JPH01104796A - Formation of multicomponent alloy coating film - Google Patents
Formation of multicomponent alloy coating filmInfo
- Publication number
- JPH01104796A JPH01104796A JP26227887A JP26227887A JPH01104796A JP H01104796 A JPH01104796 A JP H01104796A JP 26227887 A JP26227887 A JP 26227887A JP 26227887 A JP26227887 A JP 26227887A JP H01104796 A JPH01104796 A JP H01104796A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- alloy
- layers
- layer
- formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 29
- 239000000956 alloy Substances 0.000 title claims abstract description 29
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 238000000576 coating method Methods 0.000 title claims abstract description 12
- 230000015572 biosynthetic process Effects 0.000 title description 8
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 150000002739 metals Chemical class 0.000 claims abstract description 6
- 239000011247 coating layer Substances 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 abstract description 27
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 150000003839 salts Chemical class 0.000 abstract description 3
- 229910052718 tin Inorganic materials 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- -1 or 6 Generally Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910017985 Cu—Zr Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント基板、ＩＣのり−
）′フレーム、その池、金属被膜を形成すべき被加工物
の表面を、３種以上の金属から成る合金被膜によって被
覆する新規方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is directed to a printed circuit board, an IC glue frame, its pond, and the surface of a workpiece on which a metal film is to be formed using an alloy consisting of three or more metals. The present invention relates to a new method of coating with a film.
従来技術
例えば、ＩＣチップのパッケージに際しては、ＩＣチッ
プとリードフレームの結合や、完成品の実装時のハンダ
付性の為に、リードフレームの表面に、金、銀、或は、
・・へ′ンダメフキなどが施される６一般に、ハイブリ
ッドＩＣ用のリードフレームは、製造コストを押さえる
必要上から、ハンダ合金（Ｓ ｎ：Ｐ ｂ−９０：１０
−６０：４０）メッキが施されるのが主流である。ＩＣ
の高＋！！能、低価格化への要請がら、リードフレーム
のハンダメッキ面にも、近年、高度なハンダ濡れ性が要
求されているが、従来のハンダメッキ法では、例えば、
ＭＬＩ加”湿試験法によるエーシングテスト（ＭＬＩ−
５ＴＤ−２０２Ｈのハンダ付性試験法、２０８℃のエー
ジング４１１（ｌ、ハンダ付条件としてノン７ラツクス
（アルコール洗浄のみ）で、ハンダ温度２１０℃±５℃
という条件）をクリアすることはＶＡ難である。これに
対して、ハンダに他の金属を加えて、ハンダ濡れ性や電
気抵抗等を改良することが考えられるが、実用に耐える
三元以上の多元合金層を電気メッキによって対象物の表
面に形成する方法は未だ知られていないのが現状である
。Prior Art For example, when packaging an IC chip, the surface of the lead frame is coated with gold, silver, or
6 Generally, lead frames for hybrid ICs are made of solder alloy (S n:P b-90:10) due to the need to reduce manufacturing costs.
-60:40) Plating is the mainstream. IC
High+! ! In recent years, the solder-plated surface of lead frames has been required to have a high level of solder wettability due to the demand for higher performance and lower costs.
Acing test by MLI humidification test method (MLI-
5TD-202H solderability test method, aging 411 (l) at 208℃, soldering conditions: non-7lux (alcohol cleaning only), soldering temperature 210℃±5℃
It is difficult for VA to clear the following conditions. On the other hand, it is possible to improve solder wettability and electrical resistance by adding other metals to the solder, but it is possible to form a practical multi-component alloy layer of ternary or higher on the surface of the object by electroplating. At present, there is no known method to do so.
発、明の目的
本発明は、電気メッキによっては、形成できなかった三
元合金或はそれ以上の多元合金の平滑な被膜を、金属被
膜の形成を必要とする被加工物（例えば、前記リードフ
レームなど）の表面に形成する新規方法を開示すること
を目的とするものである。OBJECTS OF THE INVENTION The present invention provides a smooth coating of a ternary alloy or a multi-component alloy, which cannot be formed by electroplating, on a workpiece that requires the formation of a metal coating (for example, the above-mentioned lead). The purpose of this paper is to disclose a new method for forming the film on the surface of a frame (such as a frame).
