GB961686A - Improvements in or relating to methods of alloying material to semiconductor bodies - Google Patents

Improvements in or relating to methods of alloying material to semiconductor bodies

Info

Publication number
GB961686A
GB961686A GB32333/61A GB3233361A GB961686A GB 961686 A GB961686 A GB 961686A GB 32333/61 A GB32333/61 A GB 32333/61A GB 3233361 A GB3233361 A GB 3233361A GB 961686 A GB961686 A GB 961686A
Authority
GB
United Kingdom
Prior art keywords
jig
semi
alloying
conductor
sept
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB32333/61A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB961686A publication Critical patent/GB961686A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Die Bonding (AREA)
  • Package Frames And Binding Bands (AREA)
GB32333/61A 1960-09-13 1961-09-08 Improvements in or relating to methods of alloying material to semiconductor bodies Expired GB961686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL255865 1960-09-13

Publications (1)

Publication Number Publication Date
GB961686A true GB961686A (en) 1964-06-24

Family

ID=19752566

Family Applications (1)

Application Number Title Priority Date Filing Date
GB32333/61A Expired GB961686A (en) 1960-09-13 1961-09-08 Improvements in or relating to methods of alloying material to semiconductor bodies

Country Status (6)

Country Link
US (1) US3164499A (enExample)
CH (1) CH396217A (enExample)
DE (1) DE1142969B (enExample)
ES (1) ES270397A1 (enExample)
GB (1) GB961686A (enExample)
NL (1) NL255865A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69312411T2 (de) * 1992-09-15 1997-11-27 Texas Instruments Inc Ballkontaktierung für Flip-Chip-Anordnungen
US5567648A (en) * 1994-08-29 1996-10-22 Motorola, Inc. Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE529730A (enExample) * 1953-06-19
NL106130C (enExample) * 1954-06-29
US2825667A (en) * 1955-05-10 1958-03-04 Rca Corp Methods of making surface alloyed semiconductor devices
BE554048A (enExample) * 1957-01-09 1957-01-31
US3003798A (en) * 1957-05-20 1961-10-10 Jersey Prod Res Co Anchoring reinforcing cables or braids in well packers
US2964431A (en) * 1959-07-28 1960-12-13 Rca Corp Jig alloying of semiconductor devices

Also Published As

Publication number Publication date
NL255865A (enExample) 1900-01-01
DE1142969B (de) 1963-01-31
US3164499A (en) 1965-01-05
CH396217A (de) 1965-07-31
ES270397A1 (es) 1961-11-16

Similar Documents

Publication Publication Date Title
US2735050A (en) Liquid soldering process and articles
US3046651A (en) Soldering technique
GB961686A (en) Improvements in or relating to methods of alloying material to semiconductor bodies
GB908751A (en) Attaching bodies to support members by the use of solder and brazing alloy
GB1038469A (en) Improvements in or relating to joints between electrically conducting bodies
US2823148A (en) Method for removing portions of semiconductor device electrodes
US3066248A (en) Semiconductor device
GB928894A (en) Improvements in or relating to methods of manufacturing semi-conductor devices
GB851978A (en) Improvements in or relating to processes for the production of electrodes on semi-conductor bodies
GB1017101A (en) Improvements in or relating to methods of manufacturing transistors
US3055099A (en) Method of contacting semi-conductor devices
GB907734A (en) Method of soldering silicon or silicon alloy
US3132419A (en) Method for soldering silicon or a silicon alloy to a diefferent metal
GB1168358A (en) A Process for the Production of a Semiconductor Unit
GB864239A (en) A process for providing a semi-conductor body with a metal electrode
GB966019A (en) Improvements in or relating to composite piece-parts for use in apparatus manufacture
JPS6453427A (en) Bonding process
GB906938A (en) Improvements in and relating to methods of alloying to semiconductor bodies
GB965696A (en) Improvements in or relating to semiconductor devices
GB894871A (en) Improvements in or relating to methods of alloying substances onto semi-conductor material
GB966320A (en) Improvements in or relating to methods of manufacturing semi-conductor devices
GB959608A (en) A process for use in the production of semi-conductor arrangements
ES271622A1 (es) Un metodo de fabricar un dispositivo semiconductor
GB925042A (en) A method of producing gold-silicon alloy contacts
US3134699A (en) Method of manufacturing semiconductor devices