JP4745142B2 - Processing method of printed wiring board - Google Patents
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- JP4745142B2 JP4745142B2 JP2006161696A JP2006161696A JP4745142B2 JP 4745142 B2 JP4745142 B2 JP 4745142B2 JP 2006161696 A JP2006161696 A JP 2006161696A JP 2006161696 A JP2006161696 A JP 2006161696A JP 4745142 B2 JP4745142 B2 JP 4745142B2
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本発明は、プリント配線板の加工方法に係り、搭載した部品が溝部を覆うような設計のプリント配線板の加工方法に関する。 The present invention relates to a method for processing a printed wiring board , and more particularly to a method for processing a printed wiring board designed so that a mounted part covers a groove.
電子機器の１つであるパーソナルコンピュータ（以下、略して「パソコン」という）は、プリント配線板（Ｐｒｉｎｔｅｄ Ｗｉｒｉｎｇ Ｂｏａｒｄ）上にＣＰＵ、メモリ、制御用ＩＣ、インターフェース回路等の電子部品を搭載したプリント回路板（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ）を内蔵する。 A personal computer (hereinafter referred to as “personal computer” for short), which is one of electronic devices, is a printed circuit in which electronic components such as a CPU, a memory, a control IC, and an interface circuit are mounted on a printed wiring board (Printed Wiring Board). Built-in board (Printed Circuit Board).
携帯型のパソコンで多く用いられるプリント配線板の外形形状は複雑である。従って、電子部品である実装部品を実装機で実装する場合には、その生産性の観点から例えば長方形のプリント配線板内に上記複雑なプリント配線板を設計する。この複雑な形状のプリント配線板は予め長方形のプリント配線板から切断しやすいように外形形状に沿った溝が設けられている。両者は複数の連結片で連結されている。
このような構成にすることで実装機による実装部品の搭載後に溝に沿ってエンドミル等の加工ツールを引き回すことで上記連結部を切断し、複雑な形状のプリント配線板は、長方形のプリント配線板から切り離される。
The external shape of a printed wiring board often used in a portable personal computer is complicated. Therefore, when mounting a mounting component which is an electronic component with a mounting machine, the complex printed wiring board is designed in, for example, a rectangular printed wiring board from the viewpoint of productivity. The complicated-shaped printed wiring board is previously provided with a groove along the outer shape so as to be easily cut from the rectangular printed wiring board. Both are connected by a plurality of connecting pieces.
With such a configuration, after mounting the mounting component by the mounting machine, the connecting portion is cut by drawing a processing tool such as an end mill along the groove, and the complicated printed wiring board is a rectangular printed wiring board. Detached from.
特許文献１には複数の回路基板の相互間を切断溝で仕切ると共に、幅広連結部と幅狭連結部からなる連結片を切断溝に設け、この連結片により回路基板の相互間を連結した構成にして、連結片と回路基板との連結強度の向上、及び連結部の切断を容易にしたプリント配線板が開示されている。
しかし、特許文献１のプリント配線板においては、搭載した実装部品が溝部を覆うよう設計では、部品実装後のプリント回路板において、実装部品が加工ツールの移動を妨げ、加工ツールによる連結片の切断を効率的に行うことはできない。 However, in the printed wiring board disclosed in Patent Document 1, when the mounted component is designed to cover the groove portion, the mounted component prevents the processing tool from moving on the printed circuit board after mounting the component, and the connection piece is cut by the processing tool. Cannot be done efficiently.
そこで本発明の目的は、上記問題を解決するためになされたものであり、搭載した実装部品が溝部を覆うような設計のプリント配線板においても加工ツールによる連結片の切断の効率を維持できるプリント配線板の加工方法を提供することにある。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-described problem, and in a printed wiring board designed so that a mounted component covers a groove portion, a print that can maintain the efficiency of cutting a connecting piece by a processing tool. It is in providing the processing method of a wiring board .