発明の構成
本発明の要旨は、金属被膜を形４成すべき被加工物の表
面に、電気メッキ処理を繰り返して施すことによって、
異なった複数の金属被膜層を層状に形成したのち、加熱
溶融処理に付すことにより、前記複数の金属被膜層を、
三元以上の多元合金から成る単一層の合金被膜とするこ
とを特徴とする多元合金被膜の形成方法にある。Structure of the Invention The gist of the present invention is to repeatedly perform electroplating on the surface of a workpiece on which a metal film is to be formed.
After forming a plurality of different metal coating layers in a layered form, the plurality of metal coating layers are heated and melted to form a layer.
A method for forming a multi-component alloy film, characterized in that the film is a single-layer alloy film made of ternary or more multi-component alloys.
上記において、金属被膜を形成すべきＮ象物の素材は、
必ずしもすべてが電導体であることを必要とせず、ただ
、後工程における加熱溶融処理に耐えられる耐熱性と、
電気メッキのカソードとして少なくとも、その表面に無
電解メッキ、溶融メッキ、金属蒸着、その他、適宜な手
段によって、電導層が存在することの二つの条件が充た
されていればよい。In the above, the material of the N object on which the metal coating is to be formed is:
It does not necessarily have to be a conductor, but it must have enough heat resistance to withstand the heat melting process in the post-process.
As a cathode for electroplating, it is sufficient that at least two conditions are satisfied: a conductive layer is present on the surface by electroless plating, hot-dip plating, metal vapor deposition, or other appropriate means.
このような対象物をカソードとして、銅、錫、亜鉛等の
単一金属塩のメッキ浴や、Ｃｕ−Ｚｒ＋、Ｓｎ−’Ｐｂ
などの合金メッキ浴を用いて、対象物の表面に、順次、
金属被ＨｔＡＷＩを層状に形成する。メッキ処理は、従
来の方法と全く同じであって、例えば、メッキ被膜を形
成すべき対象物の素材が鉄板であれば、前処理として、
下地の研摩処理、トリクレンなどの有機溶剤、或は、稀
硫酸などの酸を用いた脱脂処理等を行い、ついで、目的
とする金属塩と必要に応じて加えられる導電ｊｉ４ＷＩ
剤、ＰＨ調節剤、その他の添加剤を含むメッキ浴中で、
対象物表面に、第一のメッキ被膜を形成する。この上う
にして得られた第一のメッキ被膜上に、同様に、メッキ
処理によって異なる金属から成る第二のメッキ被膜を形
成する。順次、これを繰り返すことにより、対象物表面
には、種類の異なる金属被膜層が層状に重なって形成さ
れる。各金属被膜の厚さは、目的とする単一合金被膜に
おいて要求される組成に応じて定められる。このように
して得られた複数のメッキ層が層設された被加工物を加
熱溶融処理に付すことにより、複数のメッキ層を溶融し
て単一の今ｆ層にしたのち、冷却すれば、被加工物表面
には、所望の組成の単一合金層が形成される。Using such an object as a cathode, plating baths of single metal salts such as copper, tin, and zinc, Cu-Zr+, Sn-'Pb
Using an alloy plating bath such as
The metallized HtAWI is formed in a layered manner. The plating process is exactly the same as the conventional method. For example, if the material on which the plating film is to be formed is an iron plate, as a pretreatment,
After polishing the base and degreasing using an organic solvent such as trichloride or an acid such as dilute sulfuric acid, the desired metal salt and conductive ji4WI are added as necessary.
In a plating bath containing agents, PH regulators, and other additives,
A first plating film is formed on the surface of the object. On the first plating film thus obtained, a second plating film made of a different metal is similarly formed by plating. By sequentially repeating this process, metal coating layers of different types are formed in layers on the surface of the object. The thickness of each metal coating is determined depending on the desired composition of the intended single alloy coating. By subjecting the thus obtained workpiece on which a plurality of plating layers are layered to a heating melting process, the plurality of plating layers are melted into a single layer, and then cooled. A single alloy layer of desired composition is formed on the surface of the workpiece.
