JP2627576B2 - Method of manufacturing terminal lead for hybrid integrated circuit device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a terminal lead for a hybrid integrated circuit device, which is convenient when the hybrid integrated circuit device is mounted on a mother circuit board.

2. Description of the Related Art In recent years, electronic devices equipped with a hybrid integrated circuit device and the like have been demanded to be small, lightweight, and reliable.

[Conventional technology]

FIG. 11 is an explanatory view showing a state in which a hybrid integrated circuit device in a conventional example is mounted on a mother circuit board.

In FIG. 11, a wiring pattern (not shown) and a land electrode 22 connected to the wiring pattern are formed on the main surface of the mother circuit board 21. A hybrid integrated circuit device or an electronic circuit component (not shown) is mounted on the wiring pattern.

On the other hand, on the main surface of the insulating substrate in the hybrid integrated circuit device 23, a land electrode 25 and a predetermined wiring pattern (not shown) are formed by thick film printing. And
In the hybrid integrated circuit device 23, a plurality of external connection terminal leads 24 connected to the land electrodes 25 are led out from two end edges facing each other.

In order to mount the dual in-line hybrid integrated circuit device 23 on which the electronic components as described above are mounted on the mother circuit board 21, the hybrid integrated circuit device 23 having the terminal leads 24 is mounted on the land electrodes 22 via cream solder. And then
For example, a reflow process is performed. In this way, the mother circuit board 21 and the hybrid integrated circuit device 23 are mechanically and electrically connected.

[Problems to be solved by the invention]

In order to mechanically and electrically connect the mother circuit board 21 and the hybrid integrated circuit device 23 as described above, the terminal leads 24 for external connection must be individually arranged. Thereafter, the terminal leads 24 are connected one by one. But,
If the terminal leads 24 are, for example, as shown in FIG. 12, a mounting failure occurs. In other words, even if the hybrid integrated circuit device 23 is moved to the correct position, if there is only one terminal lead 24 for external connection that is not aligned as described above, the mounting will be defective. Also, the mother circuit board
After mounting the hybrid integrated circuit device 23 on 21, for example,
If the hybrid integrated circuit device 23 falls during operation or if a force is applied to the substrate surface of the hybrid integrated circuit device 23 in a horizontal direction due to any cause, the terminal leads 24 of the hybrid integrated circuit device 23 are fragile and bent. Thus, the hybrid integrated circuit device 23 is inclined. In such a case, the wiring pattern of the mother circuit board 21 may come into contact with the wiring pattern of the hybrid integrated circuit device 23 to cause a short circuit accident.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a terminal lead for a hybrid integrated circuit device which is convenient when attaching a terminal lead to the hybrid integrated circuit device.

[Means for solving the problem]

To achieve the object, of the present invention, a wiring pattern is formed on a main surface of an insulating substrate, and a land electrode is formed along at least one side edge of the insulating substrate,
The method of manufacturing a terminal lead for a hybrid integrated circuit device in which an electronic circuit component is mounted on the wiring pattern has a shape in which at least one terminal lead connected to the land electrode can be turned around the entire peripheral surface of the prism member. A first step of molding, a second step of expanding an open portion formed at an end of the terminal lead, a third step of sequentially placing the terminal lead in a state where the open portion is expanded on a prism member, and pressing. And a fourth step of pressing the terminal lead against the prism member by a member.

In the method of manufacturing a terminal lead for a hybrid integrated circuit device according to the present invention, the terminal lead is pressed by a groove formed in the prism member.

According to the present invention, a wiring pattern is formed on the main surface of the insulating substrate, and a land electrode is formed along at least one side edge of the insulating substrate, and an electronic circuit component is mounted on the wiring pattern. A method of manufacturing a terminal lead for a hybrid integrated circuit device includes a first step of forming a lead frame including a desired number of terminal leads and a frame portion connecting both ends of the terminal lead, and disposing the lead frame at substantially equal intervals as the prism member A second step of placing the lead frame so as to be passed over the two pressed blocks, and by pressing the prism member,
A third step of pressing the lead frame between the pressing blocks to form the lead frame into a U-shape, a fourth step of cutting the frame portion of the lead frame, and both ends of the terminal lead on the peripheral surface of the prism member. And a fifth step of rotating the portion.

