure 5.

A sixth step 6 'is a step of welding the defined components 22 onto the second surface 22a of the printed circuit board body 20 by secondary reflow in the reflow oven, even though this is not shown. A seventh step 7 'is a step consisting of cutting edge sections (bridge sections) of the printed circuit board body as shown in Figures 15 and IB, where the previous bridge sections 20c for connecting the section of printed circuit board 20a and edge sections 20b of printed circuit board body 20, are cut with a punch (not shown). Only the printed circuit board section 20a remains in the printed circuit board body 20 after cutting the bridge sections 20c. The bridge sections 20c are each cut along a side edge B of the printed circuit board section 20a, as shown in Figure 16. Next, an eighth step 8 'is a step consisting of incorporating the printed circuit board section 20a in the frame 10 as shown in Figures 17 and 18. The printed circuit board section 20a is incorporated in, and engaged with, the lower side of the frame 10 equipped with the side walls 11, the inner walls 12, and the plurality of support sections 13, so that the second surface 22a of the printed circuit board section 20a having the defined components 22 mounted on the surface, will go upwards. At this time, the plurality of support sections 13 of the frame 10 are inserted through the holes 24 of the printed circuit board section 20a. Then, a ninth step 9 'is a step of applying tertiary solder paste as shown in Figure 19. The solder paste 40 is applied to peripheral portions of the support sections 13 of the frame 10 inserted through the bases. holes 24 of the printed circuit board section 20a and welded sections 32 of the terminals 31, and electrically connecting the sections 50a between the outer side walls 11 of the frame 10 and the ground patterns 50, which are located on the first surface 21a . A tenth step 10 'is a tertiary reflux step in the reflow oven, even though this is not shown. The solder paste applied in the tertiary solder paste application step, is fixed in the support sections 13 and the welded sections 32. In this step the frame 10, in which the printed circuit board section 20a is incorporated which has the solder paste 40 on it, is charged in the reflow oven (not shown), and the printed circuit board section 20a and the frame 10 are heated in the reflow oven. By heating in the reflow oven, the solder paste 40 connects and fixes the support sections 13 of the frame 10 and the welded sections 32 of the terminals 31, and the electrical installation circuit 51 or the ground patterns 50 located near of the holes 24 of the printed circuit board section 20a. In this step, it is prevented, by surface tension of the weld and the like, that the electric components 21 that have already been welded, fall and move. Then, an eleventh step 11 'is a step that consists of cutting the connection sections of the terminals (see Figure 10), wherein a connecting section 30 formed at the main end of each continuous terminal 30 is cut along of a cutting line C, thus forming individually insulated terminals 31. Manufactured and thus concluded, is the high frequency device A ', in which the frame 10 and the printed circuit board section 20a with the terminals 31 fixed on the same, they are hooked and fixed to each other. However, in the aforementioned conventional manufacturing method, since the edge sections 20b of the printed circuit board section 20a are cut before the printed circuit board section 20a is incorporated into the frame 10When the printed circuit board section 20a is incorporated into the frame 10 or is conveyed to the reflow oven, one of the fingers of the operator or the like thereof may strike the terminals 31 of the printed circuit board section 20a, by from which external force is applied and the terminals 31 are transformed. Furthermore, the external force is exerted on the holes 24 of the printed circuit board section 20a in which the welded sections 32 of the terminals 31 are tightly adjusted, by means of which the holes 24 are transformed and the welded sections 32 of the terminals 31 show a decrease in the mounting force. Further, during heating by the tertiary reflux (the tenth step 10 ') in the reflow oven, the radiant heat from the bottom surface of the reflow oven is applied directly on all terminals 31 of the printed circuit board section 20a, and the oxidation of terminals 31 proceeds like this. When the high frequency device A 'provided with the oxidized terminals 31 is incorporated in a printed motherboard (not shown), and the terminals 31 are welded on the printed motherboard, since the oxidized terminals 31 have deteriorated, the capacity The welding of the same decreases, which makes it difficult to achieve a stable welding.