加熱溶融の温度、処理時間、加熱媒体などは、層設され
たメッキ層を構成する金属の物性や、メッキ層の厚さに
よって異なる。The heating and melting temperature, processing time, heating medium, etc. vary depending on the physical properties of the metal forming the plated layer and the thickness of the plated layer.
例えば、メッキ層の厚さが、検数ミクロンのオーダーな
らば、加熱時間は、その融点付近において数秒間で十分
である。加熱媒体としては、油浴、空気或はＮ２ｆｆス
などの熱雰囲気などが用いられる。For example, if the thickness of the plating layer is on the order of microns, heating time of several seconds near the melting point is sufficient. As the heating medium, a thermal atmosphere such as an oil bath, air, or N2ff gas is used.
以下に、ＩＣ用リードフレームの表面処理の場合につい
て、本発明を適用した実施例を掲げる。Examples in which the present invention is applied in the case of surface treatment of IC lead frames are listed below.
［実施例］
ａ、銅下地層の形成
凹い鉄製帯状体からプレス加工によって打ち抜かれたリ
ードフレームは、常法に基ずいて、脱脂処理されたのち
、シアン化銅メッキ浴・・・（ＣｕＣＮ６０［ｇ／え］
、Ｆｒｅｅ ＣＭ ７，５、Ｎａ２Ｃｏｓ３０．ＫＯＩ
１１５、Ｐ１１１２．５、温度６０℃、電流密度２［Ａ
／ｄｍ２］）−中でメッキ処理し、リードフレーム表面
に厚さ約３μの下地被膜を形成した。[Example] a. Formation of copper base layer A lead frame punched out by press working from a concave iron strip was degreased using a conventional method, and then treated with a copper cyanide plating bath (CuCN60). [g/e]
, Free CM 7,5, Na2Cos30. K.O.I.
115, P1112.5, temperature 60°C, current density 2 [A
/dm2]) to form a base film with a thickness of about 3 μm on the lead frame surface.
ｂ、ハンダメッキ層の形成
上記ａ工程で得られた銅下地層をカソードとし、Ｓ ｎ
−Ｐ ｂ（８０：２０）のハンダ板を７ノードとして
、鉛−錫合金メッキ浴・・・［アルカノールスルフォン
酸Ｓｎ（金属錫として８ｇ／ ｊＬアルカノールスルフ
ォン酸ｐｂ（金属鉛として２ｇ／ １．７ルカノールス
ル７オン
び適量の尤訳剤］・・・中でメッキ処理して、１５μの
ハング合金層を銅下地層の一ヒに形成した。b. Formation of solder plating layer The copper base layer obtained in step a above is used as a cathode, and S n
- P b (80:20) solder plate as 7 nodes, lead-tin alloy plating bath...[Sn alkanolsulfonate (8 g/jL as metal tin) pb alkanol sulfonate (2 g/1.7 as metal lead) A 15μ thick hang alloy layer was formed on one of the copper underlayers by plating in a lukanorol solution and an appropriate amount of a compensator.
Ｃ０銀メッキ層の形成
上記すの工程で得られた、ハング合金層によって被覆さ
れたリードフレームを、銀メンキ浴・・・（八ｇＣＮ
３６［ｇ／玉］、ＫＣＮ６０、Ｋ２ＣＯ３１５、）・・
・中で、２０℃、電流密度０．５［八／ｄＩ１１２１の
条件でメッキ処理し、ハング合金層の外面に更に、０．
５μの銀メッキ層を形成した。Formation of C0 Silver Plating Layer The lead frame covered with the hang alloy layer obtained in the above step was heated in a silver coating bath (8gCN
36 [g/ball], KCN60, K2CO315,)...
・Plating was performed inside at 20°C and a current density of 0.5[8/dI1121, and the outer surface of the hang alloy layer was further coated with 0.
A 5 μm silver plating layer was formed.
ｄ、上記工程Ｃで得られたリードフレームを、約２１０
℃に保ったエチレングリコール浴中に約２秒問浸漬処理
することにより、リードフレーム表面には、金属光沢を
備えたＳｎ −Ｐｂ −八Ｈ（８０：１４：６重量％）
の組成の合金被膜が形成された。d. The lead frame obtained in the above step C is about 210
By immersing the lead frame in an ethylene glycol bath kept at ℃ for about 2 seconds, the surface of the lead frame is coated with Sn-Pb-8H (80:14:6% by weight) with metallic luster.
