GB809641A - Improved methods of treating semiconductor bodies - Google Patents

Improved methods of treating semiconductor bodies

Info

Publication number
GB809641A
GB809641A GB7810/56A GB781056A GB809641A GB 809641 A GB809641 A GB 809641A GB 7810/56 A GB7810/56 A GB 7810/56A GB 781056 A GB781056 A GB 781056A GB 809641 A GB809641 A GB 809641A
Authority
GB
United Kingdom
Prior art keywords
impurity
semi
conductor
treated
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7810/56A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB809641A publication Critical patent/GB809641A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60—Impurity distributions or concentrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S252/00—Compositions
    • Y10S252/95—Doping agent source material
    • Y10S252/951—Doping agent source material for vapor transport

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Junction Field-Effect Transistors (AREA)
GB7810/56A 1955-03-23 1956-03-13 Improved methods of treating semiconductor bodies Expired GB809641A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US496202A US3028655A (en) 1955-03-23 1955-03-23 Semiconductive device
US496201A US2868678A (en) 1955-03-23 1955-03-23 Method of forming large area pn junctions
US109934A US3202887A (en) 1955-03-23 1961-05-15 Mesa-transistor with impurity concentration in the base decreasing toward collector junction

Publications (1)

Publication Number Publication Date
GB809641A true GB809641A (en) 1959-02-25

Family

ID=27380743

Family Applications (2)

Application Number Title Priority Date Filing Date
GB7810/56A Expired GB809641A (en) 1955-03-23 1956-03-13 Improved methods of treating semiconductor bodies
GB7811/56A Expired GB809642A (en) 1955-03-23 1956-03-13 Improvements in semiconductor devices and methods of making them

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB7811/56A Expired GB809642A (en) 1955-03-23 1956-03-13 Improvements in semiconductor devices and methods of making them

Country Status (7)

Country Link
US (3) US2868678A (cg-RX-API-DMAC7.html)
BE (1) BE546222A (cg-RX-API-DMAC7.html)
CH (2) CH345077A (cg-RX-API-DMAC7.html)
DE (1) DE1056747C2 (cg-RX-API-DMAC7.html)
FR (1) FR1147153A (cg-RX-API-DMAC7.html)
GB (2) GB809641A (cg-RX-API-DMAC7.html)
NL (2) NL107344C (cg-RX-API-DMAC7.html)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2950220A (en) * 1956-03-13 1960-08-23 Battelle Development Corp Preparation of p-n junctions by the decomposition of compounds
US2954308A (en) * 1956-05-21 1960-09-27 Ibm Semiconductor impurity diffusion
DE1170555B (de) * 1956-07-23 1964-05-21 Siemens Ag Verfahren zum Herstellen eines Halbleiter-bauelements mit drei Zonen abwechselnd entgegengesetzten Leitungstyps
US3145328A (en) * 1957-04-29 1964-08-18 Raytheon Co Methods of preventing channel formation on semiconductive bodies
NL237225A (cg-RX-API-DMAC7.html) * 1958-03-19
US2974072A (en) * 1958-06-27 1961-03-07 Ibm Semiconductor connection fabrication
US3025192A (en) * 1959-01-02 1962-03-13 Norton Co Silicon carbide crystals and processes and furnaces for making them
NL246971A (cg-RX-API-DMAC7.html) * 1959-01-02 1900-01-01
DE1208012C2 (de) * 1959-08-06 1966-10-20 Telefunken Patent Flaechentransistor fuer hohe Frequenzen mit einer Begrenzung der Emission des Emitters und Verfahren zum Herstellen
GB930533A (en) * 1959-09-11 1963-07-03 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3242394A (en) * 1960-05-02 1966-03-22 Texas Instruments Inc Voltage variable resistor
NL269345A (cg-RX-API-DMAC7.html) * 1960-09-19
DE1414898A1 (de) * 1960-11-09 1969-01-09 Lucas Industries Ltd Verfahren zur Herstellung von Halbleitern
US3116184A (en) * 1960-12-16 1963-12-31 Bell Telephone Labor Inc Etching of germanium surfaces prior to evaporation of aluminum
US3166448A (en) * 1961-04-07 1965-01-19 Clevite Corp Method for producing rib transistor
NL276751A (cg-RX-API-DMAC7.html) * 1961-04-10
DE1166379B (de) * 1961-05-12 1964-03-26 Raytheon Co Hochfrequenztransistor und Verfahren zu seinem Herstellen
US3287611A (en) * 1961-08-17 1966-11-22 Gen Motors Corp Controlled conducting region geometry in semiconductor devices
US3180755A (en) * 1962-02-05 1965-04-27 Gen Motors Corp Method of diffusing boron into silicon wafers
US3175975A (en) * 1962-04-19 1965-03-30 Bell Telephone Labor Inc Heat treatment of iii-v compound semiconductors
US3239393A (en) * 1962-12-31 1966-03-08 Ibm Method for producing semiconductor articles
US3249831A (en) * 1963-01-04 1966-05-03 Westinghouse Electric Corp Semiconductor controlled rectifiers with a p-n junction having a shallow impurity concentration gradient
US3165430A (en) * 1963-01-21 1965-01-12 Siliconix Inc Method of ultra-fine semiconductor manufacture
US3274462A (en) * 1963-11-13 1966-09-20 Jr Keats A Pullen Structural configuration for fieldeffect and junction transistors
US3283218A (en) * 1964-04-03 1966-11-01 Philco Corp High frequency diode having semiconductive mesa
US3337780A (en) * 1964-05-21 1967-08-22 Bell & Howell Co Resistance oriented semiconductor strain gage with barrier isolated element
DE1439480B2 (de) * 1964-12-01 1976-07-08 Siemens AG, 1000 Berlin und 8000 München Transistor und verfahren zu seiner herstellung
DE1564608B2 (de) * 1966-05-23 1976-11-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen eines transistors
US3473980A (en) * 1966-10-11 1969-10-21 Bell Telephone Labor Inc Significant impurity sources for solid state diffusion
US3852128A (en) * 1969-02-22 1974-12-03 Licentia Gmbh Method of diffusing impurities into semiconductor wafers
US3650854A (en) * 1970-08-03 1972-03-21 Ibm Method of fabricating a transistor having improved emitter-base junction breakdown voltage characteristics
US4111719A (en) * 1976-12-06 1978-09-05 International Business Machines Corporation Minimization of misfit dislocations in silicon by double implantation of arsenic and germanium
FR2471668A1 (fr) * 1979-12-14 1981-06-19 Silicium Semiconducteur Ssc Procede de diffusion de phosphore dans un semi-conducteur et procede d'obtention de phosphure de silicium

