GB845111A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB845111A
GB845111A GB3356756A GB3356756A GB845111A GB 845111 A GB845111 A GB 845111A GB 3356756 A GB3356756 A GB 3356756A GB 3356756 A GB3356756 A GB 3356756A GB 845111 A GB845111 A GB 845111A
Authority
GB
United Kingdom
Prior art keywords
indium
bead
electrode
piston
germanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3356756A
Inventor
Peter John Burgess
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB3356756A priority Critical patent/GB845111A/en
Priority to FR1185670D priority patent/FR1185670A/en
Priority to DEG23267A priority patent/DE1067529B/en
Publication of GB845111A publication Critical patent/GB845111A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

845,111. Welding by pressure. GENERAL ELECTRIC CO. Ltd. Oct. 31, 1957 [Nov. 2, 1956], No. 33567/56. Class 83 (4). [Also in Group XXXVI] In making a semi-conductor device of the junction type an electrode is attached to the junction element by sliding the surface of the electrode relatively to the surface of the element, one of which surfaces is of indium or like soft metal, to provide a clean surface on the indium &c. and pressing the electrode and element together to effect bonding. In an embodiment the rectifying element is formed by evaporating &c. a layer of gold on a slice of single crystal N-type germanium, placing indium thereupon and heating to produce a P-N junction and form a bead consisting mainly of indium. The other surface of the germanium is soldered to a copper block electrode during the heating. A further copper block electrode to be attached to the bead is coated with indium on which a flat surface is formed by slicing or turning and a flat surface is similarly formed on the bead. One or both of the indium surfaces may be convex. One of the blocks 2 is held in a collet 1 fixed in the base of a tube 3 and the other block 6 is held in piston 5 slidable in the tube and carrying projections 12 which engage ball bearings on the ends of a cross member 9 on a shaft 8 rotatable by a drive 11. With the two indium surfaces in contact the piston is rotated to slide the surfaces relatively and the weight of the piston, e.g. 3 pounds for 0.5 square inch diameter indium surfaces, provides the axial force. The indium bead on the germanium element may be replaced by indium-gallium alloy and the further copper block need not be provided with an indium coating but may be cleaned and directly bonded. According to the Provisional Specification the parts may be mounted in a lathe for pressing and sliding, and a silicon element having a bead of tin may be employed. Specifications 806,596 and 845,112 are referred to.
GB3356756A 1956-11-02 1956-11-02 Improvements in or relating to semiconductor devices Expired GB845111A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB3356756A GB845111A (en) 1956-11-02 1956-11-02 Improvements in or relating to semiconductor devices
FR1185670D FR1185670A (en) 1956-11-02 1957-10-31 Semiconductor refinements
DEG23267A DE1067529B (en) 1956-11-02 1957-11-01 A method of manufacturing a surface type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3356756A GB845111A (en) 1956-11-02 1956-11-02 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB845111A true GB845111A (en) 1960-08-17

Family

ID=10354605

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3356756A Expired GB845111A (en) 1956-11-02 1956-11-02 Improvements in or relating to semiconductor devices

Country Status (3)

Country Link
DE (1) DE1067529B (en)
FR (1) FR1185670A (en)
GB (1) GB845111A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1294559B (en) * 1960-02-25 1969-05-08 Western Electric Co Method for connecting a surface of a semiconductor body to a metal surface to be attached thereto

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL281483A (en) * 1961-10-31 1900-01-01
DE1254774B (en) * 1964-02-18 1967-11-23 Itt Ind Ges Mit Beschraenkter Method for producing a solder-free contact on a semiconductor component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1294559B (en) * 1960-02-25 1969-05-08 Western Electric Co Method for connecting a surface of a semiconductor body to a metal surface to be attached thereto

Also Published As

Publication number Publication date
FR1185670A (en) 1959-08-04
DE1067529B (en) 1959-10-22

Similar Documents

Publication Publication Date Title
JPS5365089A (en) Semiconductor pressure transducer
GB820621A (en) Improvements in or relating to semi-conductive devices
GB967263A (en) A process for use in the production of a semi-conductor device
JPS5762539A (en) Mounting method for semiconductor element
GB845111A (en) Improvements in or relating to semiconductor devices
GB845112A (en) Improvements in or relating to bonded assemblies
JPS54142976A (en) Manufacture of semiconductor device
JPS553815B1 (en)
JPS52155494A (en) Process for w orking parallel plane of wafer
JPS5660025A (en) Bonding method for semiconductor element
JPS5624941A (en) Manufacture of semiconductor device
JPS52115181A (en) Sealing method for semiconductor devices
GB864121A (en) Improvements in or relating to semi-conductor devices
GB1017423A (en) Improvements in semiconductor devices
FR2452786A1 (en) Power semiconductor heat sink soldering system - with thin layer preventing adherence of solder applied to semiconductor perimeter
JPS5471562A (en) Semiconductor element
JPS5471984A (en) Bonding method of leads
GB787591A (en) Improvements in or relating to the manufacture of semi-conductor devices
GB821551A (en) Improvements in or relating to methods of soldering
JPS5585037A (en) Bonding method
JPS57120352A (en) Semiconductor device
JPS547868A (en) Manufacture for beam lead type semiconductor device
JPS55163851A (en) Adhesion of semiconductor device
JPS54152967A (en) Manufacture of semiconductor device
JPS5336180A (en) Production of semiconductor device