上記目的を達成するために、本発明に係るプリント配線板の加工方法は、部品が搭載される第１の基板と、前記第１の基板と離間し、前記第１の基板の少なくとも一部に沿った外形を有する第２の基板と、前記第１の基板と前記第２の基板との間に設けられ、前記第１の基板と前記第２の基板とを連結する少なくとも１つの連結片と、前記第２の基板に設けられ、加工ツールの挿入が可能な径を有する孔部とを有するプリント配線板に対し、前記孔部に前記加工ツールを挿入して加工移動することで前記第２の基板と前記連結片とを加工して前記第１の基板と前記第２の基板とを分割することを特徴としている。
また、本発明に係るプリント配線板の加工方法は、部品が搭載される第１の基板と、孔部が設けられた第２の基板と、前記第１の基板と前記第２の基板とを連結した少なくとも１つの連結部と、を含むプリント配線板に対し、前記孔部から加工ツールの少なくとも一部を挿入して移動させ、前記連結部を切ることを特徴としている。
In order to achieve the above object, a printed wiring board processing method according to the present invention includes a first substrate on which a component is mounted, and the first substrate, which is spaced apart from at least a part of the first substrate. A second substrate having an outer shape along the at least one connecting piece that is provided between the first substrate and the second substrate and connects the first substrate and the second substrate; the provided in the second substrate, processing the insertion tool against the printed wiring board having a hole having a capable diameter, before by processing movement by inserting the machining tool into the hole portion SL The second substrate and the connecting piece are processed to divide the first substrate and the second substrate.
The printed wiring board processing method according to the present invention includes a first substrate on which a component is mounted, a second substrate having a hole, the first substrate, and the second substrate. The printed wiring board including at least one connected portion is connected, and at least a part of the processing tool is inserted and moved from the hole to cut the connected portion .
搭載した実装部品が溝部を覆うような設計のプリント配線板においても加工ツールによる連結片の切断の効率を維持できる。 Even in a printed wiring board designed so that the mounted component covers the groove, the cutting efficiency of the connecting piece by the processing tool can be maintained.
［第１の実施の形態］
図１は、本発明の第１の実施の形態に係るプリント配線板を内蔵したノート型パソコンの図である。このノート型パソコン１００は、プリント配線板を内蔵する本体部１０１と、本体部１０１に開閉自在に取り付けられた表示部１０２とを有している。
[First Embodiment]
FIG. 1 is a diagram of a notebook personal computer incorporating a printed wiring board according to a first embodiment of the present invention. This notebook personal computer 100 has a main body 101 containing a printed wiring board, and a display unit 102 attached to the main body 101 so as to be freely opened and closed.
本体部１０１は、上面に、キーボード１０３、フラットポイント１０４とスクロールボタン１０５とクリックボタン１０６とから構成されるポインティングデバイス、機能ボタン１０７、スピーカ１０８、電源をオン／オフ用の電源ボタン１０９等が設けられている。 The main body 101 is provided with a keyboard 103, a pointing device including a flat point 104, a scroll button 105, and a click button 106, a function button 107, a speaker 108, a power button 109 for turning on / off the power, and the like on the upper surface. It has been.
また、本体部１０１の一方の側面には、外部電源供給用の電源コネクタ１１０、マイクコネクタ１１１、イヤホンコネクタ１１２、ＬＡＮコネクタ１１３、ＵＳＢコネクタ１１４、Ｉ／Ｆコネクタ１１５等の各コネクタが設けられ、他方の側面には、図示しないＣＤ／ＤＶＤドライブ、ＰＣカード挿入口等が設けられている。 Further, on one side surface of the main body 101, connectors such as a power connector 110 for supplying external power, a microphone connector 111, an earphone connector 112, a LAN connector 113, a USB connector 114, and an I / F connector 115 are provided. On the other side, a CD / DVD drive, a PC card insertion slot and the like (not shown) are provided.
また、表示部１０２は、一方に開口部を有している。この開口部からは液晶ディスプレイ１１３が露出している。液晶ディスプレイ１１３の裏面には図示しないバックライト等が内蔵されている。 The display portion 102 has an opening on one side. The liquid crystal display 113 is exposed from this opening. A back light or the like (not shown) is built in the back surface of the liquid crystal display 113.