BRIEF DESCRIPTION OF THE INVENTION In accordance with one aspect of the present invention, a method for manufacturing a high frequency device is provided, comprising the steps of engaging a printed circuit board body, wherein a section of printed circuit board with a fixed terminal on it, it is provided integrally with an edge section, and the end of the terminal is covered with the edge section, with a frame, subsequently connecting the frame and the printed circuit board section by welding, and subsequently cutting the edge section of printed circuit board body. In accordance with another aspect of the present invention, there is provided a method for manufacturing a high frequency device, comprising the steps of engaging a printed circuit board body, wherein a section of printed circuit board with a defined component and a fixed terminal thereon, is provided integrally with an edge section, and the end of the terminal is covered with the edge section, with a frame, subsequently connecting and simultaneously the frame, the defined component and the terminal to the section of printed circuit board by welding, and subsequently cutting the edge section of the printed circuit board body. In the manufacturing method of the present invention, the connection step by welding is carried out by a reflow oven.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a diagram showing a method of manufacturing a high frequency device in accordance with an embodiment of the present invention. Figure 2 is a plan view of a printed circuit board body of the prior art and of the present invention on which primary solder paste is applied. Figure 3 is a plan view showing the state in which the plate components are mounted on the printed circuit board body of the prior art and of the present invention. Figure 4 is a plan vieta of the printed circuit board body of the prior art and of the present invention on which secondary solder paste is applied. Figure 5 is a plan view showing the state in which the defined components are mounted on the printed circuit board body of the prior art and of the present invention. Figure 6 is a schematic perspective view showing the state in which the printed circuit board body and a frame of the present invention are to be hooked.

Figure 7 is a plan view showing the state in which the printed circuit board body and the frame of the present invention have been engaged with each other. Figure 8 is a plan view showing the state in which the bridge sections of the printed circuit board body shown in Figure 6 have been cut. Figure 9 is a partially enlarged view showing the state in which the bridge sections of the printed circuit board body shown in Figure 8 are to be cut. Figure 10 is a partially enlarged view showing the state in which the connection sections of the terminals of the present invention are to be cut. Figure 11 is a plan view of a high frequency device in accordance with the present invention. Figure 12 is a bottom view of the high frequency device in accordance with the present invention. Figure 13 is a front view of the high frequency device according to the present invention. Figure 14 is a diagram showing a conventional method of manufacturing the high frequency device. Figure 15 is a plan view showing the state in which the bridge sections of a conventional printed circuit board body have been cut. Figure 16 is a partially view increased showing the state in which the bridge sections of the printed circuit board body of Figure 15 are to be cut. Figure 17 is a schematic perspective view showing the state in which the conventional printed circuit board body and frame are to be engaged with each other. Figure 18 is a plan view showing the state in which the conventional printed circuit board body and frame have been hooked together. Figure 19 is a bottom view showing the state in which conventional tertiary solder paste is applied. Figure 20 is a plan view of a conventional high frequency device. Figure 21 is a bottom view of the conventional high frequency device. Figure 22 is a front view of the conventional high frequency device.

