GB969483A - Improvements in or relating to semiconductor assemblies and methods of forming such assemblies - Google Patents
Improvements in or relating to semiconductor assemblies and methods of forming such assembliesInfo
- Publication number
- GB969483A GB969483A GB33608/60A GB3360860A GB969483A GB 969483 A GB969483 A GB 969483A GB 33608/60 A GB33608/60 A GB 33608/60A GB 3360860 A GB3360860 A GB 3360860A GB 969483 A GB969483 A GB 969483A
- Authority
- GB
- United Kingdom
- Prior art keywords
- envelope
- foil
- plate
- assemblies
- relating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000000429 assembly Methods 0.000 title 2
- 230000000712 assembly Effects 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000011888 foil Substances 0.000 abstract 4
- 230000037431 insertion Effects 0.000 abstract 2
- 238000003780 insertion Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DET17280A DE1302062B (de) | 1959-09-30 | 1959-09-30 | Verfahren zum Herstellen eines guten Waermeuebergangs von einem Halbleiterbauelement zur Innenwand seines Gehaeuses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB969483A true GB969483A (en) | 1964-09-09 |
Family
ID=7548540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB33608/60A Expired GB969483A (en) | 1959-09-30 | 1960-09-30 | Improvements in or relating to semiconductor assemblies and methods of forming such assemblies |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3256469A (en:Method) |
| DE (1) | DE1302062B (en:Method) |
| FR (1) | FR1268801A (en:Method) |
| GB (1) | GB969483A (en:Method) |
| NL (1) | NL256369A (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3409808A (en) * | 1965-03-12 | 1968-11-05 | Int Rectifier Corp | High voltage diode for low pressure applications |
| US3427510A (en) * | 1965-08-12 | 1969-02-11 | Siemens Ag | Semiconductor with encapsulating housing |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2829422A (en) * | 1952-05-21 | 1958-04-08 | Bell Telephone Labor Inc | Methods of fabricating semiconductor signal translating devices |
| US2931958A (en) * | 1954-05-03 | 1960-04-05 | Nat Res Dev | Semi-conductor devices |
| DE1042762B (de) * | 1955-02-26 | 1958-11-06 | Siemens Ag | Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht |
| US2830238A (en) * | 1955-09-30 | 1958-04-08 | Hughes Aircraft Co | Heat dissipating semiconductor device |
| US2889498A (en) * | 1955-11-08 | 1959-06-02 | Westinghouse Electric Corp | Semiconductor rectifier assembly |
| US2842831A (en) * | 1956-08-30 | 1958-07-15 | Bell Telephone Labor Inc | Manufacture of semiconductor devices |
| US2955242A (en) * | 1956-11-27 | 1960-10-04 | Raytheon Co | Hermetically sealed power transistors |
| BE566430A (en:Method) * | 1957-04-05 | |||
| US3036249A (en) * | 1957-08-05 | 1962-05-22 | Fansteel Metallurgical Corp | Capacitor |
| US2903629A (en) * | 1958-10-23 | 1959-09-08 | Advanced Res Associates Inc | Encapsulated semiconductor assembly |
| US2937324A (en) * | 1959-02-05 | 1960-05-17 | Westinghouse Electric Corp | Silicon carbide rectifier |
| US3142886A (en) * | 1959-08-07 | 1964-08-04 | Texas Instruments Inc | Method of making glass encased electrolytic capacitor assembly and article resultingtherefrom |
| DE1784807C3 (de) * | 1968-09-20 | 1974-04-04 | Strabag Bau-Ag, 5000 Koeln | Stoßverbindung der Längsbewehrungsstäbe von vorgefertigten Bauwerksteilen aus Beton |
-
0
- NL NL256369D patent/NL256369A/xx unknown
-
1959
- 1959-09-30 DE DET17280A patent/DE1302062B/de active Pending
-
1960
- 1960-09-29 FR FR839624A patent/FR1268801A/fr not_active Expired
- 1960-09-29 US US59441A patent/US3256469A/en not_active Expired - Lifetime
- 1960-09-30 GB GB33608/60A patent/GB969483A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL256369A (en:Method) | 1900-01-01 |
| US3256469A (en) | 1966-06-14 |
| FR1268801A (fr) | 1961-08-04 |
| DE1302062B (de) | 1969-11-13 |
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