（プリント配線板の構成）
図２は、本発明の第１の実施の形態に係るプリント配線板を示した図である。このプリント配線板１は、主基板２と、小基板５と、捨て板６Ａ〜６Ｇと、複数の溝部３と、複数の連結片４とから構成されている。主基板２は、例えばマザーボードである。小基板５は、用途が限定された部品、例えば、外部の機器やコード類を接続するためのコネクタ等が搭載される基板である。小基板５は、比較的小サイズであり、マザーボードを補助するための基板である。小基板５は例えばサウンド基板である。捨て板６Ａ〜６Ｇは、製品には内蔵されず後述する基板の加工後は不要になる基板である。捨て板６Ａ〜６Ｇは、主基板２と小基板５のみでは長方形などの比較的簡易な形状であるプリント配線板１を構成できない場合に、この形状をなすための補完的な役割を有する。溝部３は、各基板の外形を形成する帯状の溝である。連結片４は、溝部３内に設けられ、各基板を連結する。
(Configuration of printed wiring board)
FIG. 2 is a diagram showing a printed wiring board according to the first embodiment of the present invention. The printed wiring board 1 includes a main board 2, a small board 5, discard boards 6 </ b> A to 6 </ b> G, a plurality of grooves 3, and a plurality of connecting pieces 4. The main board 2 is, for example, a mother board. The small board 5 is a board on which a component having a limited use, such as a connector for connecting an external device or cords, is mounted. The small board 5 has a relatively small size and is a board for assisting the mother board. The small board 5 is, for example, a sound board. The discard plates 6A to 6G are substrates that are not built in the product and become unnecessary after processing the substrate described later. The discard plates 6A to 6G have a complementary role for forming the printed wiring board 1 having a relatively simple shape such as a rectangle with the main substrate 2 and the small substrate 5 alone. The groove part 3 is a belt-like groove that forms the outer shape of each substrate. The connection piece 4 is provided in the groove part 3, and connects each board | substrate.
主基板２は、ＣＰＵ、ＬＳＩ、ＩＣ、メモリ、コンデンサ、抵抗、各種のコネクタ等の電子部品が搭載（実装）されることでプリント回路板を構成し、キーボード１０３の下側に配設される。主基板２は、プリント配線板１の中では大型の基板である。図１に搭載されるプリント配線板は通常多層基板であるが、本実施の形態に係るプリント配線板１は、多層板に限らず、単層板であっても良い。プリント配線板１の四隅には、部品搭載及び切削加工時に用いられる位置決め用の位置決め用孔部１０が設けられている。但し、位置決め用孔部１０は、切断を可能にするための支持孔として用いられるため、プリント配線板の種類によっては必ずしも四隅に限らず、その数や配置位置は適宜調整しても良い。 The main board 2 forms a printed circuit board by mounting (mounting) electronic components such as a CPU, LSI, IC, memory, capacitor, resistor, and various connectors, and is disposed below the keyboard 103. . The main board 2 is a large board in the printed wiring board 1. Although the printed wiring board mounted in FIG. 1 is usually a multilayer board, the printed wiring board 1 according to the present embodiment is not limited to a multilayer board and may be a single layer board. In the four corners of the printed wiring board 1, positioning hole portions 10 for positioning used during component mounting and cutting are provided. However, since the positioning hole 10 is used as a support hole for enabling cutting, it is not necessarily limited to the four corners depending on the type of the printed wiring board, and the number and arrangement position thereof may be appropriately adjusted.
主基板２は、コネクタ搭載部７を有する。このコネクタ搭載部７は、図１に示した電源コネクタ１１０、マイクコネクタ１１１、イヤホンコネクタ１１２、ＬＡＮコネクタ１１３、ＵＳＢコネクタ１１４等が搭載される領域であり、上記各コネクタの端面は、主基板２の外縁から所定量だけ突出する位置に実装されるように設計されている。 The main board 2 has a connector mounting portion 7. The connector mounting portion 7 is a region where the power connector 110, the microphone connector 111, the earphone connector 112, the LAN connector 113, the USB connector 114, and the like shown in FIG. 1 are mounted. It is designed to be mounted at a position protruding by a predetermined amount from the outer edge.