An alloy film with a composition of was formed.
［参考例１
上記実施例の方法で得られたリードフレームからサンプ
リングされた４０片を実装後、ニーソングテスト・・・
［旧Ｌ−５ＴＤ−２０２Ｅのハング付性試験法、２０８
℃のニーノングチスト４１１後、ハング付条件としてメ
ン７ラツクス（アルコール洗浄のみ）でハング温炉度２
１０℃±５°Ｃ浸漬時間３秒で試験］・・・に付したと
ころ、４０片すべてにおいて、その表面が９５％以上合
金層によって被覆されており、１００％の合格率を示し
た。[Reference Example 1] After mounting 40 pieces sampled from the lead frame obtained by the method of the above example, a knee song test...
[Former L-5TD-202E hangability test method, 208
After heating at 411 degrees Celsius, the hang temperature was set to 7 lux (alcohol cleaning only) and the temperature was 2.
When subjected to the test at 10°C±5°C for 3 seconds in immersion time, all 40 pieces showed a pass rate of 100%, with 95% or more of the surface covered by the alloy layer.
一方、従来のハングメッキ処理（Ｓｎ −Ｐｂ：９Ｏ−
１０）のリードフレームでは、合格率は２０％であった
。On the other hand, the conventional hang plating process (Sn-Pb:9O-
For the lead frame 10), the pass rate was 20%.
効果
上記実施例からも明らかなように、本願方法を、ハング
合金を主成分とし銀、金、銅等の金属を従成分とする合
金層の形成に適用すると、２１０℃前後といった低温の
溶融処理によって、三元以上の合／ｋＪＶＩが形成され
る。これらの合金層は、メッキ厚を変えることにより、
その組成、厚さを自由に且つ精密に調節することができ
、それによって例えばハングメッキであればｐｂ分を多
くして軸受部表面の加工に、或は、リードフレームなら
ば、コネクターとの接触抵抗の改善等に利用できる。又
、上記実施例において、溶融処理条件を変えれば、下地
層として用いられた銅メッキ層も、合金層にとりこんで
四元合金層とすることも可能となる。Effects As is clear from the above examples, when the method of the present invention is applied to the formation of an alloy layer containing a hang alloy as a main component and metals such as silver, gold, copper, etc. as a subsidiary component, it is possible to melt at a low temperature of around 210°C. , a ternary or higher combination /kJVI is formed. By changing the plating thickness of these alloy layers,
Its composition and thickness can be adjusted freely and precisely.For example, if it is hang plating, the PB content can be increased to process the bearing surface, or if it is a lead frame, it can be used for contact with the connector. It can be used to improve resistance, etc. Furthermore, in the above embodiments, by changing the melting treatment conditions, the copper plating layer used as the base layer can also be incorporated into the alloy layer to form a quaternary alloy layer.
これにより、合金被膜層とリードフレームなどの下地と
の密着性が向上する。尚、上記は、ハング合金層の形成
を中心に説明したが、本願方法は、これに限定されるも
のでなく、池の融点の高い多元合金被膜の形成にも適用
できることは、すでに明白である。This improves the adhesion between the alloy coating layer and the base such as the lead frame. Although the above description has focused on the formation of a hang alloy layer, it is already clear that the method of the present application is not limited thereto, and can also be applied to the formation of a multi-component alloy film having a high melting point. .
特許出願人 信光工業株式会社Patent applicant: Shinko Kogyo Co., Ltd.
