GB802053A - Improvements in or relating to the deposition of nickel on dielectric surfaces - Google Patents

Improvements in or relating to the deposition of nickel on dielectric surfaces

Info

Publication number
GB802053A
GB802053A GB1631156A GB1631156A GB802053A GB 802053 A GB802053 A GB 802053A GB 1631156 A GB1631156 A GB 1631156A GB 1631156 A GB1631156 A GB 1631156A GB 802053 A GB802053 A GB 802053A
Authority
GB
United Kingdom
Prior art keywords
nickel
dielectric
deposition
silver
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1631156A
Inventor
David Saul Margolis
Tzu En Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BRITISH DIELECTRIC RES Ltd
Original Assignee
BRITISH DIELECTRIC RES Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BRITISH DIELECTRIC RES Ltd filed Critical BRITISH DIELECTRIC RES Ltd
Priority to GB1631156A priority Critical patent/GB802053A/en
Publication of GB802053A publication Critical patent/GB802053A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A method of applying a coating of nickel containing nickel phosphide to a surface of a dielectric material comprises first sensitizing the surface by depositing thereon by vacuum evaporation a thin layer of a metal, and then chemical depositing on the sensitized surface a coating of nickel/nickel phosphide from a hot bath containing an aqueous solution of a nickel salt and a hypo-phosphite, the vacuum evaporated metal being one which serves as a catalyst in the chemical deposition process. Aluminium, copper, silver, iron and nickel are suitable catalysts: in the case of copper or silver, it may be necessary to touch the sensitized surface with e.g. an iron rod to initiate the deposition. The vacuum evaporation may be preceded by a surface cleaning as by ionic or electronic bombardment under vacuum. Specifically disclosed are the production of (i) electrodes on ceramic-type capacitors, (ii) electrodes on P.T.F.E. foil dielectric capacitors, and (iii) printed circuits; in the production of these articles, the dielectric surface may be appropriately masked during the sensitizing stage.
GB1631156A 1956-05-25 1956-05-25 Improvements in or relating to the deposition of nickel on dielectric surfaces Expired GB802053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1631156A GB802053A (en) 1956-05-25 1956-05-25 Improvements in or relating to the deposition of nickel on dielectric surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1631156A GB802053A (en) 1956-05-25 1956-05-25 Improvements in or relating to the deposition of nickel on dielectric surfaces

Publications (1)

Publication Number Publication Date
GB802053A true GB802053A (en) 1958-09-24

Family

ID=10075017

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1631156A Expired GB802053A (en) 1956-05-25 1956-05-25 Improvements in or relating to the deposition of nickel on dielectric surfaces

Country Status (1)

Country Link
GB (1) GB802053A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3207127A (en) * 1962-05-31 1965-09-21 Xerox Corp Apparatus for forming coatings on printed circuit boards
DE1239766B (en) * 1962-07-12 1967-05-03 Telefunken Patent Method for applying a firmly adhering nickel layer to a glossy carbon resistance layer applied to a ceramic carrier
CN102747345A (en) * 2012-07-19 2012-10-24 哈尔滨工业大学 Method for chemically plating nickel on surface of copper circuit of PCB (printed circuit board) by dipping and activating nickel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3207127A (en) * 1962-05-31 1965-09-21 Xerox Corp Apparatus for forming coatings on printed circuit boards
DE1239766B (en) * 1962-07-12 1967-05-03 Telefunken Patent Method for applying a firmly adhering nickel layer to a glossy carbon resistance layer applied to a ceramic carrier
CN102747345A (en) * 2012-07-19 2012-10-24 哈尔滨工业大学 Method for chemically plating nickel on surface of copper circuit of PCB (printed circuit board) by dipping and activating nickel

Similar Documents

Publication Publication Date Title
ES250419A1 (en) Method of making a capacitor employing film-forming metal electrode
GB1247706A (en) Process for forming a conductive layer upon an insulating substrate
US2639997A (en) Metallization of nonmetallic surfaces
GB832874A (en) Improvements in the coating of fluorinated polymers
US3210214A (en) Electrical conductive patterns
GB802053A (en) Improvements in or relating to the deposition of nickel on dielectric surfaces
GB1326046A (en) Method of making a patterned metal film
GB724379A (en) A method for making a predetermined metallic pattern on an insulating base
ES420944A1 (en) Sputtered metal oxide coatings articles comprising transparent electrically-conductive coatings on non-conducting substrates
US3409466A (en) Process for electrolessly plating lead on copper
US2981611A (en) Manufacture of printed electrical circuits or components
GB1065077A (en) Methods of plating insulating surfaces
JPH02125873A (en) Bonding deposition of silver film, silver film and electrically-conductive, reflective or decorative film constituted thereof
GB1241574A (en) A method of plating conductive metals on film-forming materials
GB874965A (en) Improvements in or relating to electrical circuits or circuit elements
GB892451A (en) Improvements in and relating to the manufacture of printed circuits
ES298472A1 (en) Procedure and apparatus for depositing electrolytically a superficial layer on metal articles (Machine-translation by Google Translate, not legally binding)
SU123380A1 (en) Teflon Metallization Method
GB810818A (en) Improvements in or relating to processes for electrolytically coating metals with a platinum layer
GB876858A (en) Improvements in or relating to the manufacture of printed circuits
ES311950A1 (en) A process of treatment of a metal sheet used as electrode in an electrolytic condenser. (Machine-translation by Google Translate, not legally binding)
JPS53103198A (en) Preparing thick film dielectric layer and thick film dielectic layer paste
JPS55113897A (en) Production of boiling heat transfer surface
GB1474307A (en) Process and liquid for sensitizing articles for electroless metallization and resulting articles
GB835091A (en) Improved method of manufacture of capacitors