GB841864A - Improvements in and relating to the production of articles comprising a conductive metal pattern on an insulating support - Google Patents

Improvements in and relating to the production of articles comprising a conductive metal pattern on an insulating support

Info

Publication number
GB841864A
GB841864A GB1597955A GB1597955A GB841864A GB 841864 A GB841864 A GB 841864A GB 1597955 A GB1597955 A GB 1597955A GB 1597955 A GB1597955 A GB 1597955A GB 841864 A GB841864 A GB 841864A
Authority
GB
United Kingdom
Prior art keywords
pattern
solder
june
metal
metal pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1597955A
Inventor
Robert Atcheson Lynn
Ronald Arthur Simmons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Priority to GB1597955A priority Critical patent/GB841864A/en
Publication of GB841864A publication Critical patent/GB841864A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

841,864. Coating with metals. PHILIPS ELECTRICAL INDUSTRIES Ltd. June 1, 1956 [June 3, 1955; June 30, 1955], Nos. 15979/55 and 18937/55. Class 82(2) [Also in Groups XXII and XXXVI] In the production of a printed circuit comprising a conductive metal pattern on an insulating support, a thin layer of solder or other suitable fusible metal or metallic alloy is provided over the metal pattern before components are secured to the pattern by a dip soldering process. Preferably the layer consists of tin-lead solder in eutectic proportions. The printed circuit comprising a copper pattern 8 upon an insulating plate, is fluxed using an alcoholic solution of colophony resin and is then passed between rollers 3, 4, the lower one of which dips into a heated solder bath. The rollers rotate continuously and the lower roller carries off a thin film of solder which it transfers to the pattern 8. Doctors 12, 13 are provided to reduce any tendency for impurities to be transferred to the pattern 8, while surface oxidation in the bath may be reduced by providing a film of resin or oil on the molten solder surface. The ensuing dip-soldering process may be carried out in a bath supplied with ultrasonic energy; this enables the dip soldering to be effected without the use of flux. The pattern 8 may be produced by any convenient process such as etching of metalclad laminate stock, electroplating, dusting with metal or transfer of the metal pattern from a preliminary support.
GB1597955A 1955-06-03 1955-06-03 Improvements in and relating to the production of articles comprising a conductive metal pattern on an insulating support Expired GB841864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1597955A GB841864A (en) 1955-06-03 1955-06-03 Improvements in and relating to the production of articles comprising a conductive metal pattern on an insulating support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1597955A GB841864A (en) 1955-06-03 1955-06-03 Improvements in and relating to the production of articles comprising a conductive metal pattern on an insulating support

Publications (1)

Publication Number Publication Date
GB841864A true GB841864A (en) 1960-07-20

Family

ID=10069039

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1597955A Expired GB841864A (en) 1955-06-03 1955-06-03 Improvements in and relating to the production of articles comprising a conductive metal pattern on an insulating support

Country Status (1)

Country Link
GB (1) GB841864A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2623358A1 (en) * 1987-11-17 1989-05-19 Commissariat Energie Atomique PRINTING CIRCUIT PLATING DEVICE

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2623358A1 (en) * 1987-11-17 1989-05-19 Commissariat Energie Atomique PRINTING CIRCUIT PLATING DEVICE
EP0317422A1 (en) * 1987-11-17 1989-05-24 Commissariat A L'energie Atomique Individual tinning device for printed-circuit boards

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