[Action]

Since the plurality of terminal leads have grooves formed on the plurality of side surfaces of the prism member, they are hardly displaced at the time of mounting, and there is no short circuit between adjacent terminals.

The prismatic member having the terminal lead having such a configuration has no orientation and can be handled by an automatic mounter like one electronic circuit component. Therefore, a conventional hybrid integrated circuit device in which terminal leads must be aligned one by one. The productivity is improved as compared with. Further, as described above, since the terminal lead is wrapped around and attached to the prism member, the terminal lead can be reliably disposed at an arbitrary position of the prism member.

Further, the hybrid integrated circuit device in which the terminal lead made of the prism member is arranged along the edge of at least one side surface,
Even if it is dropped or receives any impact, it is protected by the prism members provided at the edges and has sufficient strength to withstand the impact.

The prism member may have, for example, a square cross section or a rectangular cross section. The height or effective area of the hybrid integrated circuit device can be arbitrarily set by selecting the width of the prism member having a rectangular cross section in the vertical and horizontal directions.

Furthermore, the prismatic member formed of a heat-resistant insulating member, for example, ceramic, not only has a high resistance to a force perpendicular to the hybrid integrated circuit device, but also connects the prismatic member to the hybrid integrated circuit device or the mother circuit board. It is convenient when performing the reflow process.

Further, since the groove is formed at the position where the terminal lead of the prism member is arranged, the positioning of the terminal lead to be attached to the prism member is facilitated, and the terminal lead is hardly shifted from a predetermined position.

〔Example〕

One embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a hybrid integrated circuit device according to the present invention, FIG. 2 is a cross-sectional view of the hybrid integrated circuit device according to the present invention, and FIG.

In the figure, a hybrid integrated circuit device 1 is, for example, an insulating substrate made of ceramic, and a conductor paste is screen-printed on both surfaces thereof in a predetermined pattern, and then baked to form a land electrode 4 and a wiring (not shown). A pattern is formed. Then, a surface mount electronic circuit component 5 such as an integrated circuit device is mounted on the wiring pattern.

In the hybrid integrated circuit device 1, prism members 2 having terminal leads 3 are attached to at least both side edges. The prism member 2 is made of, for example, a heat-resistant insulating member capable of withstanding reflow soldering described later, and the terminal lead 3 is attached as described later. And
The terminal lead 3 and the land electrode 4 of the hybrid integrated circuit device 1 are connected by reflow soldering. When connecting the terminal lead 3 and the hybrid integrated circuit device 1, there is a step between one end surface of the terminal lead 3 and the prism member 2, so that a space is generated between the terminal leads 3.

The space serves to prevent the adjacent terminal lead 3 from being short-circuited. In particular, in the hybrid integrated circuit device having a prismatic member provided with the terminal lead 3, the opening 8 of the terminal lead 3 is placed on the land electrode of the mother circuit board (not shown) when connecting to the mother circuit board. .

The land electrodes of the mother circuit board and the terminal leads 3 are connected by solder, but excess solder enters the opening 8 and does not short-circuit with the adjacent terminal leads 3.

Next, the step of attaching the terminal lead to the prism member according to the present invention will be described with reference to FIGS.

The prism member 2 is an insulating member and can be arbitrarily selected such as a square or rectangular cross section. This selection can change the height of the hybrid integrated circuit device or the effective area on the hybrid integrated circuit board 1 where electronic circuit components, wiring patterns, land electrodes, and the like are provided.

The terminal lead 3 is made of, for example, a tin-plated copper wire member, and is mounted so as to orbit along the peripheral surface of the prism member 2 as described above.

Further, for example, as shown in FIG. 4 (a), the terminal lead 3 is formed in a shape having an opening 8 at the lower end.
The cross section of the terminal lead 3 can be a round, square, or rectangular conductor.

Next, the upper portion of the terminal lead 3 having the shape shown in FIG. 4 (a) is formed as a bent portion 8 ', and the terminal lead 3 is opened in the direction of the arrows at both ends shown in FIG. 4 (b).

On the other hand, an adhesive is applied in advance to the position where the terminal leads 3 of the prism member 2 are arranged. Therefore, the terminal lead 3 whose lower end is widened by the automatic machine is automatically placed at the position of the prism member 2 where the adhesive is applied.