図３は、図２のコネクタ搭載部７における領域Ａの拡大図である。コネクタ搭載部７は、実際にコネクタが搭載される領域を示すコネクタ搭載領域７Ａ〜７Ｃを有する。このコネクタ搭載領域７Ａ〜７Ｃは、そのほとんどの領域が主基板２上にありあるものの、一部が溝部３を跨いで捨て板６Ａ上に及んでいる。これは、コネクタ搭載領域７Ａ〜７Ｃに搭載したコネクタの先端面が、図１の本体部１０１の側面に連なるように露出させるためである。尚、コネクタ搭載領域７Ａ〜７Ｃは製造製の観点からプリント配線板１上にシルク印刷等で表示しても良い。 FIG. 3 is an enlarged view of a region A in the connector mounting portion 7 of FIG. The connector mounting portion 7 has connector mounting areas 7A to 7C indicating areas where the connectors are actually mounted. Although most of the connector mounting regions 7A to 7C are on the main board 2, a part of the connector mounting regions 7A to 7C extends over the discard plate 6A across the groove 3. This is because the front end surface of the connector mounted in the connector mounting regions 7A to 7C is exposed so as to be continuous with the side surface of the main body 101 in FIG. The connector mounting areas 7A to 7C may be displayed on the printed wiring board 1 by silk printing or the like from the viewpoint of manufacturing.
溝部３には、各コネクタ搭載領域（７Ａ〜７Ｃ）の間に連結片４が設けられている。この連結片４の主基板２側には、捨て板６Ａと主基板２とを切断し易くするための小径の孔部であるミシン目７ａが設けられている。連結片４の捨て板６Ａ上の所定位置には、孔部８が設けられている。孔部８は、捨て板６Ａと主基板２とをルータ加工機等の加工ツール（図４参照）を用いて切断加工する際に、加工ツールの挿入孔として利用される。 In the groove portion 3, a connecting piece 4 is provided between the connector mounting regions (7A to 7C). A perforation 7a that is a small-diameter hole for facilitating cutting of the discard plate 6A and the main board 2 is provided on the main board 2 side of the connecting piece 4. A hole 8 is provided at a predetermined position on the discard plate 6 </ b> A of the connecting piece 4. The hole 8 is used as an insertion hole for a processing tool when the discard plate 6A and the main board 2 are cut using a processing tool (see FIG. 4) such as a router processing machine.
孔部８は、加工ツール（例えば、エンドミル）の直径よりやや大きい径を有し、その配置位置は、例えばプリント配線板１の板厚相当の距離を置いて溝部３の近傍に配置する。また、孔部８は、隣接するコネクタ等の部品と加工ツールとの干渉がなく、且つ、ミシン目の孔との間隙を最小限確保できる位置に設けることが好ましい。図３に示すように、孔部８の径は、連結片４の連結方向を軸とすると、この孔部８の径は少なくともその一部がこの軸に重複している位置に配置することが好ましい。このようにすることで、分割の際にスムーズに連結片４にたどり着くことが可能となる。 The hole 8 has a diameter slightly larger than the diameter of the processing tool (for example, end mill), and the arrangement position thereof is arranged in the vicinity of the groove 3 with a distance corresponding to the thickness of the printed wiring board 1, for example. Moreover, it is preferable to provide the hole 8 at a position where there is no interference between a component such as an adjacent connector and the processing tool, and a gap between the perforation hole can be secured to a minimum. As shown in FIG. 3, the diameter of the hole 8 can be arranged at a position where at least a part of the diameter of the hole 8 overlaps with the axis when the connecting direction of the connecting piece 4 is an axis. preferable. By doing in this way, it becomes possible to reach the connecting piece 4 smoothly during the division.
（プリント配線板の加工方法）
次にプリント配線板１の加工方法を説明する。図４はプリント配線板１の切削加工工程を示した図である。
(Processing method for printed wiring boards)
Next, a method for processing the printed wiring board 1 will be described. FIG. 4 is a diagram showing a cutting process of the printed wiring board 1.
図２のように孔あけ加工が済んだプリント配線板１の主基板２及び小基板５にハンダペーストを塗布した上で、実装機により部品を実装し、リフロー加熱処理をしてプリント回路基板にする。このとき、コネクタ搭載領域７Ａ〜７Ｃにはコネクタ９が搭載されているため、コネクタ搭載領域７Ａ〜７Ｃを横切る溝部３は、図４の（ａ）に示すように、搭載したコネクタ９によって覆われることとなる。 After applying the solder paste to the main board 2 and the small board 5 of the printed wiring board 1 as shown in FIG. 2, the components are mounted by a mounting machine and subjected to reflow heat treatment to form a printed circuit board. To do. At this time, since the connector 9 is mounted in the connector mounting areas 7A to 7C, the groove 3 crossing the connector mounting areas 7A to 7C is covered with the mounted connector 9 as shown in FIG. It will be.