DESCRIPTION OF THE PREFERRED MODALITY Referring to Figures 1 to 13, a method for manufacturing a high frequency device A according to an embodiment of the present invention will be described in detail. Some of the prior art figures that can be shared are also used in the description of the present invention. In addition, the same components as in the prior art receive the same reference numbers. Figure 1 is a diagram showing a method of manufacturing a high frequency device in accordance with one embodiment of the present invention; Figure 2 is a plan view of a printed circuit board body of the present invention on which primary solder paste is applied; Figure 3 is a plan view showing the state in which the plate components are mounted on the printed circuit board body of the present invention; Figure 4 is a plan view of the printed circuit board body of the present invention on which secondary solder paste is applied; Figure 5 is a plan view showing the state in which the defined components are mounted on the printed circuit board body of the present invention; the figure 6 is a schematic perspective view showing the state in which the printed circuit board body and a frame of the present invention are to be hooked together; the figure 7 is a plan view showing the state in which the printed circuit board body and the frame of the present invention have been engaged with each other; Figure 8 is a plan view showing the state at which the bridge sections of the printed circuit board body shown in Figure 6 have been cut; Figure 9 is a partially enlarged view showing the state in which the bridge sections of the printed circuit board body shown in Figure 8 are to be cut; Figure 10 is a partially enlarged view showing the state in which the connection sections of the terminals of the present invention are to be cut; Figure 11 is a plan view of a high frequency device in accordance with the present invention; Figure 12 is a bottom view of the high frequency device of the present invention; and Figure 13 is a front view of the high frequency device of the present invention. First, as shown in Figures 1 to 5, the first to fifth steps 1 to 5 are the same as the first to fifth steps 1 'to 5' of the prior art mentioned above. Specifically, the first * step 1 is a step of applying primary solder paste to a printed circuit board body 20 as shown in Figure 2. This application was made by printing. The printed circuit board body 20 is provided with a pair of edge sections 20b projected and connected through bridge sections 20c to the longitudinal side edges of an almost rectangular printed circuit board section 20a. In other words, the printed circuit board body 20 comprises the printed circuit board section 20a, the edge sections 20b and the bridge sections 20c. The pair of edge sections 20b is provided with holes 53 that serve as a reference point to form an electrical installation 51 and the like thereof, engaging the holes 54 to be engaged with a transport jig (not shown) during body transport. of printed circuit board 20 through the use of the transport template, and the like. In addition, a necessary electrical installation 51 (see Figure 21) is formed on a first surface 21a of the printed circuit board section 20a. This step applies primary solder paste to solder plate-like electrical components 21, such as plate rheostats 21b, plate capacitors 21c and integrated circuits 21d, mounted corresponding to the electrical installation 51. Next, the second step 2 is a step consisting in assembling, as shown in Figure 3, the electrical components 21 similar to plates on the first surface 21a of the printed circuit board section 0a on which primary solder paste is applied. In this step 2, the plate rheostats 21b, the integrated circuits 21d and the like, are mounted on the applied solder paste using a non-schematized assembler. The third step 3, although not schematized, is a step that consists of welding the electrical components 21 onto the first surface 21a of the printed circuit board body 20, on which the electrical components 21 are mounted, by primary reflow in a Reflux oven. The fourth step 4 is a step that involves applying secondary solder paste 40 on the first surface 21a of the printed circuit board body 20, on which the electrical components 21 are sold, as shown in Figure 4. In this step 4, the solder paste is applied at points 40a, where prino-couple conductors of the defined components 22 (see Figure 5) such as coils 22 are inserted, dots 40b where the printed circuit board section 20a is connected electrically to a frame 10, and points 40c where the terminals 31 are electrically connected to the printed circuit board section 20a. The fifth step 5 is a step consisting of mounting the defined components 22 on a second surface 22a of the printed circuit board body 20 as shown in Figure 5. The defined components 22 include the coils 22b, the transformers 22c , the electrolytic capacitors 22d, and the like. In addition, the terminals 31 of each of a plurality of continuous terminals 30, are connected by a connection section 30a, and fixed on the same by firm adjustment. As mentioned above, the printed circuit board body 20 comprises the printed circuit board section 20a, the edge sections 20b and the bridge sections 20c, and the electrical components 21 such as the plate resistors 21b and the capacitors of plate 21c, and defined components 22 such as coils 22b and transformers 22c, are mounted on first surface 21a and second surface 22a of printed circuit board section 20a, respectively. One of the edge sections 20b is located opposite to, and parallel with, the plurality of continuous terminals 30 to cover the ends of the continuous terminals 30. The electrical components 21 and the defined components 22 are not mounted on the pair of sections of edge 20b. Then, a sixth step 6 is a step that consists of incorporating the printed circuit board body 20 into the frame 10. As shown in Figures 6 and 7, the printed circuit board body 20 formed in the aforementioned steps 1 to 5 is incorporated in, and engaged with, the underside of the frame 10 provided with external side walls 11 and internal walls 12 which are each made of a metallic material and formed by stamping and bending, a plurality of sections of support 13 and the like, so that the second surface 22a thereof, with the defined assembled components 22, faces upwards. The support sections 13 of the internal walls 12 of the frame 10 are inserted into the holes 24 of the printed circuit board section 20a. Then, the seventh step 7 is a secondary reflow step in a reflow oven, even when not shown, wherein the printed circuit board body 20 with the solder paste applied thereto, is heated and solidified. by a unilateral reflow oven (not shown). This weld is for welding the defined components 22 and terminals 31 on the printed circuit board section 20a and, simultaneously, to weld the frame 10 to the printed circuit board section 20a. Heating by the unilateral reflow oven is carried out while the printed circuit board body 20 is loaded in the unilateral reflow oven, so that the first surface 21a thereof having the assembled electrical components 21, such With the plate rheostats 21a, look down. During heating in the reflow oven, the printed circuit board body 20 is heated by radiant heat from the internal base of the oven. At this time, the edge section 20b located opposite to, and parallel to, the continuous terminals 30, directly receives radiant heat from the base of the reflow oven, i.e., protects the continuous terminals 30 from the radiant heat. Therefore, the continuous terminals 30 do not directly receive radiant heat from the base of the reflow oven. During welding in the unilateral reflow furnace, the ground standards 50 and a through slot 23 of the printed circuit board section 20a are electrically connected to the support sections 13 of the frame 10 (see Figure 12) as shown in FIG. I mentioned above and, simultaneously, the defined components 22 and the terminals 31 mounted on the printed circuit board section 20a are electrically connected by welding. The high frequency device A extracted from the unilateral reflow oven is composed of the printed circuit board body 20, which is provided with the edge sections 20b and the continuous terminals 30, as well as the frame 10, as mentioned above. previously. Then, an eighth step 8 is (step that consists of cutting out the edge sections of the printed circuit board body.) As shown in Figures 8 and 9, the pair of edge sections 20b connected to the section of printed circuit board 20a through the bridge sections 20c are respectively cut out from the bridge sections 20c along the cutting lines D with a punch (not shown), and separated from the circuit board section The cutting lines D are each located at a small distance from the outer side wall 11 (the distance Ll is approximately 1 mm) relative to the cutting with the punch Finally, a ninth step 9 is a step It consists of cutting the connection sections of the terminals, wherein the connection section 30a at the main end of each continuous terminal 30 composed of a plurality of terminals 31, is cut along a cutting line C as shown in FIG. shown in Figure 10, and the plurality of terminals 31 are each insulated. As mentioned above, the assembly and fabrication of the high frequency device ft shown in Figures 11 to 13 in accordance with the embodiment of the present invention, concludes in the first to ninth steps 1 to 9. The extrinsic difference between the conventional high frequency device A 'and the high frequency device A of the present invention is in the cutting position on the bridge section C, where the edge section 20b is cut out of the section printed circuit board 20a. Although not shown, the upper and lower covers, each made of a flat metal material, are retained on the upper and lower sides of the frame 10, respectively, by means of which the high frequency device is terminated. The number of steps in the embodiment of the present invention is nine, which is two steps (the application step of tertiary solder paste and the tertiary reflux step) I less than the eleven steps in the prior art. This is because the application of welding on the printed circuit board section and the reflow for the frame, the defined components and the terminals, are carried out simultaneously in the present invention. This step reduction also reduces the manufacturing cost of the high frequency A device.