Thereafter, the pressing members 9 to 11 simultaneously press the periphery of the terminal lead 3 from the directions of the arrows at both ends and the upper end shown in FIG. 4 (c), or after the pressing member 9 presses the upper part of the terminal lead 3, the pressing members 10 and 11 Also presses the sides from both sides. Due to such pressing, the terminal lead 3 is mounted around the peripheral surface of the prism member 2 as shown in FIG.

When the terminal lead 3 is placed on the prism member 2, an adhesive is applied in advance. However, the terminal lead 3 is cut into the prism member 2 by the pressing force of the pressing members 9 to 11 without applying the adhesive. be able to. Alternatively, the fourth prism member 2
(E) A groove 6 indicated by a dotted line is formed as shown in FIG.
The terminal lead 3 may be pushed into the groove 6.

Another embodiment of the prism member 2 will be described with reference to FIG. In FIG. 5, the groove 6 can be formed in advance in the prism member 2 at a position where the terminal lead 3 is arranged. When the groove 6 is provided in this manner, the terminal lead 3
Is not easily dislocated, and the excess solder does not enter the gap of the groove 6 due to its surface tension and short-circuit the adjacent terminal leads 3.

Another embodiment of the hybrid integrated circuit device will be described with reference to FIG. In FIG. 6, prism members 2 provided with two sets (terminal members 2 and 2 and prism members 2 'and 2') of terminal leads 3 facing each other are provided at the edges of the hybrid integrated circuit board 1 '. .

Another method of attaching the terminal lead to the prism member will be described with reference to FIGS. 7 to 10 (a) and (b).

In FIG. 7, a lead frame 14 is formed by pressing from a metal strip member so as to be constituted by a desired number of terminal leads 3 and a frame portion 16 to which both ends are connected. The opening 15 is a pilot hole in the above-described press working or the like. The lead frame 14 thus formed is placed so as to be inserted between the pressing blocks 17, 17 'corresponding to a press die as shown in FIG. The pressing blocks 17, 17 ′ are arranged slightly narrower than the interval between one side surfaces of the prism member 2.

Next, the prism member 2 is pushed between the pressing blocks 17 and 17 'by a pressing member (not shown) as shown in FIGS. 9 (a) and 10 (a). Due to the pressing of the prism member 2, the terminal leads 3 of the lead frame 14 are moved along three side surfaces of the prism member 2. Then, both end portions of the terminal lead 3 and the connected frame portion 16 are led out from between the pressing blocks 17, 17 'and the prism member 2.

Thereafter, in the lead frame 14, the frame portion 16 connecting the terminal leads 3 is cut by a press or the like. Then, both ends of the terminal lead 3 are shown in FIG.
As shown, it is bent by pressing members 18 and 18 'so as to go around one side surface of the prism member 2, and is formed as shown in FIG. 9 (b). When the terminal lead 3 is pressed and formed in a U-shape, as shown in FIG. 10 (a), one is fixed by a pin 19 so that the lead frame 14 does not move.
As shown in FIG. 10 (b), only the other can be bent.

The mounting of the terminal lead 3 on the prism member 2 is performed by pressing a pressing member.
Although it is tightened by pressing at 18 and 18 ', an adhesive can be applied to the prism member 2 in advance, or a double-sided adhesive film can be adhered. By doing so, even if an excessive external force is applied to the prism member 2 and the terminal lead 3, the positional relationship between the two does not deviate.

When the terminal lead 3 is attached to the prism member 2 using the lead frame 14 as described above, the distance between the terminal leads 3 can be further reduced because there is no deviation in the positional relationship between the two.

The prism member 2 having such a terminal lead 3 is handled and attached to a hybrid integrated circuit board in the same manner as one electronic circuit component, and the hybrid integrated circuit device is similarly handled as one electronic circuit component. Handled and attached to mother circuit board.

As mentioned above, although the Example of this invention was described in full detail, this invention is not limited to the said Example. Various design changes can be made without departing from the present invention described in the appended claims.

The formation of the lead frame can be achieved by etching in addition to press working.