次に、プリント配線板１の位置決め用孔部１０を位置決め用のピン等に固定し、更に、プリント配線板１を図示しない保持部材により保持する。この状態で、図４（ａ）に示すように、加工ツール（エンドミル）１１の先端を孔部８に挿入する。 Next, the positioning hole 10 of the printed wiring board 1 is fixed to a positioning pin or the like, and the printed wiring board 1 is further held by a holding member (not shown). In this state, the tip of the processing tool (end mill) 11 is inserted into the hole 8 as shown in FIG.
次に、ルータ加工機を稼働させ、加工ツール１１を回転させながら、加工ツール１１を溝部３の方向へ移動させ、図４（ｂ）に示すように、捨て板６Ａを溝状に切削して、溝部１２を形成する。 Next, the router processing machine is operated, the processing tool 11 is moved in the direction of the groove 3 while rotating the processing tool 11, and the discard plate 6A is cut into a groove shape as shown in FIG. 4B. The groove portion 12 is formed.
加工ツール１１が溝部３の中心部にまで到達すると、ルータ加工機は、加工ツール１１の移動方向を９０°変換し、溝部３の方向、即ち、隣接の連結片４の方向へ移動させ、連結片４を切断する。、図４（ｃ）に示すように、溝部１２及び溝部３が連通した状態になる。この切断方法を捨て板６Ａに存在する他の溝部３にも施すことにより、捨て板６Ａを主基板２からミシン目７ａに沿って分離することができる。 When the processing tool 11 reaches the center of the groove 3, the router processing machine converts the moving direction of the processing tool 11 by 90 ° and moves it in the direction of the groove 3, that is, the direction of the adjacent connecting piece 4. Cut the piece 4. As shown in FIG. 4C, the groove 12 and the groove 3 are in communication with each other. By applying this cutting method to the other groove portions 3 existing on the discard plate 6A, the discard plate 6A can be separated from the main substrate 2 along the perforations 7a.
更に、捨て板６Ｂ〜６Ｇ及び小基板５と主基板２との間の溝部３に介在している連結片４の全てを加工ツール１１によって切削し、捨て板６Ｂ〜６Ｇ及び小基板５を主基板２から分離する。 Further, all of the discarding plates 6B to 6G and the connecting piece 4 interposed in the groove 3 between the small substrate 5 and the main substrate 2 are cut by the processing tool 11, and the discarding plates 6B to 6G and the small substrate 5 are mainly used. Separate from the substrate 2.
以上示したような加工方法をとることで、コネクタ９が溝部３を跨いで加工ツール１１の加工を困難にしている場合でも、加工ツール１１が捨て板６Ａを切削しながら孔部８から溝部３へ移動することにより、連結片４を切削することができる。また、プリント配線板１の四隅の位置決め用孔部１０をピンや治具で位置決めして固定することにより、加工ツールによる連結片４の切削を正確に行うことができる。 By adopting the processing method as described above, even when the connector 9 straddles the groove 3 and makes it difficult to process the processing tool 11, the processing tool 11 cuts the discard plate 6A from the hole 8 to the groove 3. The connecting piece 4 can be cut by moving to. Further, by positioning and fixing the positioning holes 10 at the four corners of the printed wiring board 1 with pins or jigs, the connecting piece 4 can be accurately cut with the processing tool.
［第２の実施の形態］
（印刷回路基板の構成）
図５は、本発明の第２の実施の形態に係るプリント配線板を示した図である。図５では、部品の搭載位置を示す印刷の図示、及び孔部８の図示を省略している。
[Second Embodiment]
(Configuration of printed circuit board)
FIG. 5 is a view showing a printed wiring board according to the second embodiment of the present invention. In FIG. 5, the printing showing the component mounting position and the hole 8 are not shown.
第２の実施の形態のプリント配線板１５は、図２に示した第１の実施の形態のプリント配線板１において、捨て板６Ａ〜６Ｇのそれぞれに１つ以上の治具ピン用孔部１３を設けたものであり、その他の構成は第１の実施の形態と同様である。 The printed wiring board 15 of the second embodiment is similar to the printed wiring board 1 of the first embodiment shown in FIG. 2 in that one or more jig pin holes 13 are disposed in each of the discard plates 6A to 6G. The other configuration is the same as that of the first embodiment.
