NL255865A - - Google Patents

Info

Publication number
NL255865A
NL255865A NL255865DA NL255865A NL 255865 A NL255865 A NL 255865A NL 255865D A NL255865D A NL 255865DA NL 255865 A NL255865 A NL 255865A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL255865A publication Critical patent/NL255865A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50Alloying conductive materials with semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/012Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
NL255865D 1960-09-13 NL255865A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL255865 1960-09-13

Publications (1)

Publication Number Publication Date
NL255865A true NL255865A (enExample) 1900-01-01

Family

ID=19752566

Family Applications (1)

Application Number Title Priority Date Filing Date
NL255865D NL255865A (enExample) 1960-09-13

Country Status (6)

Country Link
US (1) US3164499A (enExample)
CH (1) CH396217A (enExample)
DE (1) DE1142969B (enExample)
ES (1) ES270397A1 (enExample)
GB (1) GB961686A (enExample)
NL (1) NL255865A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69312411T2 (de) * 1992-09-15 1997-11-27 Texas Instruments Inc Ballkontaktierung für Flip-Chip-Anordnungen
US5567648A (en) * 1994-08-29 1996-10-22 Motorola, Inc. Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE529730A (enExample) * 1953-06-19
NL106130C (enExample) * 1954-06-29
US2825667A (en) * 1955-05-10 1958-03-04 Rca Corp Methods of making surface alloyed semiconductor devices
BE554048A (enExample) * 1957-01-09 1957-01-31
US3003798A (en) * 1957-05-20 1961-10-10 Jersey Prod Res Co Anchoring reinforcing cables or braids in well packers
US2964431A (en) * 1959-07-28 1960-12-13 Rca Corp Jig alloying of semiconductor devices

Also Published As

Publication number Publication date
DE1142969B (de) 1963-01-31
US3164499A (en) 1965-01-05
GB961686A (en) 1964-06-24
CH396217A (de) 1965-07-31
ES270397A1 (es) 1961-11-16

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