[Effects of the Invention] According to the present invention, the prism member having the terminal lead and the hybrid integrated circuit device to which the terminal member is attached are treated as one component, so that the terminal lead is attached to the hybrid integrated circuit device, and The mounting of the integrated circuit device on the mother circuit board can be performed quickly and accurately.

According to the present invention, since the grooves are formed on the plurality of side surfaces of the prism member, the terminal leads can be easily mounted on the prism member, and the terminal leads that are displaced during the mounting and do not short-circuit with each other are adjacent to each other. .

According to the present invention, since the prism member has no orientation, it is handled as one component by the automatic mounter. Further, since the prism member is provided along the edge of at least one side surface of the hybrid integrated circuit board, the terminal lead does not bend unlike the related art, and has a strong strength against a vertical force. .

A hybrid integrated circuit device provided with terminal leads made of a prismatic member as in the present invention protects internal electronic components against a fall accident or the like and is temporarily attached to a mother circuit board via a solder paste. During the operation, there is no displacement or short circuit between wires.

According to the present invention, since there is room for excess solder to enter between the terminal lead and the prism member or between both ends of the terminal lead, there is no short circuit with the adjacent terminal lead.

According to the present invention, since the prism member is a heat-resistant insulating member, it is convenient for the reflow process, and is resistant to a force in a vertical direction on the hybrid integrated circuit device.

[Brief description of the drawings]

FIG. 1 is a perspective view of a hybrid integrated circuit device according to the present invention, and FIG.
FIG. 3 is a cross-sectional view of a hybrid integrated circuit device according to the present invention. FIG.
(E) is an explanatory view of a process for attaching the terminal lead to the prism member in the present invention, FIG. 5 is an explanatory view of one embodiment of the prism member in the present invention, FIG. 6 is an explanatory view of another hybrid integrated circuit device in the present invention, FIG. 7 is an explanatory view of a lead frame in the present invention, FIG. 8 is an explanatory view of terminal lead forming in the present invention, FIGS. 9 (a) and 9 (b) are explanatory views of surrounding the terminal lead in the present invention around a prism member, FIGS. 10 (a) and (b) are explanatory views of another embodiment in which the terminal lead of the present invention is wrapped around a prism member, and FIG. Twelfth
The figure is an explanatory view of a terminal lead in a conventional example. DESCRIPTION OF SYMBOLS 1 ... Hybrid integrated circuit board 2 ... Square pillar member 3 ... Terminal lead 4 ... Land electrode 5 ... Electronic circuit component 6 ... Groove 7 ... Bending part 8 ... Opening part 8 '... Bending part 9 to 11: pressing member 14: lead frame 15: opening 16: frame portion 17, 17 ': pressing block 18, 18': pressing member 19: pin

Claims (3)

(57) [Claims] An electronic circuit component is formed on a main surface of an insulating substrate, and a land electrode is formed along at least one side edge of the insulating substrate. A first step of forming at least one terminal lead 3 connected to the land electrode 4 into a shape capable of rotating along the entire peripheral surface of the prism member 2. A second step of expanding the open portion 8 formed at the end of the terminal lead 3, and connecting the terminal lead 3 with the open portion 8 expanded to the prism member 2.
And a fourth step of pressing the terminal lead 3 against the prism member 2 by pressing members 9, 10, 10 '. How to make leads. 2. The method according to claim 1, wherein the terminal lead is pressed by a groove formed in the prism member. 3. A wiring pattern is formed on the main surface of the insulating substrate, and a land electrode 4 is formed along at least one side edge of the insulating substrate, and an electronic circuit component 5 is formed on the wiring pattern. A step of forming a lead frame 14 including a desired number of terminal leads 3 and a frame portion 16 for connecting both ends of the terminal leads 3 to each other; The lead frame 14 is inserted over two pressing blocks 17 and 17 ′ that are arranged at substantially the same interval as the member 2.
A second step of placing the lead frame 14 between the pressing blocks 17 and 17 ′ by pressing the prism member 2 to form the lead frame 14 into a U-shape; A fourth step of cutting the frame portion 16 of the frame 14, and a fifth step of rotating both ends of the terminal lead 3 around the peripheral surface of the prism member 2. A terminal for a hybrid integrated circuit device, comprising: How to make leads.