図６は、捨て板の１つとこれを支持する治具ピンの構成を示した図である。図６（ａ）は平面図、図６（ｂ）は図６（ａ）のＢ−Ｂ線の断面図である。ここでは、捨て板６Ｂについてのみ示している。図６（ａ）に示すように、捨て板６Ｂの治具ピン用孔部１３には、移動可能なテーブル２１に固定された治具ピン２０が捨て板６Ｂの状態維持用の部材として挿入されている。この様な構成は、他の捨て板６Ａ，６Ｃ〜６Ｇにおいても同様である。 FIG. 6 is a diagram showing a configuration of one of the discard plates and a jig pin that supports the discard plate. 6A is a plan view, and FIG. 6B is a cross-sectional view taken along line BB in FIG. 6A. Here, only the discard plate 6B is shown. As shown in FIG. 6A, the jig pin 20 fixed to the movable table 21 is inserted into the jig pin hole 13 of the discard plate 6B as a member for maintaining the state of the discard plate 6B. ing. Such a configuration is the same in the other discard plates 6A, 6C to 6G.
（印刷回路基板の加工方法）
次に、図５、図６を参照して、プリント配線板１５の加工方法を説明する。図５のように孔あけ加工が済んだプリント配線板１５に、ハンダペースを塗布した上で自動機等により部品を実装し、リフロー加熱処理をして、プリント回路板とする。
(Processing method for printed circuit boards)
Next, a method for processing the printed wiring board 15 will be described with reference to FIGS. As shown in FIG. 5, the printed wiring board 15 that has been punched is coated with a solder pace and then mounted with an automatic machine or the like, and is subjected to reflow heat treatment to obtain a printed circuit board.
次に、プリント配線板１５の四隅の位置決め用孔部１０を位置決め用のピン等に固定し、更に、テーブル２１をプリント配線板１５の下側に位置決めし、治具ピン２０を捨て板６Ａ〜６Ｇの治具ピン用孔部１３に挿入し、捨て板６Ａ〜６Ｇを支持する。この状態で、図４で説明した捨て板６Ａに対する加工を実施する他、各小基板５及び捨て板６Ａ〜６Ｇと主基板２との間の溝部３に介在している連結片４を加工ツール（エンドミル）によって切削し、主基板２から小基板５及び捨て板６Ａ，６Ｃ〜６Ｇのそれぞれを分離する。 Next, the positioning holes 10 at the four corners of the printed wiring board 15 are fixed to positioning pins and the like, and the table 21 is positioned below the printed wiring board 15, and the jig pins 20 are disposed of the discard plates 6 </ b> A to 6 </ b> A to 6 </ b> A. It is inserted into the 6G jig pin hole 13 to support the discard plates 6A to 6G. In this state, in addition to performing processing on the discard plate 6A described with reference to FIG. 4, the connection pieces 4 interposed in the grooves 3 between the small substrates 5 and the discard plates 6A to 6G and the main substrate 2 are processed. (End mill) is used to separate the small substrate 5 and the discard plates 6A, 6C to 6G from the main substrate 2.
次に、テーブル２１を下降させた後、テーブル２１を所定位置へ移動させ、捨て板６Ａ〜６Ｇを廃棄する。このとき、捨て板６Ａ〜６Ｇは、プリント配線板１５の下方に設置された収納容器等に落下し、収納される。 Next, after lowering the table 21, the table 21 is moved to a predetermined position, and the discard plates 6A to 6G are discarded. At this time, the discard plates 6 </ b> A to 6 </ b> G are dropped and stored in a storage container or the like installed below the printed wiring board 15.
以上に示したような加工方法をとることで、捨て板６Ａ〜６Ｇに治具ピン用孔部１３を設け、捨て板６Ａ〜６Ｇによって捨て板６Ａ〜６Ｇを支持しながら連結片４を切削除去するため、捨て板６Ａ〜６Ｇの落下や飛散を防止できる。また、捨て板６Ａ〜６Ｇと小基板５を選別する作業が不要になるので、加工時間を短縮することができる。 By adopting the processing method as described above, jig pin holes 13 are provided in the discard plates 6A to 6G, and the connecting pieces 4 are cut and removed while the discard plates 6A to 6G are supported by the discard plates 6A to 6G. Therefore, it is possible to prevent the discard plates 6A to 6G from dropping and scattering. Moreover, since the operation | work which sorts the discard plates 6A-6G and the small board | substrate 5 becomes unnecessary, processing time can be shortened.
