GB836138A - Improvements in and relating to dip-soldering - Google Patents

Improvements in and relating to dip-soldering

Info

Publication number
GB836138A
GB836138A GB630457A GB630457A GB836138A GB 836138 A GB836138 A GB 836138A GB 630457 A GB630457 A GB 630457A GB 630457 A GB630457 A GB 630457A GB 836138 A GB836138 A GB 836138A
Authority
GB
United Kingdom
Prior art keywords
aperture
circuit
soldering
dip
tinned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB630457A
Inventor
Donald Howard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kelvin Hughes Ltd
Original Assignee
Kelvin Hughes Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kelvin Hughes Ltd filed Critical Kelvin Hughes Ltd
Priority to GB630457A priority Critical patent/GB836138A/en
Publication of GB836138A publication Critical patent/GB836138A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

In a method of dip-soldering a printed circuit, those portions of the metallic surface of the circuit which are not to be tinned are treated chemically so as to provide thereon a film of a compound of the metal, the compound being resistant to tinning, and molten solder is then applied to the circuit to tin the portions of the metallic surface not protected by the film. Specifically disclosed is the making of a soldered connection between an aperture in the copper pattern of a printed circuit and a lead wire passing through the aperture, in which a mask having a fluxing action is applied over the portion of the copper surface which is to be tinned (i.e. around the aperture), the remainder of the circuit is oxidized by dipping into cold potassium polysulphide solution, the lead wire is passed through the aperture, and the connection made by fluxing and dip-soldering.
GB630457A 1957-02-25 1957-02-25 Improvements in and relating to dip-soldering Expired GB836138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB630457A GB836138A (en) 1957-02-25 1957-02-25 Improvements in and relating to dip-soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB630457A GB836138A (en) 1957-02-25 1957-02-25 Improvements in and relating to dip-soldering

Publications (1)

Publication Number Publication Date
GB836138A true GB836138A (en) 1960-06-01

Family

ID=9812062

Family Applications (1)

Application Number Title Priority Date Filing Date
GB630457A Expired GB836138A (en) 1957-02-25 1957-02-25 Improvements in and relating to dip-soldering

Country Status (1)

Country Link
GB (1) GB836138A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
CN105569383A (en) * 2015-12-22 2016-05-11 浙江工业大学义乌科学技术研究院有限公司 Revolving stage realizing reliable motor and wire connection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
CN105569383A (en) * 2015-12-22 2016-05-11 浙江工业大学义乌科学技术研究院有限公司 Revolving stage realizing reliable motor and wire connection
CN105569383B (en) * 2015-12-22 2018-04-27 浙江工业大学义乌科学技术研究院有限公司 Motor wire connects reliable revolving stage

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