Claims (1)
処理を繰り返し施すことにより、異なる複数の金属被膜
層を層設したのち、加熱溶融処理をすることにより、前
記複数の金属被膜層を、三種以上の異種金属から成る単
一層の合金被膜とすることを特徴とする、被加工物表面
への多元合金被膜の形成方法。By repeatedly applying electroplating to the surface of the workpiece on which a metal coating is to be formed, a plurality of different metal coating layers are formed, and then by heating and melting the plurality of metal coating layers, A method for forming a multi-component alloy coating on the surface of a workpiece, the method comprising forming a single layer alloy coating consisting of three or more different metals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26227887A JPH01104796A (en) | 1987-10-16 | 1987-10-16 | Formation of multicomponent alloy coating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26227887A JPH01104796A (en) | 1987-10-16 | 1987-10-16 | Formation of multicomponent alloy coating film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104796A true JPH01104796A (en) | 1989-04-21 |
Family
ID=17373570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26227887A Pending JPH01104796A (en) | 1987-10-16 | 1987-10-16 | Formation of multicomponent alloy coating film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104796A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555404A (en) * | 1991-08-26 | 1993-03-05 | Hitachi Cable Ltd | Printed wiring board for mounting semiconductor devices |
| US6669996B2 (en) | 2000-07-06 | 2003-12-30 | University Of Louisville | Method of synthesizing metal doped diamond-like carbon films |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS502866A (en) * | 1973-05-10 | 1975-01-13 | ||
| JPS5489940A (en) * | 1977-12-27 | 1979-07-17 | Tokyo Rope Mfg Co | Brass plated steel wire having food drawability |
-
1987
- 1987-10-16 JP JP26227887A patent/JPH01104796A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS502866A (en) * | 1973-05-10 | 1975-01-13 | ||
| JPS5489940A (en) * | 1977-12-27 | 1979-07-17 | Tokyo Rope Mfg Co | Brass plated steel wire having food drawability |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555404A (en) * | 1991-08-26 | 1993-03-05 | Hitachi Cable Ltd | Printed wiring board for mounting semiconductor devices |
| US6669996B2 (en) | 2000-07-06 | 2003-12-30 | University Of Louisville | Method of synthesizing metal doped diamond-like carbon films |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20070026832A (en) | Tin-based plating film and method for forming the same | |
| JP2925986B2 (en) | Fixed contact material or electrical contact parts consisting of a contact part and a terminal part | |
| JPH06196349A (en) | Copper lead frame material for tantalum capacitor and manufacture thereof | |
| JPH11222659A (en) | Process for producing metal composite strip | |
| JP2006283149A (en) | Surface treatment method for copper or copper alloy, surface-treated material, and electronic component using the same | |
| JPH01104796A (en) | Formation of multicomponent alloy coating film | |
| JP2005105307A (en) | REFLOW-Sn-PLATED MEMBER, METHOD FOR MANUFACTURING THE MEMBER, AND COMPONENT FOR ELECTRICAL AND ELECTRONIC EQUIPMENT USING THE MEMBER | |
| JP4888992B2 (en) | Method for producing surface-treated Al plate | |
| JP3378717B2 (en) | Method for manufacturing reflow plated member | |
| JP2002069688A (en) | Tin alloy plated material for terminal and connector | |
| JPH02145794A (en) | Copper or copper alloy material plated with tin or solder reflowed and excellent in thermal peeling resistance | |
| JP2647656B2 (en) | Method of manufacturing contacts | |
| JP4014739B2 (en) | Reflow Sn plating material and terminal, connector, or lead member using the reflow Sn plating material | |
| JP2647657B2 (en) | Method of manufacturing contacts | |
| JPS61133395A (en) | Plated stainless steel bar and its manufacture | |
| JPH0467726B2 (en) | ||
| JPS6220895A (en) | Method for plating cu or cu alloy substrate with sn or sn alloy | |
| JPS58108761A (en) | Electronic component part | |
| JP2005060809A (en) | SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, ITS PRODUCTION METHOD AND HEAT SINK USING THE SAME | |
| JP3021602B2 (en) | Method for producing reflow tin alloy plated material for electronic equipment parts with excellent heat-peelability | |
| JPS6325078B2 (en) | ||
| JPH08508788A (en) | Method for producing silver-plated aluminum conductor, apparatus for carrying out this method, and conductor obtained thereby | |
| JPS6013095A (en) | Material for electronic parts and its manufacture | |
| JPS6342393A (en) | Method for tin or tin alloy plating copper or copper alloy wire | |
| JPH02101190A (en) | Production of solder plated copper and copper alloy material |