'? ? In accordance with the manufacturing method of the high frequency device of the present invention, since the edge sections remain in the steps of incorporating the printed circuit board section into the frame and welding to it, the terminals are protected by the edge sections and, therefore, some external force is rarely directly applied to the terminals by some of the operator's fingers. This prevents the transformation of the terminals and the jingle due to the pressureless adjustment of the welded sections of the terminals before welding. Accordingly, the high frequency device can be stably incorporated into the printed motherboard of a television receiver. In accordance with the method of manufacturing the high frequency device of the present invention, since the frame, the defined components and the terminals will be soldered simultaneously on the printed circuit board section, the number of steps is smaller than that of the prior art, in which the defined components, and the frame and terminals, are welded in separate steps. The reduction of steps allows to manufacture an economic high frequency device. Further, if the heating by the reflow oven is carried out with the connecting step by welding of the present invention, the edge sections block the radiant heat of the reflow oven, so that the terminals do not heat directly and the oxidation of them is prevented. Said prevention of the oxidation of the terminals also prevents the solder capacity of the terminals from decreasing.

Claims (4)

NOVELTY OF THE INVENTION CLAIMS

1. - A method for manufacturing a high frequency device, comprising the steps of: engaging a printed circuit board body, wherein a section of printed circuit board with a fixed terminal thereon, is provided integrally with an edge section, and the end of said terminal is covered with said edge section, with a frame; subsequently connecting said frame and said printed circuit board section by soldering; and subsequently cutting said edge section of said printed circuit board body.

2. A method for manufacturing a high frequency device according to claim 1, wherein said connection step by welding is carried out by means of a reflow oven.

3. A method for manufacturing a high-frequency device, comprising the steps of: engaging a printed circuit board body, wherein a section of printed circuit board with a defined component and a fixed terminal thereon, provides integrally with an edge section, and the end of said terminal is covered with said edge section, with a frame; connecting subsequently and simultaneously said frame, said defined component and said terminal, said section of printed circuit board by welding; and cutting - subsequently said edge section of said printed circuit board body.

4. A method for manufacturing a high-frequency device according to claim 3, wherein said connecting step by welding is carried out by means of a reflow oven.