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2362545A (en) * 1942-01-29 1944-11-14 Bell Telephone Labor Inc Selenium rectifier and method of making it
US2731366A (en) * 1948-12-28 1956-01-17 Libbey Owens Ford Glass Co Method of vapor depositing coatings of aluminum
DE883784C (de) * 1949-04-06 1953-06-03 Sueddeutsche App Fabrik G M B Verfahren zur Herstellung von Flaechengleichrichtern und Kristallverstaerkerschichten aus Elementen
US2666814A (en) * 1949-04-27 1954-01-19 Bell Telephone Labor Inc Semiconductor translating device
US2629672A (en) * 1949-07-07 1953-02-24 Bell Telephone Labor Inc Method of making semiconductive translating devices
DE840148C (de) * 1949-09-11 1952-05-29 Edgar Duemig Furnieraderhobel
US2561411A (en) * 1950-03-08 1951-07-24 Bell Telephone Labor Inc Semiconductor signal translating device
US2697269A (en) * 1950-07-24 1954-12-21 Bell Telephone Labor Inc Method of making semiconductor translating devices
BE509317A (cg-RX-API-DMAC7.html) * 1951-03-07 1900-01-01
GB728244A (en) * 1951-10-19 1955-04-13 Gen Electric Improvements in and relating to germanium photocells
BE510303A (cg-RX-API-DMAC7.html) * 1951-11-16
US2736849A (en) * 1951-12-31 1956-02-28 Hazeltine Research Inc Junction-type transistors
US2695852A (en) * 1952-02-15 1954-11-30 Bell Telephone Labor Inc Fabrication of semiconductors for signal translating devices
US2793145A (en) * 1952-06-13 1957-05-21 Sylvania Electric Prod Method of forming a junction transistor
NL178893B (nl) * 1952-11-14 Brevitex Ets Exploit Bandweefgetouw met een inslagnaald voor verschillende inslagdraden.
US2705767A (en) * 1952-11-18 1955-04-05 Gen Electric P-n junction transistor
US2784121A (en) * 1952-11-20 1957-03-05 Bell Telephone Labor Inc Method of fabricating semiconductor bodies for translating devices
NL183430C (nl) * 1952-12-16 Ventron Corp Werkwijze voor de bereiding van een vast concentraat op basis van een thermoplastische hars en een poedervormig microbiocide, werkwijze voor de bereiding van een vast thermoplastisch mengsel onder toepassing van een dergelijk concentraat, alsmede daardoor verkregen gevormde thermoplastische mengsels.
US2840494A (en) * 1952-12-31 1958-06-24 Henry W Parker Manufacture of transistors
FR1098372A (fr) * 1953-05-22 1955-07-25 Rca Corp Dispositifs semi-conducteurs
US2811653A (en) * 1953-05-22 1957-10-29 Rca Corp Semiconductor devices
US2821493A (en) * 1954-03-18 1958-01-28 Hughes Aircraft Co Fused junction transistors with regrown base regions
US2736847A (en) * 1954-05-10 1956-02-28 Hughes Aircraft Co Fused-junction silicon diodes

Also Published As

Publication number Publication date
CH356538A (de) 1961-08-31
NL107344C (cg-RX-API-DMAC7.html)
DE1056747B (de) 1959-05-06
US3028655A (en) 1962-04-10
CH345077A (fr) 1960-03-15
NL204025A (cg-RX-API-DMAC7.html)
BE546222A (cg-RX-API-DMAC7.html)
GB809642A (en) 1959-02-25
FR1147153A (fr) 1957-11-20
US2868678A (en) 1959-01-13
DE1056747C2 (de) 1959-10-15
US3202887A (en) 1965-08-24

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