更に、位置決め用孔１０をピンや治具で固定することにより、加工ツールによる連結片４の切削を正確に行うことができる。その他、第１の実施の形態で説明した効果も有する。 Furthermore, by fixing the positioning hole 10 with a pin or a jig, the connecting piece 4 can be accurately cut by the processing tool. In addition, the effects described in the first embodiment are also provided.
［他の実施の形態］
なお、本発明は、上記各実施の形態に限定されず、本発明の技術思想を逸脱あるいは変更しない範囲内で種々の変形が可能である。
[Other embodiments]
The present invention is not limited to the above embodiments, and various modifications can be made without departing from or changing the technical idea of the present invention.
例えば、プリント配線板１をノート型パソコン１００のマザーボードに適用した例を説明したが、これに限定されるものではなく、各種の電子機器、制御機器等において、複数の基板部分を溝及び連結片を介して部品搭載完了まで相互に接続した状態で取り扱われる印刷回路基板に広く適用することができる。 For example, the example in which the printed wiring board 1 is applied to the motherboard of the notebook personal computer 100 has been described. However, the present invention is not limited to this, and in various electronic devices, control devices, etc., a plurality of substrate portions are provided with grooves and connecting pieces. It can be widely applied to a printed circuit board that is handled in a state of being connected to each other until completion of component mounting.
１，１５ プリント配線板
２ 主基板
３ 溝部
４ 連結片
５ 小基板
６Ａ〜６Ｇ 捨て板
７ コネクタ搭載部
７Ａ〜７Ｃコネクタ搭載領域
８ 孔部
９ コネクタ
１０ 位置決め用孔部
１１ 加工ツール
１３ 治具ピン用孔部
DESCRIPTION OF SYMBOLS 1,15 Printed wiring board 2 Main board 3 Groove part 4 Connecting piece 5 Small board 6A-6G Discarding board 7 Connector mounting part 7A-7C Connector mounting area 8 Hole 9 Connector 10 Positioning hole 11 Processing tool 13 For jig pin Hole
Claims (6)
ことを特徴とするプリント配線板の加工方法。 A first board on which a component is mounted; a second board spaced apart from the first board ; and having an outer shape along at least a part of the first board; the first board and the second board; And at least one connecting piece that connects the first substrate and the second substrate, and a diameter that is provided on the second substrate and into which a processing tool can be inserted. against the printed wiring board having a hole, said the working tool and the second substrate prior SL by inserting to be processed moves and the connecting piece and the processing to the first substrate to the hole A method for processing a printed wiring board, comprising: dividing a second substrate.
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|---|---|---|---|
| JP2006161696A JP4745142B2 (en) | 2006-06-09 | 2006-06-09 | Processing method of printed wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006161696A JP4745142B2 (en) | 2006-06-09 | 2006-06-09 | Processing method of printed wiring board |
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| JP2007329438A JP2007329438A (en) | 2007-12-20 |
| JP4745142B2 true JP4745142B2 (en) | 2011-08-10 |
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| JP2006161696A Active JP4745142B2 (en) | 2006-06-09 | 2006-06-09 | Processing method of printed wiring board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54180263U (en) * | 1978-06-09 | 1979-12-20 | ||
| JPH0372690A (en) * | 1989-08-11 | 1991-03-27 | Koike Seisakusho:Kk | Method and apparatus for dividing circuit board |
| JPH10135622A (en) * | 1996-10-25 | 1998-05-22 | Alps Electric Co Ltd | Manufacture of high frequency apparatus |
| JPH11145568A (en) * | 1997-10-30 | 1999-05-28 | Internatl Business Mach Corp <Ibm> | Circuit board |
-
2006
- 2006-06-09 JP JP2006161696A patent/JP4745142B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54180263U (en) * | 1978-06-09 | 1979-12-20 | ||
| JPH0372690A (en) * | 1989-08-11 | 1991-03-27 | Koike Seisakusho:Kk | Method and apparatus for dividing circuit board |
| JPH10135622A (en) * | 1996-10-25 | 1998-05-22 | Alps Electric Co Ltd | Manufacture of high frequency apparatus |
| JPH11145568A (en) * | 1997-10-30 | 1999-05-28 | Internatl Business Mach Corp <Ibm> | Circuit board |
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|---|---|
| JP2007329438A (en) | 2007-12-20 |
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